SCHEMBL650713

SCHEMBL650713

C1=CC2(CCc3ccccc3)CCC1C2

nearest known ligand 0.41

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
KDM1A O60341 6/20 0.41
MAOA P21397 2/20 0.41
MAOB P27338 2/20 0.41
HSD11B1 P28845 1/20 0.36
RCOR1 Q9UKL0 4/20 0.35
HRH3 Q9Y5N1 1/20 0.35
OPRM1 P35372 1/20 0.34
OPRL1 P41146 1/20 0.34
ALDH1A1 P00352 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30180312 0.91 MEN1 (0.36) KDM1AMAOAMAOBALDH1A1
SCHEMBL20362170 0.89 OPRM1 (0.36) KDM1AMAOAMAOBOPRM1OPRL1
SCHEMBL443563 0.83 MAOA (0.40) KDM1AMAOAMAOBHSD11B1RCOR1
SCHEMBL20362176 0.83 FDFT1 (0.37) HRH3
SCHEMBL7120876 0.78
SCHEMBL17912773 0.77 KCNA3 (0.39) ALDH1A1SMN1; SMN2
SCHEMBL15063657 0.76 ALDH1A1 (0.34) KDM1AMAOAMAOBALDH1A1SMN1; SMN2
SCHEMBL1978762 0.75
SCHEMBL10700252 0.73 TDP1 (0.34) ALDH1A1
SCHEMBL29785802 0.72 TP53 (0.44) ALDH1A1SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 99 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023158767-A1 DUAL CATALYST SYSTEM FOR MASS VINYL ADDITION AND CATIONIC POLYMERIZABLE COMPOSITIONS PROMERUS, LLC (US) 2023-08-24 WO claimed
EP-4085083-A1 UV ACTIVE DERIVATIVES OF PD(ACAC)2 CATALYZED POLYCYCLOOLEFIN COMPOSITIONS AS OPTICAL MATERIALS Promerus, LLC (US) 2022-11-09 EP claimed
US-9263416-B2 Methods and materials useful for chip stacking, chip and wafer bonding SUMITOMO BAKELITE CO., LTD. (JP) 2016-02-16 US claimed
US-9051452-B2 Polymer compositions for temporary bonding PROMERUS, LLC (US) 2015-06-09 US claimed
US-20140349446-A1 METHODS AND MATERIALS USEFUL FOR CHIP STACKING, CHIP AND WAFER BONDING PROMERUS, LLC (US) 2014-11-27 US claimed
US-8816485-B2 Methods and materials useful for chip stacking, chip and wafer bonding SUMITOMO BAKELITE CO., LTD. (JP) 2014-08-26 US claimed
US-8678203-B2 Polynorbornene pervaporation membrane films, preparation and use thereof PROMERUS, LLC (US) 2014-03-25 US claimed
US-20130292872-A1 Polynorbornene Pervaporation Membrane Films, Preparation and Use Thereof PROMERUS, LLC 2013-11-07 US claimed
US-8470944-B2 Polynorbornene pervaporation membrane films, preparation and use thereof PROMERUS, LLC (US) 2013-06-25 US claimed
US-20120283404-A1 Polynorbornene Pervaporation Membrane Films, Preparation and Use Thereof PROMERUS LLC (US) 2012-11-08 US claimed
EP-1791888-B1 POLYCYCLOOLEFIN POLYMERIC COMPOSITIONS FOR SEMICONDUCTOR APPLICATIONS PROMERUS LLC (US) 2009-03-25 EP claimed
US-20080073741-A1 provide strong bonds while also being readily removed with little or no residues; reworkable; semiconductor; norbornene-type polymer derived from phenethyl norbornene, or glycidyl methyl ether norbornene or decyl norbornene PROMERUS LLC (US) 2008-03-27 US claimed
CN-101044185-A Photosensitive compositions based on polycyclic polymers PROMERUS LLC (US) 2007-09-26 CN claimed
US-20070148566-A1 Optical waveguides and methods thereof SUMITOMO BAKELITE CO., LTD. (JP) 2007-06-28 US claimed
EP-1791888-A1 POLYCYCLOOLEFIN POLYMERIC COMPOSITIONS FOR SEMICONDUCTOR APPLICATIONS Promerus, LLC (US) 2007-06-06 EP claimed
EP-1771491-A1 PHOTOSENSITIVE COMPOSITIONS BASED ON POLYCYCLIC POLYMERS Promerus, LLC (US) 2007-04-11 EP claimed
WO-2006023511-A1 POLYCYCLOOLEFIN POLYMERIC COMPOSITIONS FOR SEMICONDUCTOR APPLICATIONS PROMERUS LLC (US) 2006-03-02 WO claimed
US-20060041093-A1 Polycycloolefin polymeric compositions for semiconductor applications SUMITOMO BAKELITE CO., LTD. (JP) 2006-02-23 US claimed
WO-2006016925-A1 PHOTOSENSITIVE COMPOSITIONS BASED ON POLYCYCLIC POLYMERS PROMERUS LLC (US) 2006-02-16 WO claimed
US-20060020068-A1 Photosensitive compositions based on polycyclic polymers for low stress, high temperature films PROMERUS, LLC 2006-01-26 US claimed