SCHEMBL6545360

SCHEMBL6545360

O=C(c1ccc(F)cc1)c1cccc(C#Cc2ccc(F)cc2)c1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ATM Q13315 1/20 0.46
TDP1 Q9NUW8 1/20 0.46
L3MBTL1 Q9Y468 1/20 0.46
LMNA P02545 3/20 0.45
SMN1; SMN2 Q16637 3/20 0.45
ALPG P10696 2/20 0.45
HPGD P15428 2/20 0.45
VNN1 O95497 1/20 0.45
CTSL P07711 2/20 0.45
CTSK P43235 1/20 0.45
LTA4H P09960 1/20 0.44
MMP2 P08253 1/20 0.44
MMP9 P14780 1/20 0.44
MMP12 P39900 1/20 0.44
MAPK14 Q16539 3/20 0.44
CA12 O43570 1/20 0.43
CA1 P00915 1/20 0.43
CA2 P00918 1/20 0.43
CA9 Q16790 1/20 0.43
GRM5 P41594 2/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7715052 1.00 ATM (0.46) ATMTDP1L3MBTL1LMNASMN1; SMN2
SCHEMBL7716078 0.97 ATM (0.48) ATMTDP1L3MBTL1LMNASMN1; SMN2
SCHEMBL7716935 0.97 VNN1 (0.47) ATMTDP1L3MBTL1VNN1MMP2
SCHEMBL4301156 0.95 L3MBTL1 (0.53) ATMTDP1L3MBTL1LMNASMN1; SMN2
SCHEMBL7518691 0.88 VNN1 (0.42) ATMTDP1L3MBTL1LMNASMN1; SMN2
SCHEMBL7512194 0.88 GRM5 (0.42) ATMTDP1L3MBTL1LMNASMN1; SMN2
SCHEMBL1746493 0.86 MMP2 (0.55) LMNASMN1; SMN2ALPGHPGDLTA4H
SCHEMBL7717354 0.86 LTA4H (0.57) TDP1LMNASMN1; SMN2ALPGHPGD
SCHEMBL7716924 0.86 LTA4H (0.57) TDP1LMNASMN1; SMN2ALPGHPGD
SCHEMBL7715045 0.86 LTA4H (0.57) TDP1LMNASMN1; SMN2ALPGHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6303733-B1 FROM BISPHENOL COMPOUNDS AND DIFLUORO DIARYLACETYLENES AND/OR ETHYNYLATED BENZOPHENONES; DIELECTRICS EMPLOYED WITH A VARIETY OF MICROELECTRONIC DEVICES, FOR EXAMPLE, INTEGRATED CIRCUITS AND MULTICHIP MODULES. ALLIEDSIGNAL INC. 2001-10-16 US claimed
WO-2000031163-A2 POLY(ARYLENE ETHER) HOMOPOLYMER COMPOSITIONS AND METHODS OF MANUFACTURE THEREOF ALLIEDSIGNAL INC. (US) 2000-06-02 WO claimed
EP-1274755-B1 LOW DIELECTRIC CONSTANT ORGANIC DIELECTRICS BASED ON CAGE-LIKE STRUCTURES HONEYWELL INT INC (US) 2008-02-20 EP disclosed
US-7307137-B2 CROSSLINKING SHELL-CORE POLYMER HONEYWELL INTERNATIONAL INC. (US) 2007-12-11 US disclosed
US-7307137-B2 CROSSLINKING SHELL-CORE POLYMER HONEYWELL INTERNATIONAL INC. (US) 2007-12-11 US disclosed
US-6780517-B2 FOR USE IN SEMICONDUCTOR DEVICES HONEYWELL INTERNATIONAL INC. 2004-08-24 US disclosed
US-6761975-B1 RESISTANCE TO DELAMINATION; ELIMINATES THE NEED FOR A PRIMER COATING APPLICATION PROCESS STEP; CURABLE POLYARYL ETHER FILM HONEYWELL INTERNATIONAL INC. 2004-07-13 US disclosed
US-20040102584-A1 Low dielectric constant materials with polymeric networks LAU KREISLER S (US) 2004-05-27 US disclosed
US-6713590-B2 FABRICATED FROM FIRST COMPONENT COMPRISING POLYMERIC STRAND AND SECOND COMPONENT COMPRISING MOLECULE HAVING CENTRAL PORTION WITH AT LEAST THREE ARMS EXTENDING THEREFROM HONEYWELL INTERNATIONAL INC. 2004-03-30 US disclosed
EP-1373382-A2 NANOPOROUS LOW DIELECTRIC CONSTANT POLYMERS Honeywell International Inc. (US) 2004-01-02 EP disclosed
US-20030143390-A1 Nanoporous low dielectric constant polymers with hollow polymer particles HONEYWELL INTERNATIONAL INC. 2003-07-31 US disclosed
US-20020037941-A1 Low dielectric constant materials with polymeric networks LAU KREISLER S (US) 2002-03-28 US disclosed
WO-2002006366-A1 LOW DIELECTRIC CONSTANT MATERIALS WITH POLYMERIC NETWORKS HONEYWELL INTERNATIONAL INC. (US) 2002-01-24 WO disclosed
EP-1171516-A1 POLYMERS HAVING BACKBONES WITH REACTIVE GROUPS EMPLOYED IN CROSSLINKING AS PRECURSORS TO NANOPOROUS THIN FILM STRUCTURES AlliedSignal Inc. (US) 2002-01-16 EP disclosed
US-6313185-B1 PROVIDING POLYMERIC STRANDS WHEREIN EACH OF THE POLYMERIC STRANDS INCLUDES THERMOLABILE PORTION, AND DEFINES A BACKBONE INCLUDING REACTIVE GROUPS; PROVIDING ENERGY TO CROSSLINK; PROVIDING ENERGY TO PARTIALLY DERGADE THERMOLABILE PORTION HONEYWELL INTERNATIONAL INC. 2001-11-06 US disclosed
US-6303733-B1 FROM BISPHENOL COMPOUNDS AND DIFLUORO DIARYLACETYLENES AND/OR ETHYNYLATED BENZOPHENONES; DIELECTRICS EMPLOYED WITH A VARIETY OF MICROELECTRONIC DEVICES, FOR EXAMPLE, INTEGRATED CIRCUITS AND MULTICHIP MODULES. ALLIEDSIGNAL INC. 2001-10-16 US disclosed
WO-2001046963-A1 POLYCARBOSILANE ADHESION PROMOTERS FOR LOW DIELECTRIC CONSTANT POLYMERIC MATERIALS ALLIEDSIGNAL INC. (US) 2001-06-28 WO disclosed
US-6172128-B1 FABRICATING NANOPOROUS MATERIAL BY CROSSLINKING TWO POLYMERIC STRANDS, EACH HAVING A CROSSLINKING FUNCTIONALITY AND AT LEAST ONE HAVING A THERMOLABILE PORTION, TO FORM A CYCLIC STRUCTURE FOLLOWED BY THERMOLYSIS OF THERMOLABILE PORTION HONEYWELL INTERNATIONAL INC. 2001-01-09 US disclosed
WO-2000061667-A1 POLYMERS HAVING BACKBONES WITH REACTIVE GROUPS EMPLOYED IN CROSSLINKING AS PRECURSORS TO NANOPOROUS THIN FILM STRUCTURES ALLIEDSIGNAL INC. (US) 2000-10-19 WO disclosed
US-6124421-A A SEMICONDUCTOR DEVICE COMPRISING A DIELECTRIC LAYER DISPOSED OVERLYING A SURFACE, COMPRISES A POLY(ARYLENE ETHER) ALLIEDSIGNAL INC. (US) 2000-09-26 US disclosed