SCHEMBL6566833

SCHEMBL6566833

CCC(CC)ONC(C)=O

nearest known ligand 0.33

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.32
USP2 O75604 1/20 0.31
TSHR P16473 1/20 0.31
CTSK P43235 1/20 0.31
LMNA P02545 1/20 0.31
HSD17B10 Q99714 1/20 0.31
CRBN Q96SW2 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15131250 0.80 PRKCA (0.32) ALDH1A1CRBN
SCHEMBL23709473 0.78 CYP2C9 (0.41) USP2TSHRCTSK
SCHEMBL19821897 0.78
SCHEMBL28142432 0.74
SCHEMBL27761929 0.73 ALOX15 (0.37)
Hydrochloric Acid SCHEMBL27557442 0.72 ALOX15 (0.40)
SCHEMBL1561818 0.70
SCHEMBL305036 0.69 CTSK (0.40) ALDH1A1USP2TSHRCTSKHSD17B10
SCHEMBL15296654 0.68
SCHEMBL9784727 0.68

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117337314-A Acid dianhydride 三菱瓦斯化学株式会社 2024-01-02 CN disclosed
CN-116096784-B Bisimide phenol compounds 三菱瓦斯化学株式会社 2023-08-15 CN disclosed
CN-116096784-A Bisimide phenol compounds 三菱瓦斯化学株式会社 2023-05-09 CN disclosed
CN-111788176-A Compound, resin, composition, and film-forming material for lithography using same 三菱瓦斯化学株式会社 2020-10-16 CN disclosed
EP-0875906-B1 Electronic part and process for manufacturing the same JSR CORP (JP) 2004-04-07 EP disclosed
US-6084053-A AS STRUCTURAL COMPONENT, A DIELECTRIC POLYIMIDE MATERIAL HAVING AT LEAST ONE FLUORENE-CONTAINING STRUCTURAL UNIT; APPLYING POLYIMIDE SOLUTION TO SUBSTRATE, AND DRYING TO FORM THE DIELECTRIC; HEAT RESISTANCE, LOW DIELECTRIC CONSTANT JSR CORPORATION (JP) 2000-07-04 US disclosed
EP-0875906-A2 Electronic part and process for manufacturing the same JSR Corporation (JP) 1998-11-04 EP disclosed