SCHEMBL6531076

SCHEMBL6531076

c1cnc(CC2CO2)cn1

nearest known ligand 0.33

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
MAP4K4 O95819 2/20 0.33
HSP90AA1 P07900 1/20 0.32
HDAC3 O15379 1/20 0.32
HDAC1 Q13547 1/20 0.32
HDAC2 Q92769 1/20 0.32
HDAC6 Q9UBN7 1/20 0.32
CYP1A2 P05177 1/20 0.32
CYP3A4 P08684 1/20 0.32
CYP2C9 P11712 1/20 0.32
CYP2C19 P33261 1/20 0.32
GABRA1 P14867 1/20 0.31
GABRA5 P31644 1/20 0.31
ROCK2 O75116 1/20 0.30
VNN1 O95497 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16606318 0.77 CYP1A2 (0.37) CYP1A2CYP3A4CYP2C9CYP2C19
SCHEMBL25235377 0.75 MAP4K4 (0.40) MAP4K4HSP90AA1HDAC3HDAC1HDAC2
SCHEMBL465245 0.72 HRH1 (0.44)
SCHEMBL18919009 0.71 ALDH1A1 (0.35) CYP3A4
SCHEMBL3507744 0.71 HRH4 (0.44) MAP4K4
Hydrochloric Acid SCHEMBL28440523 0.71 HRH1 (0.42)
SCHEMBL980114 0.70
SCHEMBL14060896 0.69 TDP1 (0.43) CYP1A2CYP3A4
SCHEMBL28310570 0.68 HRH3 (0.49) MAP4K4ROCK2
SCHEMBL1521573 0.68 HSP90AA1 (0.43) HSP90AA1HDAC3HDAC1HDAC2HDAC6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10197930-B2 Electrophotographic member, process cartridge, and electrophotographic apparatus CANON KABUSHIKI KAISHA (JP) 2019-02-05 US disclosed
CN-106483801-A Electrophotography component, handle box and electronic photographing device 佳能株式会社 2017-03-08 CN disclosed
US-20170060007-A1 ELECTROPHOTOGRAPHIC MEMBER, PROCESS CARTRIDGE, AND ELECTROPHOTOGRAPHIC APPARATUS CANON KABUSHIKI KAISHA (JP) 2017-03-02 US disclosed
US-6946198-B2 A semiconductor device is bonded to a wiring board, using a liquid binder containing epoxy resins and a hydrolyzed silantriol coupling agents, a curing agent, and conductive metallic powder; low viscosity HITACHI, LTD. (JP) 2005-09-20 US disclosed
US-6821657-B1 PREHEATING A MIXTURE OF AN EPOXY RESIN, AND ORGANOSILICON COMPOUND AND WATER PRIOR TO ADDING A CURING AGENT IS EFFECTIVE TO OBTAIN A THERMOSETTING RESIN COMPOSITION WHICH HAS A LOW VISCOSITY AT A ROOM TEMPERATURE HITACHI, LTD. (JP) 2004-11-23 US disclosed
US-20040007769-A1 Solvent-free thermosetting resin composition, process for producing the same, and product therefrom TAKAHASHI AKIO (JP) 2004-01-15 US disclosed