SCHEMBL662597

SCHEMBL662597

C=Cc1ccc(O)cc1F

nearest known ligand 0.53

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
MIF P14174 1/20 0.53
ESR1 P03372 14/20 0.49
ESR2 Q92731 13/20 0.49
SIRT1 Q96EB6 1/20 0.44
ESRRB O95718 1/20 0.43
ESRRA P11474 1/20 0.43
TTR P02766 1/20 0.40
MAPT P10636 1/20 0.37
TSHR P16473 1/20 0.37
HTT P42858 1/20 0.37
HSD17B10 Q99714 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19798041 0.82 ESR2 (0.45) MIFESR1ESR2ESRRBESRRA
SCHEMBL189018 0.77 MIF (0.58) MIFESR1ESR2SIRT1TTR
SCHEMBL18664018 0.77 MIF (0.53) MIFESR1ESR2SIRT1TTR
SCHEMBL319771 0.76 NFE2L2 (0.54) MAPT
SCHEMBL29413981 0.76 NFE2L2 (0.54) MAPT
SCHEMBL29420732 0.76 TYR (0.52) ESR1ESR2ESRRBESRRATTR
SCHEMBL686136 0.76 TYR (0.52) ESR1ESR2ESRRBESRRATTR
SCHEMBL11725687 0.74 ALDH1A1 (0.46) ESR1ESR2MAPTTSHR
SCHEMBL10780595 0.74 MIF (0.50) MIFESR1ESR2SIRT1TTR
SCHEMBL10780596 0.74 MIF (0.50) MIFESR1ESR2SIRT1TTR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 73 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118909356-A Preparation process of EVA integrated foaming hot-press forming tray 东莞市百盈塑料制品有限公司 2024-11-08 CN claimed
CN-114709406-B Sulfur-rich copolymer material, lithium sulfur battery positive electrode material, and preparation methods and applications thereof 中国电建集团成都勘测设计研究院有限公司 2023-07-25 CN claimed
CN-114709406-A Sulfur-rich copolymer material, lithium-sulfur battery positive electrode material, and preparation methods and applications thereof 中国电建集团成都勘测设计研究院有限公司 2022-07-05 CN claimed
US-8822619-B1 Directed self assembly copolymer composition and related methods ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2014-09-02 US claimed
US-20140227445-A1 Directed self assembly copolymer composition and related methods ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2014-08-14 US claimed
EP-2958562-B1 ANTIDIABETIC BICYCLIC COMPOUNDS MERCK SHARP & DOHME LLC (US) 2025-09-10 EP disclosed
EP-4560309-A1 SEQUENCE ANALYZING METHOD, SEQUENCE ANALYZING DEVICE, POLYMERIZATION CONDITION PROPOSING DEVICE, AND AUTOMATIC SYNTHESIZING DEVICE National Institute for Materials Science (JP) 2025-05-28 EP disclosed
WO-2025033010-A1 COMPOSITION ESTIMATION METHOD, COMPOSITION ESTIMATION DEVICE, PROGRAM, SAMPLE CONTAINER, AND THERMOGRAVIMETRY/MASS SPECTROMETRY METHOD 国立研究開発法人物質・材料研究機構 2025-02-13 WO disclosed
CN-118909356-A Preparation process of EVA integrated foaming hot-press forming tray 东莞市百盈塑料制品有限公司 2024-11-08 CN disclosed
CN-118909356-A Preparation process of EVA integrated foaming hot-press forming tray 东莞市百盈塑料制品有限公司 2024-11-08 CN disclosed
WO-2024018725-A1 SEQUENCE ANALYZING METHOD, SEQUENCE ANALYZING DEVICE, POLYMERIZATION CONDITION PROPOSING DEVICE, AND AUTOMATIC SYNTHESIZING DEVICE 国立研究開発法人物質・材料研究機構 2024-01-25 WO disclosed
US-20230305398-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-28 US disclosed
US-8304493-B2 Methods of forming block copolymers MICRON TECHNOLOGY, INC. (US) 2012-11-06 US disclosed
CN-101186678-B Acid-degradable resin compositions containing ketene-aldehyde copolymer NIPPON SODA CO 2012-05-23 CN disclosed
US-20120046415-A1 METHODS OF FORMING BLOCK COPOLYMERS, METHODS OF FORMING A SELF-ASSEMBLED BLOCK COPOLYMER STRUCTURE AND RELATED COMPOSITIONS MICRON TECHNOLOGY, INC. (US) 2012-02-23 US disclosed
US-7416821-B2 Thermally cured undercoat for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2008-08-26 US disclosed
CN-101186678-A Acid-degradable resin compositions containing ketene-aldehyde copolymer NIPPON SODA CO (JP) 2008-05-28 CN disclosed
EP-1743363-A2 THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION FujiFilm Electronic Materials USA, Inc. (US) 2007-01-17 EP disclosed
US-20050238997-A1 Thermally cured undercoat for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. 2005-10-27 US disclosed
WO-2005089150-A2 THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS USA INC. (US) 2005-09-29 WO disclosed