SCHEMBL6562524

SCHEMBL6562524

Clc1ccc(C2=CCC(Cl)(c3ccccc3)C=C2)cc1

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 1/20 0.39
KDM1A O60341 1/20 0.36
RCOR1 Q9UKL0 1/20 0.36
GSK3B P49841 2/20 0.33
PSEN1 P49768 1/20 0.32
PSEN2 P49810 1/20 0.32
APH1B Q8WW43 1/20 0.32
NCSTN Q92542 1/20 0.32
APH1A Q96BI3 1/20 0.32
PSENEN Q9NZ42 1/20 0.32
GAA P10253 2/20 0.32
KDM4E B2RXH2 1/20 0.32
LMNA P02545 1/20 0.32
L3MBTL1 Q9Y468 1/20 0.32
TSHR P16473 1/20 0.31
NPC1 O15118 2/20 0.31
RAB9A P51151 2/20 0.31
KMT2A Q03164 2/20 0.31
MEN1 O00255 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30151522 0.81 CYP1A2 (0.37) CYP1A2KDM1ARCOR1PSEN1PSEN2
SCHEMBL21382151 0.76 KDM1A (0.35) KDM1ARCOR1KDM4EKMT2AOPRM1
SCHEMBL510772 0.75
SCHEMBL2769438 0.75 MEN1 (0.34) KMT2AMEN1
SCHEMBL2772216 0.74 HTT (0.33) CYP1A2NPC1RAB9AKMT2AMEN1
SCHEMBL7985533 0.72 ALDH1A1 (0.31)
SCHEMBL27715518 0.70 MAOB (0.31)
SCHEMBL27534066 0.70 OPRM1 (0.32) OPRM1OPRK1OPRL1
SCHEMBL28100042 0.70
SCHEMBL5579449 0.70 CYP1A2 (0.35) CYP1A2GSK3B

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1122746-B1 Composition for film formation and insulating film JSR CORP (JP) 2004-09-22 EP disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 EP disclosed