Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.33 |
| ▸ | TSHR | P16473 | 1/20 | 0.33 |
| ▸ | CA4 | P22748 | 1/20 | 0.33 |
| ▸ | ESR1 | P03372 | 1/20 | 0.31 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.31 |
| ▸ | HDAC8 | Q9BY41 | 1/20 | 0.30 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.30 |
| ▸ | POLB | P06746 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL94036 | 0.81 | ALDH1A1 (0.36) | ALDH1A1TSHR | |
| SCHEMBL3012600 | 0.77 | ALDH1A1 (0.33) | ALDH1A1TSHR | |
| SCHEMBL143426 | 0.77 | ALDH1A1 (0.33) | ALDH1A1TSHRCA4ESR1ESR2 | |
| SCHEMBL294669 | 0.77 | ALDH1A1 (0.33) | ALDH1A1TSHRCA4ESR1ESR2 | |
| SCHEMBL6561434 | 0.77 | MEN1 (0.34) | ALDH1A1TSHR | |
| SCHEMBL336006 | 0.77 | ESR1 (0.32) | ALDH1A1TSHRESR1ESR2 | |
| SCHEMBL12302824 | 0.76 | ALDH1A1 (0.32) | ALDH1A1TSHR | |
| SCHEMBL3481365 | 0.76 | ALDH1A1 (0.32) | ALDH1A1TSHR | |
| SCHEMBL296744 | 0.76 | ALDH1A1 (0.32) | ALDH1A1TSHR | |
| SCHEMBL296246 | 0.76 | ESR1 (0.34) | ALDH1A1TSHRCA4ESR1ESR2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117844447-A | Thermosetting organic silicon die bond adhesive for LED, and preparation method and application thereof | 江苏诚睿达光电有限公司 | 2024-04-09 | — | — | CN | claimed |
| CN-110627974-A | High-heat-resistance phosphorus-silicon flame retardant, and preparation method and application thereof | 铨盛聚碳科技股份有限公司 | 2019-12-31 | — | — | CN | claimed |
| CN-117844447-A | Thermosetting organic silicon die bond adhesive for LED, and preparation method and application thereof | 江苏诚睿达光电有限公司 | 2024-04-09 | — | — | CN | disclosed |
| CN-116675819-A | Resin particle, connection material, and connection structure | 积水化学工业株式会社 | 2023-09-01 | — | — | CN | disclosed |
| CN-110088160-B | Resin particle, connection material, and connection structure | 积水化学工业株式会社 | 2023-06-13 | — | — | CN | disclosed |
| EP-3375808-B1 | PARTICLES, PARTICLE MATERIAL, CONNECTING MATERIAL, AND CONNECTION STRUCTURE | SEKISUI CHEMICAL CO LTD (JP) | 2022-12-21 | — | — | EP | disclosed |
| CN-115181223-A | Low-gloss matte auxiliary agent, preparation method thereof and formed body | 铨盛聚碳科技股份有限公司 | 2022-10-14 | — | — | CN | disclosed |
| CN-114085382-A | Hydrogen-containing poly titanium boron siloxane flame retardant, and preparation method and application thereof | 铨盛聚碳科技股份有限公司 | 2022-02-25 | — | — | CN | disclosed |
| CN-114068067-A | Metal-containing particle, connecting material, connecting structure and method for producing same, conduction test member, and conduction test device | 积水化学工业株式会社 | 2022-02-18 | — | — | CN | disclosed |
| CN-107709414-B | Particle, particle material, connecting material, and connecting structure | 积水化学工业株式会社 | 2021-12-28 | — | — | CN | disclosed |
| CN-111095441-B | Metal-containing particle, connecting material, connecting structure, method for producing connecting structure, member for conduction test, and conduction test device | 积水化学工业株式会社 | 2021-11-23 | — | — | CN | disclosed |
| WO-2013100166-A1 | METHOD OF PRODUCING AN ORGANIC SILICON COMPOUND | DOW CORNING TORAY CO., LTD. (JP) | 2013-07-04 | — | — | WO | disclosed |
| EP-1122746-B1 | Composition for film formation and insulating film | JSR CORP (JP) | 2004-09-22 | — | — | EP | disclosed |
| US-6468589-B2 | A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING | JSR CORPORATION (JP) | 2002-10-22 | — | — | US | disclosed |
| US-20010012870-A1 | Composition for film formation and insulating film | JSR CORPORATION (JP) | 2001-08-09 | — | — | US | disclosed |
| EP-1122746-A1 | Composition for film formation and insulating film | JSR Corporation (JP) | 2001-08-08 | — | — | EP | disclosed |
| US-5439746-A | Formed by coating or impregnating a reinforcement sheet and curing; mechanical strength; corrosion and heat resistance; electrical properties | KABUSHIKI KAISHA TOSHIBA (JP) | 1995-08-08 | — | — | US | disclosed |
| EP-0139234-B1 | RESIN COMPOSITION | KABUSHIKI KAISHA TOSHIBA (JP) | 1989-11-29 | — | — | EP | disclosed |
| US-4599155-A | POLYORTHOESTERS;SHRINKAGE INHIBITION;NONCRACKING;COATINGS | KABUSHIKI KAISHA TOSHIBA (JP) | 1986-07-08 | — | — | US | disclosed |
| EP-0139234-A2 | Resin composition | KABUSHIKI KAISHA TOSHIBA (JP) | 1985-05-02 | — | — | EP | disclosed |