SCHEMBL667354

SCHEMBL667354

C=C[Si](C=C)(C=C)O[Si](C=C)(c1ccccc1)c1ccccc1

nearest known ligand 0.32

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.32
TSHR P16473 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL569492 0.89 ALDH1A1 (0.36) ALDH1A1TSHR
SCHEMBL6890056 0.86 ALDH1A1 (0.35) ALDH1A1TSHR
SCHEMBL3481735 0.84 ALDH1A1 (0.33) ALDH1A1TSHR
SCHEMBL9901171 0.84 ALDH1A1 (0.33) ALDH1A1TSHR
SCHEMBL841999 0.83 ALDH1A1 (0.32) ALDH1A1TSHR
SCHEMBL3482271 0.81 ALDH1A1 (0.31) ALDH1A1TSHR
SCHEMBL3481880 0.81 ALDH1A1 (0.31) ALDH1A1TSHR
SCHEMBL6910505 0.81 ALDH1A1 (0.31) ALDH1A1TSHR
SCHEMBL2600703 0.81 ESR1 (0.33) ALDH1A1TSHR
SCHEMBL3481638 0.80 ALDH1A1 (0.33) ALDH1A1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 67 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12521919-B2 Anisotropic film and method for manufacturing anisotropic film SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-01-13 US disclosed
US-20240286321-A1 ANISOTROPIC FILM AND METHOD FOR MANUFACTURING ANISOTROPIC FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-08-29 US disclosed
CN-111205788-B Anisotropic film and method for producing anisotropic film 信越化学工业株式会社 2024-06-07 CN disclosed
EP-2626898-B1 Sealant laminated composite and method for sealing a semiconductor devices mounting substrate using the sealant laminated composite SHINETSU CHEMICAL CO (JP) 2021-05-19 EP disclosed
EP-2469590-B1 Fiber-containing resin substrate for sealing semiconductor devices or a wafer and a method of sealing a semiconductor apparatus using a fiber-containing resin substrate SHINETSU CHEMICAL CO (JP) 2020-08-12 EP disclosed
CN-111205788-A Anisotropic film and method for producing anisotropic film 信越化学工业株式会社 2020-05-29 CN disclosed
US-20200156291-A1 ANISOTROPIC FILM AND METHOD FOR MANUFACTURING ANISOTROPIC FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-05-21 US disclosed
EP-3024021-B1 METHOD FOR MANUFACTURING A SEMICONDUCTOR APPARATUS SHINETSU CHEMICAL CO (JP) 2020-03-25 EP disclosed
CN-104851826-B Vacuum laminating apparatus and method for manufacturing semiconductor device 信越化学工业株式会社 2020-02-21 CN disclosed
US-10242924-B2 Base-attached encapsulant for semiconductor encapsulation, semiconductor apparatus SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-03-26 US disclosed
WO-2008140761-A2 BRANCHED POLYSILOXANE OF REDUCED MOLECULAR WEIGHT AND VISCOSITY MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2008-11-20 WO disclosed
US-20080276836-A1 Composition containing anti-misting component of reduced molecular weight and viscosity MOMENTIVE PERFORMANCE MATERIALS INC. 2008-11-13 US disclosed
US-20080281055-A1 Branched polysiloxane of reduced molecular weight and viscosity MOMENTIVE PERFORMANCE MATERIALS INC. 2008-11-13 US disclosed
WO-2008027497-A2 BRANCHED POLYSILOXANE COMPOSITION MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2008-03-06 WO disclosed
US-20080058479-A1 Composition containing anti-misting component GENERAL ELECTRIC COMPANY (US) 2008-03-06 US disclosed
US-20080058491-A1 Branched polysiloxane composition GENERAL ELECTRIC COMPANY (US) 2008-03-06 US disclosed
WO-2008027494-A2 COMPOSITION CONTAINING ANTI-MISTING COMPONENT MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2008-03-06 WO disclosed
EP-0761761-B1 Microparticle catalysts for hydrosilylation reactions and thermosetting silicone compositions containing said catalyst DOW CORNING TORAY SILICONE (JP) 2002-02-06 EP disclosed
US-5789334-A PLATINUM CATALYST, DISILOXANE, STORAGE STABILITY, DIMETHYLDIVINYLDIPHENYLDISILOXANE DOW CORNING TORAY SILICONE CO., LTD. (JP) 1998-08-04 US disclosed
EP-0761761-A1 Microparticle catalysts for hydrosilylation reactions and thermosetting silicone compositions containing said catalyst Dow Corning Toray Silicone Company Ltd. (JP) 1997-03-12 EP disclosed