SCHEMBL6564310

SCHEMBL6564310

C#C[Si](OC(C)=O)(OC(C)=O)c1ccccc1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CES2 O00748 1/20 0.36
CES1 P23141 1/20 0.36
ALDH1A1 P00352 4/20 0.36
MAPT P10636 2/20 0.35
HSD17B10 Q99714 3/20 0.34
PTGS2 P35354 2/20 0.34
TSHR P16473 2/20 0.34
NAPRT Q6XQN6 2/20 0.34
KDM4E B2RXH2 2/20 0.34
HPGD P15428 2/20 0.34
ELANE P08246 1/20 0.34
ESR1 P03372 1/20 0.34
ITGB3 P05106 1/20 0.34
ITGA2B P08514 1/20 0.34
HMGB1 P09429 1/20 0.34
GGT1 P19440 1/20 0.34
PTGS1 P23219 1/20 0.34
BLM P54132 1/20 0.34
TDP1 Q9NUW8 1/20 0.34
L3MBTL1 Q9Y468 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6562661 0.81 CES2 (0.36) CES2CES1ALDH1A1MAPTHSD17B10
SCHEMBL6564454 0.77 NPSR1 (0.39) ALDH1A1KDM4EHPGDL3MBTL1CYP3A4
SCHEMBL132933 0.74 CES2 (0.43) CES2CES1ALDH1A1MAPTHSD17B10
SCHEMBL6562663 0.74 CA4 (0.33) ESR1
SCHEMBL476126 0.74 CES2 (0.43) CES2CES1ALDH1A1MAPTHSD17B10
SCHEMBL132756 0.74 CES2 (0.43) CES2CES1ALDH1A1MAPTHSD17B10
SCHEMBL150540 0.72 MAPT (0.43) CES2CES1ALDH1A1MAPTHSD17B10
SCHEMBL475923 0.72 MAPT (0.43) CES2CES1ALDH1A1MAPTHSD17B10
SCHEMBL704476 0.72 CES2 (0.41) CES2CES1ALDH1A1MAPTHSD17B10
SCHEMBL475969 0.72 MAPT (0.43) CES2CES1ALDH1A1MAPTHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1122746-B1 Composition for film formation and insulating film JSR CORP (JP) 2004-09-22 EP disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 EP disclosed