Trifluoromethanesulfonic Acid

Trifluoromethanesulfonic Acid

SCHEMBL646691

CC[S+](CC)c1cccc2ccccc12.O=S(=O)([O-])C(F)(F)F

nearest known ligand 0.42

Full drug profile on Sugi Atlas →

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
KCNH2 Q12809 7/20 0.39
GPR3 P46089 2/20 0.37
ACHE P22303 5/20 0.36
KEAP1 Q14145 1/20 0.34
NQO2 P16083 1/20 0.33
ELANE P08246 1/20 0.33
CA1 P00915 1/20 0.33
CA2 P00918 1/20 0.33
CA9 Q16790 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Trifluoromethanesulfonic Acid SCHEMBL31168264 1.00 KCNH2 (0.39) KCNH2GPR3ACHEKEAP1NQO2
Trifluoromethanesulfonic Acid SCHEMBL6564917 0.89 KCNH2 (0.40) KCNH2GPR3ACHEKEAP1NQO2
SCHEMBL3107022 0.87 ABCC9 (0.30) KEAP1CA1CA2
Trifluoromethanesulfonic Acid SCHEMBL112169 0.86 KCNH2 (0.44) KCNH2GPR3ACHE
SCHEMBL3114349 0.86 CA1 (0.32) CA1CA2
Trifluoromethanesulfonic Acid SCHEMBL645454 0.83 GPR3 (0.40) KCNH2GPR3ACHEKEAP1CA1
Trifluoromethanesulfonic Acid SCHEMBL31168285 0.83 GPR3 (0.40) KCNH2GPR3ACHEKEAP1CA1
Trifluoromethanesulfonic Acid SCHEMBL31235599 0.83 GPR3 (0.42) KCNH2GPR3ACHEKEAP1CA1
Trifluoromethanesulfonic Acid SCHEMBL66197 0.83 GPR3 (0.42) KCNH2GPR3ACHEKEAP1CA1
SCHEMBL700284 0.82 CYP2A6 (0.43) KEAP1ELANE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 105 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120077771-A Curable composition for organic EL element, cured product for organic EL element, method for producing cured product for organic EL element, and polymer JSR株式会社 2025-05-30 CN disclosed
WO-2024101411-A1 CURABLE COMPOSITION FOR ORGANIC EL ELEMENTS, CURED PRODUCT FOR ORGANIC EL ELEMENTS AND METHOD FOR PRODUCING SAME, ORGANIC EL ELEMENT, AND POLYMER JSR株式会社 2024-05-16 WO disclosed
WO-2021106537-A1 RESIST UNDERLAYER FILM-FORMING COMPOSITION, PATTERN FORMING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD 富士フイルム株式会社 2021-06-03 WO disclosed
CN-110850680-A Curable composition, display element, and method for forming cured film JSR株式会社 2020-02-28 CN disclosed
US-9170492-B2 Silicon-containing film-forming composition, silicon-containing film, and pattern forming method JSR CORPORATION (JP) 2015-10-27 US disclosed
US-9140985-B2 2015-09-22 US disclosed
US-9134611-B2 Composition for forming resist underlayer film and pattern-forming method JSR CORPORATION (JP) 2015-09-15 US disclosed
US-9126231-B2 Insulation pattern-forming method and insulation pattern-forming material JSR CORPORATION (JP) 2015-09-08 US disclosed
US-8722306-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2014-05-13 US disclosed
US-8691496-B2 Method for forming resist under layer film, pattern forming method and composition for resist under layer film JSR CORPORATION (JP) 2014-04-08 US disclosed
US-20010041769-A1 Polysiloxane, method of manufacturing same, silicon-containingalicyclic compouns, and radiation-sensitive resin composition JSR CORPORATION (JP) 2001-11-15 US disclosed
EP-1142928-A1 Polysiloxane, method of manufacturing same, silicon-containing alicyclic compound, and radiation-sensitive resin compounds JSR Corporation (JP) 2001-10-10 EP disclosed
US-20010014427-A1 Radiation sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 2001-08-16 US disclosed
EP-1085379-A1 Radiation-sensitive resin composition JSR Corporation (JP) 2001-03-21 EP disclosed
US-6187504-B1 PHOTOSENSITIVE BLEND CONTAINING A NAPHTHALENE SULFONIUM SULFONATE DERIVATIVE PHOTOACID GENERATOR, RESIN HAVING ALKALI INSOLUBLE GROUPS CLEAVABLE BY ACID, AN ALKALI SOLUBLE RESIN AND A SOLUBILITY CONTROL AGENT; POSITIVES, RESOLUTION JSR CORPORATION (JP) 2001-02-13 US disclosed
US-6180316-B1 SUITABLE FOR USE AS CHEMICALLY AMPLIFIED RESIST USED IN MANUFACTURING OF INTEGRATED CIRCUITS JSR CORPORATION (JP) 2001-01-30 US disclosed
EP-1048983-A1 Radiation sensitive resin composition JSR Corporation (JP) 2000-11-02 EP disclosed
EP-1045290-A2 Composition for resist underlayer film and method for producing the same JSR Corporation (JP) 2000-10-18 EP disclosed
EP-0930541-A1 Radiation sensitive resin composition JSR Corporation (JP) 1999-07-21 EP disclosed
EP-0849634-A1 Radiation sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1998-06-24 EP disclosed