Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LTA4H | P09960 | 3/20 | 0.45 |
| ▸ | TSHR | P16473 | 6/20 | 0.45 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.45 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.45 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.44 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.44 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.44 |
| ▸ | TDP1 | Q9NUW8 | 4/20 | 0.42 |
| ▸ | L3MBTL1 | Q9Y468 | 3/20 | 0.42 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.42 |
| ▸ | HPGD | P15428 | 1/20 | 0.41 |
| ▸ | MEN1 | O00255 | 1/20 | 0.41 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.41 |
| ▸ | NR5A1 | Q13285 | 1/20 | 0.39 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.39 |
| ▸ | LIPG | Q9Y5X9 | 1/20 | 0.38 |
| ▸ | RECQL | P46063 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29618448 | 1.00 | LTA4H (0.45) | LTA4HTSHRALDH1A1CYP3A4CYP1A2 | |
| SCHEMBL4235969 | 0.90 | TDP1 (0.42) | LTA4HTSHRALDH1A1CYP3A4CYP1A2 | |
| SCHEMBL10792626 | 0.88 | TSHR (0.44) | LTA4HTSHRALDH1A1CYP3A4CYP1A2 | |
| SCHEMBL9452735 | 0.86 | CYP1A2 (0.55) | LTA4HTSHRALDH1A1CYP3A4CYP1A2 | |
| SCHEMBL19055306 | 0.86 | IDO1 (0.50) | LTA4HTSHRALDH1A1CYP3A4CYP1A2 | |
| SCHEMBL1839896 | 0.86 | IDO1 (0.50) | LTA4HTSHRALDH1A1CYP3A4TDP1 | |
| SCHEMBL14948690 | 0.86 | IDO1 (0.50) | LTA4HTSHRALDH1A1CYP3A4CYP1A2 | |
| SCHEMBL648261 | 0.86 | L3MBTL1 (0.45) | LTA4HTSHRALDH1A1L3MBTL1NPSR1 | |
| SCHEMBL7178486 | 0.85 | LTA4H (0.40) | LTA4HTSHRALDH1A1CYP3A4NPSR1 | |
| SCHEMBL18386621 | 0.84 | GABRA1 (0.48) | LTA4HTSHRALDH1A1CYP3A4CYP1A2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2022255321-A1 | INTEGRATED DICING/DIE BONDING FILM AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 昭和電工マテリアルズ株式会社 | 2022-12-08 | — | — | WO | disclosed |
| WO-2022255322-A1 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND DICING-DIE BONDING INTEGRATED FILM | 昭和電工マテリアルズ株式会社 | 2022-12-08 | — | — | WO | disclosed |
| US-20220216114-A1 | METHOD FOR EVALUATING PICKUP PERFORMANCE, INTEGRATED DICING/DIE-BONDING FILM, METHOD FOR EVALUATING AND SELECTING INTEGRATED DICING/DIE-BONDING FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2022-07-07 | — | — | US | disclosed |
| US-20140332984-A1 | ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE | HITACHI CHEMICAL CO LTD (JP) | 2014-11-13 | — | — | US | disclosed |
| US-8200059-B2 | Adhesive composition for optical waveguide, adhesive film for optical waveguide and adhesive sheet for optical waveguide each using the same, and optical device using any of them | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-06-12 | — | — | US | disclosed |
| US-20120080808-A1 | ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE | INADA TEIICHI (JP) | 2012-04-05 | — | — | US | disclosed |
| US-8119737-B2 | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-02-21 | — | — | US | disclosed |
| US-8053378-B2 | Modified phenolic resin, epoxy resin composition containing the same, and prepreg containing the composition | MITSUI CHEMICALS, INC. (JP) | 2011-11-08 | — | — | US | disclosed |
| US-20110187006-A1 | ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE | INADA TEIICHI | 2011-08-04 | — | — | US | disclosed |
| US-7947779-B2 | Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-05-24 | — | — | US | disclosed |
| US-20070026572-A1 | Dicing/die bonding sheet | RESONAC CORPORATION (JP) | 2007-02-01 | — | — | US | disclosed |
| US-20060106166-A1 | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device | INADA TEIICHI | 2006-05-18 | — | — | US | disclosed |
| US-20060100315-A1 | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device | INADA TEIICHI | 2006-05-11 | — | — | US | disclosed |
| US-20040259019-A1 | Positive photosensitive composition | SUMITOMO CHEMICAL COMPANY, LIMITED | 2004-12-23 | — | — | US | disclosed |
| US-20030069331-A1 | An adhesive formulation containing an epoxy resin, a phenolic curing agent and a acrylic copolymer incompatible with epoxy resin | HITACHI CHEMICAL CO., LTD. (JP) | 2003-04-10 | — | — | US | disclosed |
| US-6297332-B1 | FOR SEALING A SEMICONDUCTOR INTEGRATED CIRCUIT, AMINOPHOSPHINE OXIDE AS IMPROVED ACCELERATING AGENT, PACKAGE BETTER IN CRACK RESISTANCE | MITSUI CHEMICALS, INC. (JP) | 2001-10-02 | — | — | US | disclosed |
| EP-0953588-A2 | An epoxy-resin composition and use thereof | Mitsui Chemicals, Inc. (JP) | 1999-11-03 | — | — | EP | disclosed |
| EP-0233450-B1 | LINEAR SALICYLIC ACID COPOLYMERS AND THEIR METAL SALTS, PRODUCTION PROCESS THEREOF, COLOR-DEVELOPING AGENTS COMPRISING METAL-RESINS OF THE COPOLYMERS, AND COLOR-DEVELOPING SHEETS EMPLOYING THE AGENTS | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1992-03-11 | — | — | EP | disclosed |
| US-4783521-A | Linear salicylic acid copolymers and their metal salts, production process thereof, color-developing agents comprising metal-resins of the copolymers | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1988-11-08 | — | — | US | disclosed |
| EP-0233450-A2 | Linear salicylic acid copolymers and their metal salts, production process thereof, color-developing agents comprising metal-resins of the copolymers, and color-developing sheets employing the agents | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1987-08-26 | — | — | EP | disclosed |