SCHEMBL6436617

SCHEMBL6436617

c1ccc(N(CC2CO2)CC2CO2)c(CC2CO2)c1

nearest known ligand 0.38

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.38
LMNA P02545 2/20 0.37
TDP1 Q9NUW8 1/20 0.34
USP2 O75604 1/20 0.33
ALDH1A1 P00352 3/20 0.32
POLB P06746 1/20 0.32
L3MBTL1 Q9Y468 1/20 0.32
GLA P06280 1/20 0.32
CTSB P07858 1/20 0.30
DHFR P00374 1/20 0.30
TP53 P04637 1/20 0.30
CYP3A4 P08684 1/20 0.30
TSHR P16473 1/20 0.30
SMN1; SMN2 Q16637 1/20 0.30
HIF1A Q16665 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31544651 1.00 KDM4E (0.38) KDM4ELMNATDP1USP2ALDH1A1
SCHEMBL11265919 0.88 KDM4E (0.33) KDM4ELMNAALDH1A1POLBL3MBTL1
SCHEMBL625141 0.87 KDM4E (0.38) KDM4ELMNATDP1USP2ALDH1A1
SCHEMBL29703193 0.87 KDM4E (0.38) KDM4ELMNATDP1USP2ALDH1A1
SCHEMBL8928199 0.85 KDM4E (0.35) KDM4ELMNAALDH1A1TP53CYP3A4
SCHEMBL30015922 0.85 LMNA (0.43) KDM4ELMNATDP1USP2ALDH1A1
SCHEMBL6230504 0.85 LMNA (0.43) KDM4ELMNATDP1USP2ALDH1A1
SCHEMBL11115495 0.84 CTSB (0.42) KDM4ELMNATDP1USP2ALDH1A1
SCHEMBL10413043 0.84 KDM4E (0.37) KDM4ELMNATDP1USP2ALDH1A1
SCHEMBL1661638 0.83 KDM4E (0.36) KDM4ELMNATDP1USP2ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1389631-B1 Epoxy resin compositions SHINETSU CHEMICAL CO (JP) 2005-10-19 EP claimed
US-6353082-B1 REACTING EPOXIDE GROUPS OF MULTI-FUNCTIONAL DI- OR HIGHER EPOXIDE GROUP CONTAINING COMPOUND REACTANT WITH ACID CHLORIDE GROUPS OF MULTI-FUNCTIONAL DI- OR HIGHER ACID CHLORIDE GROUP CONTAINING COMPOUND REACTANT TO FORM ESTER PRODUCTS EASTMAN KODAK COMPANY 2002-03-05 US claimed
US-9548252-B2 Reworkable epoxy resin and curative blend for low thermal expansion applications RAYTHEON COMPANY (US) 2017-01-17 US disclosed
EP-3071623-A1 REWORKABLE EPOXY RESIN AND CURATIVE BLEND FOR LOW THERMAL EXPANSION APPLICATIONS Raytheon Company (US) 2016-09-28 EP disclosed
WO-2015076912-A1 REWORKABLE EPOXY RESIN AND CURATIVE BLEND FOR LOW THERMAL EXPANSION APPLICATIONS RAYTHEON COMPANY (US) 2015-05-28 WO disclosed
US-20150137362-A1 REWORKABLE EPOXY RESIN AND CURATIVE BLEND FOR LOW THERMAL EXPANSION APPLICATIONS RAYTHEON COMPANY 2015-05-21 US disclosed
US-6353082-B1 REACTING EPOXIDE GROUPS OF MULTI-FUNCTIONAL DI- OR HIGHER EPOXIDE GROUP CONTAINING COMPOUND REACTANT WITH ACID CHLORIDE GROUPS OF MULTI-FUNCTIONAL DI- OR HIGHER ACID CHLORIDE GROUP CONTAINING COMPOUND REACTANT TO FORM ESTER PRODUCTS EASTMAN KODAK COMPANY 2002-03-05 US disclosed