Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 4/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.35 |
| ▸ | HTT | P42858 | 1/20 | 0.33 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.31 |
| ▸ | KIF11 | P52732 | 1/20 | 0.31 |
| ▸ | KCNN4 | O15554 | 1/20 | 0.30 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9402727 | 0.85 | ALDH1A1 (0.33) | TSHRALDH1A1HTTKIF11 | |
| SCHEMBL6561439 | 0.80 | MAPK1 (0.35) | TSHRALDH1A1HTTMAPK1KIF11 | |
| SCHEMBL9402693 | 0.78 | ALDH1A1 (0.32) | TSHRALDH1A1HTTKIF11 | |
| SCHEMBL135715 | 0.77 | MAPK1 (0.38) | TSHRALDH1A1HTTMAPK1KCNN4 | |
| SCHEMBL19990803 | 0.72 | TSHR (0.52) | TSHRALDH1A1HTTMAPK1KCNN4 | |
| SCHEMBL9717826 | 0.72 | TSHR (0.42) | TSHRALDH1A1HTTKCNN4KDM4E | |
| SCHEMBL238217 | 0.72 | KIF11 (0.41) | TSHRALDH1A1MAPK1KIF11KCNN4 | |
| SCHEMBL705543 | 0.68 | MAPK1 (0.44) | ALDH1A1MAPK1KCNN4 | |
| SCHEMBL14562712 | 0.68 | TSHR (0.44) | TSHRALDH1A1MAPK1KIF11KCNN4 | |
| SCHEMBL109031 | 0.68 | TAAR1 (0.52) | ALDH1A1MAPK1KCNN4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 284 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12331164-B2 | Curable siloxane resin composition | KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) | 2025-06-17 | — | — | US | claimed |
| CN-115181223-B | Low-gloss matte auxiliary agent, preparation method thereof and molded body | 铨盛聚碳科技股份有限公司 | 2023-08-29 | — | — | CN | claimed |
| WO-2023072128-A1 | COLORANT COMPOSITION AND COATED ARTICLE | GUANGDONG HUARUN PAINTS CO., LTD. (CN) | 2023-05-04 | — | — | WO | claimed |
| US-20230078587-A1 | CURABLE SILOXANE RESIN COMPOSITION | KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) | 2023-03-16 | — | — | US | claimed |
| CN-113956727-A | Colorant composition and coated article | 广东华润涂料有限公司 | 2022-01-21 | — | — | CN | claimed |
| CN-110734552-B | Preparation method of high-purity silicon carbide polycrystalline powder source precursor | 哈尔滨工业大学 | 2021-12-14 | — | — | CN | claimed |
| CN-110734552-A | Preparation method of high-purity silicon carbide polycrystalline powder source precursors | 哈尔滨工业大学 | 2020-01-31 | — | — | CN | claimed |
| EP-2791241-B1 | POLYHYDROXY CURABLE FLUOROELASTOMER COMPOSITIONS | CHEMOURS CO FC LLC (US) | 2018-11-28 | — | — | EP | claimed |
| EP-2791241-A1 | POLYHYDROXY CURABLE FLUOROELASTOMER COMPOSITIONS | E. I. Du Pont de Nemours and Company (US) | 2014-10-22 | — | — | EP | claimed |
| EP-2470574-B1 | PROCESS AND CATALYST SYSTEM FOR POLYDIENE PRODUCTION | BRIDGESTONE CORP (JP) | 2014-09-17 | — | — | EP | claimed |
| US-20070077782-A1 | Treatment of low dielectric constant films using a batch processing system | TOKYO ELECTRON LIMITED (JP) | 2007-04-05 | — | — | US | claimed |
| WO-2006091264-A1 | METHOD AND SYSTEM FOR TREATING A DIELECTRIC FILM | TOKYO ELECTRON LIMITED (JP) | 2006-08-31 | — | — | WO | claimed |
| EP-1390972-B1 | METHOD OF FABICATING LOW-DIELECTRIC CONSTANT INTERLEVEL DIELECTRIC FILMS FOR BEOL INTERCONNECTS WITH ENHANCED ADHESION AND LOW-DEFECT DENSITY | IBM (US) | 2006-07-12 | — | — | EP | claimed |
| US-20050215072-A1 | Method and system for treating a dielectric film | TOKYO ELECTRON LIMITED (JP) | 2005-09-29 | — | — | US | claimed |
| US-6710450-B2 | Interconnect structure with precise conductor resistance and method to form same | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2004-03-23 | — | — | US | claimed |
| EP-1390972-A2 | METHOD OF FABICATING LOW-DIELECTRIC CONSTANT INTERLEVEL DIELECTRIC FILMS FOR BEOL INTERCONNECTS WITH ENHANCED ADHESION AND LOW-DEFECT DENSITY | International Business Machines Corporation (US) | 2004-02-25 | — | — | EP | claimed |
| US-20020160600-A1 | Method of fabricating low-dielectric constant interlevel dielectric films for BEOL interconnects with enhanced adhesion and low-defect density | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2002-10-31 | — | — | US | claimed |
| US-6455443-B1 | APPLYING UNIFORM COATING OF SILANE COUPLING AGENT CONTAINING POLYMERIZABLE GROUP TO SURFACE OF SUBSTRATE, HEATING TO PROVIDE MODIFIED SURFACE LAYER CONTAINING SI-O BONDS, RINSING WITH SOLVENT TO REMOVE UNREACTED COUPLER, APPLYING DIELECTRIC | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2002-09-24 | — | — | US | claimed |
| WO-2002069381-A2 | METHOD OF FABRICATING LOW-DIELECTRIC CONSTANT INTERLEVEL DIELECTRIC FILMS FOR BEOL INTERCONNECTS WITH ENHANCED ADHESION AND LOW-DEFECT DENSITY | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2002-09-06 | — | — | WO | claimed |
| US-20020117737-A1 | Interconnect structure with precise conductor resistance and method to form same | INTERNATIONAL BUSINESS CORPORATION (US) | 2002-08-29 | — | — | US | claimed |