SCHEMBL6562734

SCHEMBL6562734

Fc1ccc(C2C=CC(F)(c3ccccc3)C=C2)cc1

nearest known ligand 0.34

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
MAOB P27338 8/20 0.33
MAOA P21397 4/20 0.33
KDM1A O60341 3/20 0.33
RCOR1 Q9UKL0 3/20 0.33
EPHX1 P07099 2/20 0.33
FADS1 O60427 1/20 0.33
ATM Q13315 1/20 0.32
NFE2L2 Q16236 1/20 0.31
POLB P06746 1/20 0.31
GAA P10253 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9814883 0.70 ALDH1A1 (0.38) EPHX1ATM
SCHEMBL1577842 0.70 HTR2A (0.41) MAOBMAOAKDM1A
SCHEMBL6496498 0.67 HTR2A (0.42) MAOBMAOAKDM1A
SCHEMBL7422826 0.67 HTR2A (0.38) MAOBMAOA
SCHEMBL746904 0.67 HTR2A (0.38) MAOBMAOA
SCHEMBL2188570 0.66 NPC1 (0.39) EPHX1ATMPOLBGAA
SCHEMBL11819974 0.66 KDM1A (0.34) MAOBMAOAKDM1A
SCHEMBL6562517 0.64 KDM1A (0.42) KDM1ARCOR1ATM
SCHEMBL1862793 0.64 ESR2 (0.39) POLB
SCHEMBL440482 0.64

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1122746-B1 Composition for film formation and insulating film JSR CORP (JP) 2004-09-22 EP disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 EP disclosed