SCHEMBL649159

SCHEMBL649159

CCOCc1cccc(COCC)c1

nearest known ligand 0.46

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.46
IDO1 P14902 11/20 0.43
AGXT P21549 8/20 0.41
MRGPRX4 Q96LA9 2/20 0.40
TP53 P04637 1/20 0.40
PKM P14618 1/20 0.40
NFKB1 P19838 1/20 0.40
NFKB2 Q00653 1/20 0.40
RELA Q04206 1/20 0.40
SMN1; SMN2 Q16637 1/20 0.40
CYP3A4 P08684 1/20 0.39
PTPN1 P18031 1/20 0.38
FFAR4 Q5NUL3 1/20 0.38
DPP4 P27487 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9628682 0.95 TSHR (0.48) TSHRIDO1AGXTMRGPRX4TP53
SCHEMBL13274041 0.93 SOD1 (0.42) TSHRIDO1AGXTMRGPRX4TP53
SCHEMBL14962810 0.91 IDO1 (0.40) TSHRIDO1AGXTMRGPRX4TP53
SCHEMBL29928701 0.89 MRGPRX4 (0.46) TSHRIDO1MRGPRX4TP53PKM
SCHEMBL18949771 0.89 ALDH1A1 (0.39) TSHRIDO1AGXTMRGPRX4TP53
SCHEMBL17214615 0.89 ENPP2 (0.50) IDO1MRGPRX4NFKB1SMN1; SMN2CYP3A4
SCHEMBL20547932 0.89 MRGPRX4 (0.46) TSHRIDO1MRGPRX4TP53PKM
SCHEMBL8750524 0.87 IDO1 (0.62) IDO1
SCHEMBL9524707 0.87 ENPP2 (0.52) PKMNFKB1CYP3A4
SCHEMBL20548123 0.86 ALDH1A1 (0.46) TSHRIDO1MRGPRX4TP53PKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2022255322-A1 METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND DICING-DIE BONDING INTEGRATED FILM 昭和電工マテリアルズ株式会社 2022-12-08 WO disclosed
WO-2022255321-A1 INTEGRATED DICING/DIE BONDING FILM AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE 昭和電工マテリアルズ株式会社 2022-12-08 WO disclosed
US-20220216114-A1 METHOD FOR EVALUATING PICKUP PERFORMANCE, INTEGRATED DICING/DIE-BONDING FILM, METHOD FOR EVALUATING AND SELECTING INTEGRATED DICING/DIE-BONDING FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE RESONAC CORPORATION (JP) 2022-07-07 US disclosed
CN-108884212-B Maleimide resin, curable resin composition and cured product thereof 日本化药株式会社 2020-12-29 CN disclosed
CN-106103534-B Aromatic amine resin, maleimide resin, hardening resin composition and its solidfied material 日本化药株式会社 2019-04-02 CN disclosed
CN-108884212-A Maleimide resin, hardening resin composition and its hardening thing 日本化药株式会社 2018-11-23 CN disclosed
US-9905768-B2 Semiconductor device and insulating layer-forming composition FUJIFILM CORPORATION (JP) 2018-02-27 US disclosed
US-9905768-B2 Semiconductor device and insulating layer-forming composition FUJIFILM CORPORATION (JP) 2018-02-27 US disclosed
US-20170054076-A1 SEMICONDUCTOR DEVICE AND INSULATING LAYER-FORMING COMPOSITION FUJIFILM CORPORATION (JP) 2017-02-23 US disclosed
US-20170054076-A1 SEMICONDUCTOR DEVICE AND INSULATING LAYER-FORMING COMPOSITION FUJIFILM CORPORATION (JP) 2017-02-23 US disclosed
EP-0342943-B1 THERMOSETTING RESIN COMPOSITION MITSUI TOATSU CHEMICALS, Inc. (JP) 1993-08-04 EP disclosed
EP-0233450-B1 LINEAR SALICYLIC ACID COPOLYMERS AND THEIR METAL SALTS, PRODUCTION PROCESS THEREOF, COLOR-DEVELOPING AGENTS COMPRISING METAL-RESINS OF THE COPOLYMERS, AND COLOR-DEVELOPING SHEETS EMPLOYING THE AGENTS MITSUI TOATSU CHEMICALS, Inc. (JP) 1992-03-11 EP disclosed
US-5051494-A A bismaleimide and an amino resin MITSUI TOATSU CHEMICALS, INC. (JP) 1991-09-24 US disclosed
US-4959443-A HIGH STRENGTH, REACTION OF ARALKYL ALCOHOL AND AROMATIC AMINE MITSUI TOATSU CHEMICALS, INC. (JP) 1990-09-25 US disclosed
US-4937318-A Aromatic amine resins MITSUI TOATSU CHEMICALS, INC. (JP) 1990-06-26 US disclosed
EP-0342943-A1 Thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-11-23 EP disclosed
EP-0311387-A2 Aromatic amine resins, their production process and thermosetting resin compositions making use of the same MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-04-12 EP disclosed
US-4783521-A Linear salicylic acid copolymers and their metal salts, production process thereof, color-developing agents comprising metal-resins of the copolymers MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1988-11-08 US disclosed
EP-0284385-A2 Aralkylphenolic resin molding material MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-09-28 EP disclosed
EP-0233450-A2 Linear salicylic acid copolymers and their metal salts, production process thereof, color-developing agents comprising metal-resins of the copolymers, and color-developing sheets employing the agents MITSUI TOATSU CHEMICALS, Inc. (JP) 1987-08-26 EP disclosed