SCHEMBL6564084

SCHEMBL6564084

[SiH3]OC(C#Cc1ccccc1)(C#Cc1ccccc1)c1ccccc1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
APP P05067 1/20 0.42
MAPT P10636 3/20 0.39
KCNN4 O15554 1/20 0.34
CYP1A2 P05177 2/20 0.33
CYP3A4 P08684 2/20 0.33
CYP2C9 P11712 2/20 0.33
CYP2C19 P33261 2/20 0.33
THPO P40225 1/20 0.33
BLM P54132 1/20 0.32
PMP22 Q01453 1/20 0.32
GRM5 P41594 1/20 0.32
NPC1 O15118 2/20 0.31
ALDH1A1 P00352 2/20 0.31
KDM4E B2RXH2 1/20 0.31
MEN1 O00255 1/20 0.31
HPGD P15428 1/20 0.31
KMT2A Q03164 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
HSD17B10 Q99714 1/20 0.31
MTOR P42345 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6563098 0.77 APP (0.48) APPMAPTCYP1A2CYP3A4CYP2C9
SCHEMBL5328907 0.74 MAPT (0.38) APPMAPTKCNN4NPC1ALDH1A1
SCHEMBL6564064 0.73 APP (0.44) APPMAPTCYP1A2CYP3A4CYP2C9
SCHEMBL6562950 0.72 TSHR (0.39) KCNN4ALDH1A1MAPK1TSHR
SCHEMBL6564437 0.72 APP (0.38) APPMAPTKCNN4CYP1A2CYP3A4
SCHEMBL6562532 0.71 MAPT (0.41) APPMAPTCYP1A2CYP3A4CYP2C9
SCHEMBL6562542 0.69 KCNN4 (0.37) APPMAPTKCNN4CYP1A2NPC1
SCHEMBL6562626 0.69 MAPT (0.40) APPMAPTCYP1A2CYP3A4CYP2C9
SCHEMBL3120848 0.68 APP (0.48) APPMAPTKCNN4CYP1A2CYP3A4
SCHEMBL14840154 0.68 APP (0.48) APPMAPTKCNN4CYP1A2CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1122746-B1 Composition for film formation and insulating film JSR CORP (JP) 2004-09-22 EP disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 EP disclosed