Trifluoromethanesulfonic Acid

Trifluoromethanesulfonic Acid

SCHEMBL645454

C[S+](C)c1cccc2ccccc12.O=S(=O)([O-])C(F)(F)F

nearest known ligand 0.40

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Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
GPR3 P46089 2/20 0.40
KEAP1 Q14145 1/20 0.37
CA1 P00915 1/20 0.36
CA2 P00918 1/20 0.36
CA9 Q16790 1/20 0.36
KCNH2 Q12809 6/20 0.35
ACHE P22303 5/20 0.35
HTR6 P50406 1/20 0.34
NLRP3 Q96P20 1/20 0.34
CYP1A2 P05177 1/20 0.33
HSD17B2 P37059 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Trifluoromethanesulfonic Acid SCHEMBL31168285 1.00 GPR3 (0.40) GPR3KEAP1CA1CA2CA9
Trifluoromethanesulfonic Acid SCHEMBL1077274 0.87 CYP1A2 (0.37) KEAP1CA1CA2CA9NLRP3
Trifluoromethanesulfonic Acid SCHEMBL66197 0.87 GPR3 (0.42) GPR3KEAP1CA1CA2CA9
Trifluoromethanesulfonic Acid SCHEMBL31235599 0.87 GPR3 (0.42) GPR3KEAP1CA1CA2CA9
Trifluoromethanesulfonic Acid SCHEMBL3837247 0.86 GPR3 (0.37) GPR3KCNH2ACHE
SCHEMBL3114236 0.86 CA1 (0.32) KEAP1CA1CA2CA9HTR6
SCHEMBL3114542 0.84 CA1 (0.33) KEAP1CA1CA2CA9
Trifluoromethanesulfonic Acid SCHEMBL646691 0.83 KCNH2 (0.39) GPR3KEAP1CA1CA2CA9
Trifluoromethanesulfonic Acid SCHEMBL31168264 0.83 KCNH2 (0.39) GPR3KEAP1CA1CA2CA9
Trifluoromethanesulfonic Acid SCHEMBL6566341 0.83 GPR3 (0.37) GPR3KEAP1CA1CA2CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 110 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2021106537-A1 RESIST UNDERLAYER FILM-FORMING COMPOSITION, PATTERN FORMING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD 富士フイルム株式会社 2021-06-03 WO disclosed
CN-110850680-A Curable composition, display element, and method for forming cured film JSR株式会社 2020-02-28 CN disclosed
US-9170492-B2 Silicon-containing film-forming composition, silicon-containing film, and pattern forming method JSR CORPORATION (JP) 2015-10-27 US disclosed
US-9140985-B2 2015-09-22 US disclosed
US-9134611-B2 Composition for forming resist underlayer film and pattern-forming method JSR CORPORATION (JP) 2015-09-15 US disclosed
US-9126231-B2 Insulation pattern-forming method and insulation pattern-forming material JSR CORPORATION (JP) 2015-09-08 US disclosed
US-8722306-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2014-05-13 US disclosed
US-8691496-B2 Method for forming resist under layer film, pattern forming method and composition for resist under layer film JSR CORPORATION (JP) 2014-04-08 US disclosed
US-8663905-B2 Pattern-forming method JSR CORPORATION (JP) 2014-03-04 US disclosed
US-20140048512-A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM AND PATTERN-FORMING METHOD JSR CORPORATION (JP) 2014-02-20 US disclosed
EP-1142928-A1 Polysiloxane, method of manufacturing same, silicon-containing alicyclic compound, and radiation-sensitive resin compounds JSR Corporation (JP) 2001-10-10 EP disclosed
US-20010014427-A1 Radiation sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 2001-08-16 US disclosed
US-6242161-B1 ABSORPTION COATINGS USING COPOLYMERS JSR CORPORATION (JP) 2001-06-05 US disclosed
EP-1085379-A1 Radiation-sensitive resin composition JSR Corporation (JP) 2001-03-21 EP disclosed
US-6187504-B1 PHOTOSENSITIVE BLEND CONTAINING A NAPHTHALENE SULFONIUM SULFONATE DERIVATIVE PHOTOACID GENERATOR, RESIN HAVING ALKALI INSOLUBLE GROUPS CLEAVABLE BY ACID, AN ALKALI SOLUBLE RESIN AND A SOLUBILITY CONTROL AGENT; POSITIVES, RESOLUTION JSR CORPORATION (JP) 2001-02-13 US disclosed
US-6180316-B1 SUITABLE FOR USE AS CHEMICALLY AMPLIFIED RESIST USED IN MANUFACTURING OF INTEGRATED CIRCUITS JSR CORPORATION (JP) 2001-01-30 US disclosed
EP-1048983-A1 Radiation sensitive resin composition JSR Corporation (JP) 2000-11-02 EP disclosed
EP-1045290-A2 Composition for resist underlayer film and method for producing the same JSR Corporation (JP) 2000-10-18 EP disclosed
EP-0930541-A1 Radiation sensitive resin composition JSR Corporation (JP) 1999-07-21 EP disclosed
EP-0849634-A1 Radiation sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1998-06-24 EP disclosed