Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | IDO1 | P14902 | 12/20 | 0.38 |
| ▸ | RIPK1 | Q13546 | 2/20 | 0.36 |
| ▸ | HSPA5 | P11021 | 1/20 | 0.35 |
| ▸ | GABRA1 | P14867 | 1/20 | 0.33 |
| ▸ | GABRB2 | P47870 | 1/20 | 0.33 |
| ▸ | BCHE | P06276 | 1/20 | 0.33 |
| ▸ | ACHE | P22303 | 1/20 | 0.33 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.33 |
| ▸ | TK1 | P04183 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14008209 | 0.86 | TAAR1 (0.43) | ACHE | |
| SCHEMBL18240037 | 0.84 | TAAR1 (0.42) | ACHE | |
| SCHEMBL13050671 | 0.84 | ALDH1A1 (0.45) | IDO1GABRA1GABRB2BCHEACHE | |
| SCHEMBL18185026 | 0.84 | FDPS (0.38) | IDO1 | |
| SCHEMBL841507 | 0.84 | IDO1 (0.55) | IDO1RIPK1 | |
| SCHEMBL13603792 | 0.84 | IDO1 (0.55) | IDO1 | |
| SCHEMBL8576825 | 0.84 | IDO1 (0.55) | IDO1RIPK1 | |
| Lithium SCHEMBL18240038 | 0.84 | TAAR1 (0.42) | ACHE | |
| SCHEMBL18213797 | 0.84 | HTR1A (0.49) | — | |
| SCHEMBL18213793 | 0.83 | IDO1 (0.60) | IDO1BCHEACHE |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118053799-A | Method for manufacturing semiconductor device | 株式会社力森诺科 | 2024-05-17 | — | — | CN | disclosed |
| CN-117157733-A | Method for manufacturing semiconductor device and dicing die-bonding integrated film | 株式会社力森诺科 | 2023-12-01 | — | — | CN | disclosed |
| CN-110945634-B | Heat-dissipating die bonding film and dicing die bonding film | 株式会社力森诺科 | 2023-08-29 | — | — | CN | disclosed |
| WO-2022255322-A1 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND DICING-DIE BONDING INTEGRATED FILM | 昭和電工マテリアルズ株式会社 | 2022-12-08 | — | — | WO | disclosed |
| WO-2022255321-A1 | INTEGRATED DICING/DIE BONDING FILM AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 昭和電工マテリアルズ株式会社 | 2022-12-08 | — | — | WO | disclosed |
| CN-112292431-B | Crystal cutting and crystal bonding integrated film and pressure-sensitive adhesive film used by same | 昭和电工材料株式会社 | 2022-09-02 | — | — | CN | disclosed |
| US-20220216114-A1 | METHOD FOR EVALUATING PICKUP PERFORMANCE, INTEGRATED DICING/DIE-BONDING FILM, METHOD FOR EVALUATING AND SELECTING INTEGRATED DICING/DIE-BONDING FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2022-07-07 | — | — | US | disclosed |
| CN-114641849-A | Dicing die-bonding integrated film, method for manufacturing the same, and method for manufacturing semiconductor device | 昭和电工材料株式会社 | 2022-06-17 | — | — | CN | disclosed |
| CN-114641848-A | Dicing die-bonding integrated film, method for manufacturing the same, and method for manufacturing semiconductor device | 昭和电工材料株式会社 | 2022-06-17 | — | — | CN | disclosed |
| CN-113348533-B | Method for evaluating pickup property, die-cut/die-bond integrated film, method for evaluating the same, method for sorting the same, and method for manufacturing semiconductor device | 昭和电工材料株式会社 | 2022-06-03 | — | — | CN | disclosed |
| EP-2128213-A1 | ADHESIVE COMPOSITION FOR OPTICAL WAVEGUIDE, ADHESIVE FILM FOR OPTICAL WAVEGUIDE AND ADHESIVE SHEET FOR OPTICAL WAVEGUIDE EACH USING THE SAME, AND OPTICAL DEVICE USING ANY OF THEM | Hitachi Chemical Company, Ltd. (JP) | 2009-12-02 | — | — | EP | disclosed |
| US-20090186955-A1 | ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE | INADA TEIICHI | 2009-07-23 | — | — | US | disclosed |
| US-7517724-B2 | Dicing/die bonding sheet | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2009-04-14 | — | — | US | disclosed |
| US-20070036971-A1 | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device | INADA TEIICHI | 2007-02-15 | — | — | US | disclosed |
| US-20070026572-A1 | Dicing/die bonding sheet | RESONAC CORPORATION (JP) | 2007-02-01 | — | — | US | disclosed |
| US-20060106166-A1 | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device | INADA TEIICHI | 2006-05-18 | — | — | US | disclosed |
| US-20060100315-A1 | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device | INADA TEIICHI | 2006-05-11 | — | — | US | disclosed |
| US-20030069331-A1 | An adhesive formulation containing an epoxy resin, a phenolic curing agent and a acrylic copolymer incompatible with epoxy resin | HITACHI CHEMICAL CO., LTD. (JP) | 2003-04-10 | — | — | US | disclosed |
| US-6297332-B1 | FOR SEALING A SEMICONDUCTOR INTEGRATED CIRCUIT, AMINOPHOSPHINE OXIDE AS IMPROVED ACCELERATING AGENT, PACKAGE BETTER IN CRACK RESISTANCE | MITSUI CHEMICALS, INC. (JP) | 2001-10-02 | — | — | US | disclosed |
| EP-0953588-A2 | An epoxy-resin composition and use thereof | Mitsui Chemicals, Inc. (JP) | 1999-11-03 | — | — | EP | disclosed |