Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPK1 | P28482 | 1/20 | 0.35 |
| ▸ | TSHR | P16473 | 4/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.35 |
| ▸ | HTT | P42858 | 1/20 | 0.33 |
| ▸ | KIF11 | P52732 | 1/20 | 0.31 |
| ▸ | KCNN4 | O15554 | 1/20 | 0.30 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL82858 | 0.80 | TSHR (0.35) | MAPK1TSHRALDH1A1HTTKIF11 | |
| SCHEMBL135715 | 0.77 | MAPK1 (0.38) | MAPK1TSHRALDH1A1HTTKCNN4 | |
| SCHEMBL10610048 | 0.75 | CYP2C9 (0.48) | TSHRALDH1A1HTTKIF11 | |
| SCHEMBL1313620 | 0.74 | L3MBTL1 (0.30) | TSHR | |
| SCHEMBL238217 | 0.72 | KIF11 (0.41) | MAPK1TSHRALDH1A1KIF11KCNN4 | |
| SCHEMBL5701475 | 0.71 | — | — | |
| SCHEMBL7692733 | 0.69 | KCNN4 (0.38) | TSHRALDH1A1HTTKIF11KCNN4 | |
| SCHEMBL9402727 | 0.69 | ALDH1A1 (0.33) | TSHRALDH1A1HTTKIF11 | |
| SCHEMBL705543 | 0.68 | MAPK1 (0.44) | MAPK1ALDH1A1KCNN4 | |
| SCHEMBL109031 | 0.68 | TAAR1 (0.52) | MAPK1ALDH1A1KCNN4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115181223-A | Low-gloss matte auxiliary agent, preparation method thereof and formed body | 铨盛聚碳科技股份有限公司 | 2022-10-14 | — | — | CN | claimed |
| EP-3375808-B1 | PARTICLES, PARTICLE MATERIAL, CONNECTING MATERIAL, AND CONNECTION STRUCTURE | SEKISUI CHEMICAL CO LTD (JP) | 2022-12-21 | — | — | EP | disclosed |
| CN-115181223-A | Low-gloss matte auxiliary agent, preparation method thereof and formed body | 铨盛聚碳科技股份有限公司 | 2022-10-14 | — | — | CN | disclosed |
| CN-114085382-A | Hydrogen-containing poly titanium boron siloxane flame retardant, and preparation method and application thereof | 铨盛聚碳科技股份有限公司 | 2022-02-25 | — | — | CN | disclosed |
| CN-114068067-A | Metal-containing particle, connecting material, connecting structure and method for producing same, conduction test member, and conduction test device | 积水化学工业株式会社 | 2022-02-18 | — | — | CN | disclosed |
| CN-107709414-B | Particle, particle material, connecting material, and connecting structure | 积水化学工业株式会社 | 2021-12-28 | — | — | CN | disclosed |
| CN-111095441-B | Metal-containing particle, connecting material, connecting structure, method for producing connecting structure, member for conduction test, and conduction test device | 积水化学工业株式会社 | 2021-11-23 | — | — | CN | disclosed |
| CN-108140450-B | Metal-containing particle, connecting material, connection structure, and method for producing connection structure | 积水化学工业株式会社 | 2021-08-03 | — | — | CN | disclosed |
| US-20200269315-A1 | METAL-CONTAINING PARTICLE, CONNECTION MATERIAL, CONNECTION STRUCTURE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, CONDUCTION INSPECTION MEMBER, AND CONDUCTION INSPECTION DEVICE | SEKISUI CHEMICAL CO., LTD. (JP) | 2020-08-27 | — | — | US | disclosed |
| EP-3686903-A1 | METAL-CONTAINING PARTICLE, CONNECTION MATERIAL, CONNECTION STRUCTURE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, CONDUCTION INSPECTION MEMBER, AND CONDUCTION INSPECTION DEVICE | Sekisui Chemical Co., Ltd. (JP) | 2020-07-29 | — | — | EP | disclosed |
| CN-110627974-A | High-heat-resistance phosphorus-silicon flame retardant, and preparation method and application thereof | 铨盛聚碳科技股份有限公司 | 2019-12-31 | — | — | CN | disclosed |
| EP-3375808-A1 | PARTICLES, PARTICLE MATERIAL, CONNECTING MATERIAL, AND CONNECTION STRUCTURE | Sekisui Chemical Co., Ltd. (JP) | 2018-09-19 | — | — | EP | disclosed |
| US-9260458-B2 | Method of producing an organic silicon compound | DOW CORNING CORPORATION (US) | 2016-02-16 | — | — | US | disclosed |
| US-20150141689-A1 | Method Of Producing An Organic Silicon Compound | DOW TORAY CO., LTD. (JP) | 2015-05-21 | — | — | US | disclosed |
| EP-2797855-A1 | METHOD OF PRODUCING AN ORGANIC SILICON COMPOUND | Dow Corning Toray Co., Ltd. (JP) | 2014-11-05 | — | — | EP | disclosed |
| WO-2013100166-A1 | METHOD OF PRODUCING AN ORGANIC SILICON COMPOUND | DOW CORNING TORAY CO., LTD. (JP) | 2013-07-04 | — | — | WO | disclosed |
| EP-1122746-B1 | Composition for film formation and insulating film | JSR CORP (JP) | 2004-09-22 | — | — | EP | disclosed |
| US-6468589-B2 | A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING | JSR CORPORATION (JP) | 2002-10-22 | — | — | US | disclosed |
| US-20010012870-A1 | Composition for film formation and insulating film | JSR CORPORATION (JP) | 2001-08-09 | — | — | US | disclosed |
| EP-1122746-A1 | Composition for film formation and insulating film | JSR Corporation (JP) | 2001-08-08 | — | — | EP | disclosed |