Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.45 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.45 |
| ▸ | NPC1 | O15118 | 1/20 | 0.45 |
| ▸ | BRD4 | O60885 | 1/20 | 0.45 |
| ▸ | MITF | O75030 | 1/20 | 0.45 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.39 |
| ▸ | LMNA | P02545 | 1/20 | 0.38 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.38 |
| ▸ | MEN1 | O00255 | 1/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.38 |
| ▸ | IDO1 | P14902 | 3/20 | 0.37 |
| ▸ | NR1I2 | O75469 | 1/20 | 0.37 |
| ▸ | MAPT | P10636 | 1/20 | 0.36 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.36 |
| ▸ | ADRA2A | P08913 | 1/20 | 0.35 |
| ▸ | ADRA2B | P18089 | 1/20 | 0.35 |
| ▸ | ADRA2C | P18825 | 1/20 | 0.35 |
| ▸ | TSHR | P16473 | 1/20 | 0.35 |
| ▸ | LTA4H | P09960 | 1/20 | 0.34 |
| ▸ | HPGD | P15428 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL18573061 | 0.89 | IDO1 (0.53) | L3MBTL1KDM4ENPC1BRD4MITF | |
| SCHEMBL10593611 | 0.87 | TAAR1 (0.42) | L3MBTL1KDM4ENPC1BRD4MITF | |
| SCHEMBL29618448 | 0.86 | LTA4H (0.45) | L3MBTL1ALDH1A1MEN1KMT2ANPSR1 | |
| SCHEMBL647824 | 0.86 | LTA4H (0.45) | L3MBTL1ALDH1A1MEN1KMT2ANPSR1 | |
| SCHEMBL7222677 | 0.85 | IDO1 (0.53) | L3MBTL1KDM4ENPC1BRD4MITF | |
| SCHEMBL1988193 | 0.85 | IDO1 (0.53) | L3MBTL1KDM4ENPC1BRD4MITF | |
| SCHEMBL8662272 | 0.85 | CYP1A2 (0.44) | L3MBTL1KDM4ENPC1BRD4MITF | |
| SCHEMBL1984467 | 0.85 | IDO1 (0.53) | L3MBTL1KDM4ENPC1BRD4MITF | |
| SCHEMBL1840002 | 0.85 | IDO1 (0.53) | L3MBTL1KDM4ENPC1BRD4MITF | |
| SCHEMBL6218727 | 0.85 | L3MBTL1 (0.40) | L3MBTL1KDM4ENPC1BRD4MITF |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20220216114-A1 | METHOD FOR EVALUATING PICKUP PERFORMANCE, INTEGRATED DICING/DIE-BONDING FILM, METHOD FOR EVALUATING AND SELECTING INTEGRATED DICING/DIE-BONDING FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2022-07-07 | — | — | US | disclosed |
| US-20140332984-A1 | ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE | HITACHI CHEMICAL CO LTD (JP) | 2014-11-13 | — | — | US | disclosed |
| US-8200059-B2 | Adhesive composition for optical waveguide, adhesive film for optical waveguide and adhesive sheet for optical waveguide each using the same, and optical device using any of them | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-06-12 | — | — | US | disclosed |
| US-20120080808-A1 | ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE | INADA TEIICHI (JP) | 2012-04-05 | — | — | US | disclosed |
| US-8119737-B2 | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-02-21 | — | — | US | disclosed |
| US-8053378-B2 | Modified phenolic resin, epoxy resin composition containing the same, and prepreg containing the composition | MITSUI CHEMICALS, INC. (JP) | 2011-11-08 | — | — | US | disclosed |
| US-20110187006-A1 | ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE | INADA TEIICHI | 2011-08-04 | — | — | US | disclosed |
| US-7947779-B2 | Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-05-24 | — | — | US | disclosed |
| US-20110021005-A1 | ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE | INADA TEIICHI | 2011-01-27 | — | — | US | disclosed |
| US-20100129045-A1 | Adhesive Composition for Optical Waveguide, Adhesive Film for Optical Waveguide and Adhesive Sheet for Optical Waveguide Each Using the Same, and Optical Device Using Any of Them | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2010-05-27 | — | — | US | disclosed |
| US-20070036971-A1 | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device | INADA TEIICHI | 2007-02-15 | — | — | US | disclosed |
| US-20070026572-A1 | Dicing/die bonding sheet | RESONAC CORPORATION (JP) | 2007-02-01 | — | — | US | disclosed |
| US-20060106166-A1 | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device | INADA TEIICHI | 2006-05-18 | — | — | US | disclosed |
| US-20060100315-A1 | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device | INADA TEIICHI | 2006-05-11 | — | — | US | disclosed |
| US-20030069331-A1 | An adhesive formulation containing an epoxy resin, a phenolic curing agent and a acrylic copolymer incompatible with epoxy resin | HITACHI CHEMICAL CO., LTD. (JP) | 2003-04-10 | — | — | US | disclosed |
| US-6297332-B1 | FOR SEALING A SEMICONDUCTOR INTEGRATED CIRCUIT, AMINOPHOSPHINE OXIDE AS IMPROVED ACCELERATING AGENT, PACKAGE BETTER IN CRACK RESISTANCE | MITSUI CHEMICALS, INC. (JP) | 2001-10-02 | — | — | US | disclosed |
| EP-0953588-A2 | An epoxy-resin composition and use thereof | Mitsui Chemicals, Inc. (JP) | 1999-11-03 | — | — | EP | disclosed |
| EP-0233450-B1 | LINEAR SALICYLIC ACID COPOLYMERS AND THEIR METAL SALTS, PRODUCTION PROCESS THEREOF, COLOR-DEVELOPING AGENTS COMPRISING METAL-RESINS OF THE COPOLYMERS, AND COLOR-DEVELOPING SHEETS EMPLOYING THE AGENTS | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1992-03-11 | — | — | EP | disclosed |
| US-4783521-A | Linear salicylic acid copolymers and their metal salts, production process thereof, color-developing agents comprising metal-resins of the copolymers | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1988-11-08 | — | — | US | disclosed |
| EP-0233450-A2 | Linear salicylic acid copolymers and their metal salts, production process thereof, color-developing agents comprising metal-resins of the copolymers, and color-developing sheets employing the agents | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1987-08-26 | — | — | EP | disclosed |