SCHEMBL645895

SCHEMBL645895

O=S(=O)(Cc1ccccc1)OS(c1ccccc1)(c1ccccc1)c1ccccc1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 1/20 0.55
CA1 P00915 3/20 0.47
CA2 P00918 3/20 0.47
PRSS1 P07477 3/20 0.47
PRSS2 P07478 3/20 0.47
PRSS3 P35030 3/20 0.47
CA9 Q16790 2/20 0.47
FAAH O00519 1/20 0.47
ELANE P08246 1/20 0.47
PRTN3 P24158 1/20 0.47
CA5A P35218 1/20 0.47
HTT P42858 1/20 0.44
MMP1 P03956 1/20 0.42
MMP2 P08253 1/20 0.42
MMP9 P14780 1/20 0.42
MMP8 P22894 1/20 0.42
MMP13 P45452 1/20 0.42
KEAP1 Q14145 1/20 0.41
TSHR P16473 2/20 0.41
HSD17B10 Q99714 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4465657 0.85 HTR6 (0.44) KMT2ACA1CA2PRSS1PRSS2
SCHEMBL1972890 0.85 KMT2A (0.65) KMT2ACA1CA2PRSS1PRSS2
SCHEMBL218621 0.81 HTR6 (0.44) KMT2ACA1CA2CA9CA5A
SCHEMBL4485970 0.79 PSIP1 (0.52) KMT2ACA1CA2CA9CA5A
SCHEMBL11438308 0.78 KMT2A (0.57) KMT2ACA1CA2PRSS1PRSS2
SCHEMBL218711 0.78 HTR6 (0.41) CA1CA2CA9CA5AMMP1
SCHEMBL11036282 0.75 KMT2A (0.59) KMT2ACA1CA2PRSS1PRSS2
SCHEMBL6652822 0.74 TDP1 (0.49) KMT2ACA1CA2CA9CA5A
SCHEMBL3454429 0.74 SMN1; SMN2 (0.40) CA1CA2CA9CA5AMMP1
SCHEMBL29671360 0.74 KMT2A (0.53) KMT2ACA1CA2PRSS1PRSS2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20150076552-A1 SILICONE RESIN COMPOSITION, SEMI-CURED MATERIAL SHEET, PRODUCING METHOD OF SILICONE CURED MATERIAL, LIGHT EMITTING DIODE DEVICE, AND PRODUCING METHOD THEREOF NITTO DENKO CORPORATION (JP) 2015-03-19 US disclosed
US-20130341671-A1 SILICONE RESIN COMPOSITION, SEMI-CURED MATERIAL SHEET, PRODUCING METHOD OF SILICONE CURED MATERIAL, LIGHT EMITTING DIODE DEVICE, AND PRODUCING METHOD THEREOF NITTO DENKO CORPORATION (JP) 2013-12-26 US disclosed
EP-2677005-A1 Silicone resin composition, semi-cured material sheet, producing method of silicone cured material, light emitting diode device, and producing method thereof NITTO DENKO CORPORATION (JP) 2013-12-25 EP disclosed
US-8119323-B2 Process for producing patterned film and photosensitive resin composition SEKISUI CHEMICAL CO., LTD. (JP) 2012-02-21 US disclosed
US-20090206328-A1 Silicon-Containing Photosensitive Composition, Method for Forming Thin Film Pattern Using Same, Protective Film for Electronic Device, Gate Insulating Film And Thin Film Transistor Matsukawa, Kimihiro (JP) 2009-08-20 US disclosed
US-20090202942-A1 PROCESS FOR PRODUCING PATTERNED FILM AND PHOTOSENSITIVE RESIN COMPOSITION SEKISUI CHEMICAL CO., LTD. (JP) 2009-08-13 US disclosed
EP-1835344-A1 SILICON-CONTAINING PHOTOSENSITIVE COMPOSITION, METHOD FOR FORMING THIN FILM PATTERN USING SAME, PROTECTIVE FILM FOR ELECTRONIC DEVICE, GATE INSULATING FILM AND THIN FILM TRANSISTOR SEKISUI CHEMICAL CO., LTD. (JP) 2007-09-19 EP disclosed
EP-1004936-B1 RESIST RESIN, RESIST RESIN COMPOSITION, AND PROCESS FOR PATTERNING THEREWITH SHOWA DENKO KK (JP) 2003-10-08 EP disclosed
US-6303268-B1 SENSITIVITY TO RADIATION SHOWA DENKO K.K. (JP) 2001-10-16 US disclosed
EP-1004936-A1 RESIST RESIN, RESIST RESIN COMPOSITION, AND PROCESS FOR PATTERNING THEREWITH Showa Denko K K (JP) 2000-05-31 EP disclosed