SCHEMBL6656488

SCHEMBL6656488

O=C([O-])C(F)(F)C(F)(F)F.c1ccc([S+](c2ccccc2)c2ccccc2)cc1

nearest known ligand 0.37

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPK1 P28482 1/20 0.37
CES1 P23141 3/20 0.36
CA2 P00918 1/20 0.34
CA4 P22748 1/20 0.34
PDK1 Q15118 2/20 0.33
PDK2 Q15119 2/20 0.33
PDK3 Q15120 2/20 0.33
PDK4 Q16654 2/20 0.33
PTPN1 P18031 1/20 0.31
HSD11B1 P28845 1/20 0.31
MEN1 O00255 1/20 0.31
MAPT P10636 1/20 0.31
HTT P42858 1/20 0.31
RAB9A P51151 1/20 0.31
KMT2A Q03164 1/20 0.31
HDAC3 O15379 1/20 0.31
HDAC4 P56524 1/20 0.31
HDAC1 Q13547 1/20 0.31
HDAC7 Q8WUI4 1/20 0.31
HDAC2 Q92769 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4964687 0.92 CES1 (0.39) MAPK1CES1CA2CA4PTPN1
SCHEMBL545780 0.89 CES1 (0.34) MAPK1CES1CA2CA4PDK1
SCHEMBL29745841 0.89 CES1 (0.34) MAPK1CES1CA2CA4PDK1
SCHEMBL1573975 0.87 THRB (0.39) MAPK1CES1CA2CA4HDAC3
SCHEMBL29746113 0.87 THRB (0.39) MAPK1CES1CA2CA4HDAC3
SCHEMBL4962904 0.87 HDAC1 (0.40) CES1CA2CA4PTPN1HDAC3
SCHEMBL4962900 0.86 THRB (0.42) CES1CA2HDAC3HDAC4HDAC1
SCHEMBL4962460 0.86 THRB (0.42) CES1CA2HDAC3HDAC4HDAC1
SCHEMBL4962222 0.86 THRB (0.42) CES1CA2HDAC3HDAC4HDAC1
SCHEMBL4962404 0.86 THRB (0.42) CES1CA2HDAC3HDAC4HDAC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1434091-A1 CHEMICAL-AMPLIFICATION-TYPE POSITIVE RADIATION-SENSITIVE RESIN COMPOSITION Clariant International Ltd. (CH) 2004-06-30 EP disclosed
US-20040033438-A1 Chemical-amplication-type positive radiation-sensitive resin composition AZ ELECTRONIC MATERIALS USA CORP. 2004-02-19 US disclosed