SCHEMBL656154

SCHEMBL656154

O=S(=O)(O)c1ccc(CC2CCCCC2)cc1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 4/20 0.44
MEN1 O00255 3/20 0.44
LTA4H P09960 1/20 0.44
HRH3 Q9Y5N1 1/20 0.43
CA2 P00918 2/20 0.42
CA12 O43570 1/20 0.42
CA1 P00915 1/20 0.42
CA7 P43166 1/20 0.42
CA9 Q16790 1/20 0.42
CA14 Q9ULX7 1/20 0.42
DUSP3 P51452 1/20 0.41
PTPN5 P54829 1/20 0.41
PTPN11 Q06124 1/20 0.41
LMNA P02545 1/20 0.41
TSHR P16473 2/20 0.40
GAA P10253 1/20 0.40
HTT P42858 1/20 0.40
SMN1; SMN2 Q16637 1/20 0.40
SLC18A3 Q16572 1/20 0.40
ALDH1A1 P00352 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8763564 0.98 MEN1 (0.46) KMT2AMEN1LTA4HHRH3CA2
SCHEMBL2944821 0.93 MEN1 (0.43) KMT2AMEN1LTA4HHRH3CA2
SCHEMBL12453115 0.83 DAO (0.43) KMT2AMEN1CA2LMNAHTT
SCHEMBL22123904 0.83 LMNA (0.47) KMT2AMEN1CA2CA12CA1
SCHEMBL778057 0.83 CA1 (0.43) KMT2AMEN1CA2CA12CA1
SCHEMBL16503442 0.82 LTA4H (0.41) KMT2AMEN1LTA4HHRH3CA2
SCHEMBL5160716 0.82 CA2 (0.54) KMT2AMEN1CA2CA12CA1
SCHEMBL20526046 0.81 CYP2D6 (0.50) KMT2AMEN1CA2CA12CA1
SCHEMBL778786 0.81 CA1 (0.37) KMT2AMEN1CA2CA12CA1
SCHEMBL7735405 0.81 DAO (0.41) KMT2AMEN1LMNATSHRALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115988939-A Method for realizing interface welding of perovskite solar cell by self-repairing polymer 江西师范大学 2023-04-18 CN claimed
EP-1163550-B1 HYDROXY-AMINO THERMALLY CURED UNDERCOAT FOR 193 NM LITHOGRAPHY FUJIFILM ELECTRONIC MATERIALS (US) 2007-05-30 EP claimed
CN-115988939-A Method for realizing interface welding of perovskite solar cell by self-repairing polymer 江西师范大学 2023-04-18 CN disclosed
CN-108697595-B Microencapsulated resin particles containing silica, method for producing same and use thereof 积水化成品工业株式会社 2022-01-14 CN disclosed
CN-113795532-A Resist underlayer film forming composition containing alicyclic compound terminal polymer 日产化学株式会社 2021-12-14 CN disclosed
CN-112513108-A Organic-inorganic composite particles, method for producing same, and use thereof 积水化成品工业株式会社 2021-03-16 CN disclosed
WO-2021024464-A1 RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED PRODUCT, CURED PRODUCT, PATTERNED CURED PRODUCT, INTERLAYER INSULATION FILM, COVER COATING LAYER, SURFACE PROTECTION FILM, AND ELECTRONIC COMPONENT HDマイクロシステムズ株式会社 2021-02-11 WO disclosed
US-10626287-B2 Resin composition for underlayer film formation, layered product, method for forming pattern, and process for producing device FUJIFILM CORPORATION (JP) 2020-04-21 US disclosed
US-10344177-B2 Under layer film-forming composition for imprints and method for forming pattern FUJIFILM CORPORATION (JP) 2019-07-09 US disclosed
US-10246605-B2 Resin composition for underlayer film formation, layered product, method for forming pattern, imprint forming kit, and process for producing device FUJIFILM CORPORATION (JP) 2019-04-02 US disclosed
US-10191375-B2 Resin composition for underlayer film formation, layered product, method for forming pattern, imprint forming kit and process for producing device FUJIFILM CORPORATION (JP) 2019-01-29 US disclosed
WO-2009010405-A1 LASER-SENSITIVE COATING FORMULATION BASF SE (CH) 2009-01-22 WO disclosed
EP-1981717-A1 COATING COMPOSITION FOR MARKING SUBSTRATES Ciba Holding Inc. (CH) 2008-10-22 EP disclosed
WO-2007088104-A1 COATING COMPOSITION FOR MARKING SUBSTRATES CIBA HOLDING INC. (CH) 2007-08-09 WO disclosed
US-6696219-B2 MULTILAYER FUJI PHOTO FILM CO., LTD. (JP) 2004-02-24 US disclosed
US-20020028409-A1 Positive resist laminate FUJI PHOTO FILM CO., LTD. 2002-03-07 US disclosed
US-5981752-A Tricyclic compounds having fungicidal activity, their preparation and their use SANKYO COMPANY, LIMITED (JP) 1999-11-09 US disclosed
US-5773618-A PYRROLOQUINOLINONE DERIVATIVES SANKYO COMPANY, LIMITED (JP) 1998-06-30 US disclosed
US-5489501-A MIXTURES OF TWO COORDINATION COMPOUNDS WHICH REACT TO FORM NEW COORDINATION COMPOUND WHILE CAUSING VISIBLE COLOR CHANGES RICOH COMPANY, LTD. (JP) 1996-02-06 US disclosed
US-5446011-A Imagewise coloring when heating; mixture of n-substituted indole, aromatic polyhydroxy compound, carbonyl compound and an acid RICOH COMPANY, LTD. (JP) 1995-08-29 US disclosed