SCHEMBL6561402

SCHEMBL6561402

Fc1ccc(-c2ccc(F)cc2-c2ccccc2)cc1

nearest known ligand 0.46

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
PTGS2 P35354 2/20 0.46
PTGS1 P23219 1/20 0.46
MAPT P10636 1/20 0.44
TOP1 P11387 2/20 0.44
GCGR P47871 1/20 0.44
MAPK14 Q16539 1/20 0.44
ADORA1 P30542 2/20 0.43
ADORA2A P29274 1/20 0.42
NR4A2 P43354 1/20 0.41
BACE1 P56817 1/20 0.41
GPR3 P46089 1/20 0.41
METAP2 P50579 1/20 0.41
MKNK1 Q9BUB5 1/20 0.41
MKNK2 Q9HBH9 1/20 0.41
SQOR Q9Y6N5 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11665495 0.95 BACE1 (0.44) PTGS2PTGS1MAPTBACE1GPR3
SCHEMBL13682561 0.89 MEN1 (0.48) PTGS2PTGS1MAPTTOP1GCGR
SCHEMBL30997630 0.86 MAPT (0.45) PTGS2PTGS1MAPTBACE1GPR3
SCHEMBL27649740 0.85 PTGS2 (0.57) PTGS2PTGS1TOP1GCGRMAPK14
Hydrogen Sulfide SCHEMBL27719947 0.83 PTGS2 (0.55) PTGS2PTGS1TOP1GCGRMAPK14
SCHEMBL18241028 0.83 PTGS2 (0.55) PTGS2PTGS1TOP1GCGRMAPK14
SCHEMBL16673243 0.83 MEN1 (0.49) PTGS2PTGS1MAPTTOP1GCGR
SCHEMBL18561607 0.80 MEN1 (0.50) PTGS2PTGS1MAPTADORA1ADORA2A
SCHEMBL30388410 0.79 MAPT (0.47) MAPTADORA1ADORA2AMETAP2
SCHEMBL20777561 0.79 MAPT (0.47) MAPTADORA1ADORA2AMETAP2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1122746-B1 Composition for film formation and insulating film JSR CORP (JP) 2004-09-22 EP disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 EP disclosed