Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL94036 | 0.87 | ALDH1A1 (0.36) | ALDH1A1TSHR | |
| SCHEMBL569492 | 0.87 | ALDH1A1 (0.36) | ALDH1A1TSHR | |
| SCHEMBL6890056 | 0.85 | ALDH1A1 (0.35) | ALDH1A1TSHR | |
| SCHEMBL9901171 | 0.83 | ALDH1A1 (0.33) | ALDH1A1TSHR | |
| SCHEMBL296744 | 0.81 | ALDH1A1 (0.32) | ALDH1A1TSHR | |
| SCHEMBL841999 | 0.81 | ALDH1A1 (0.32) | ALDH1A1TSHR | |
| SCHEMBL3481365 | 0.81 | ALDH1A1 (0.32) | ALDH1A1TSHR | |
| SCHEMBL667354 | 0.81 | ALDH1A1 (0.32) | ALDH1A1TSHR | |
| SCHEMBL12302824 | 0.81 | ALDH1A1 (0.32) | ALDH1A1TSHR | |
| SCHEMBL2600703 | 0.79 | ESR1 (0.33) | ALDH1A1TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109661435-B | Curable resin composition, cured product thereof, and semiconductor device | 日亚化学工业株式会社 | 2022-04-12 | — | — | CN | disclosed |
| US-10947384-B2 | Curable resin composition, cured product thereof, and semiconductor device | DAICEL CORPORATION (JP) | 2021-03-16 | — | — | US | disclosed |
| CN-110177841-A | Hardening resin composition, its solidfied material and semiconductor device | 株式会社大赛璐 | 2019-08-27 | — | — | CN | disclosed |
| US-20190218346-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND SEMICONDUCTOR DEVICE | DAICEL CORPORATION (JP) | 2019-07-18 | — | — | US | disclosed |
| CN-109661435-A | Hardening resin composition, its solidfied material and semiconductor device | 株式会社大赛璐 | 2019-04-19 | — | — | CN | disclosed |
| EP-2057239-B1 | BRANCHED POLYSILOXANE COMPOSITION | MOMENTIVE PERFORMANCE MAT INC (US) | 2015-03-04 | — | — | EP | disclosed |
| EP-2057238-B1 | COMPOSITION CONTAINING ANTI-MISTING COMPONENT | MOMENTIVE PERFORMANCE MAT INC (US) | 2012-10-10 | — | — | EP | disclosed |
| US-7649071-B2 | Branched polysiloxane composition | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2010-01-19 | — | — | US | disclosed |
| US-7560167-B2 | branched polysiloxane component; paper release coating; high-speed coating processes | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2009-07-14 | — | — | US | disclosed |
| EP-2057239-A2 | BRANCHED POLYSILOXANE COMPOSITION | Momentive Performance Materials Inc. (US) | 2009-05-13 | — | — | EP | disclosed |
| EP-2057238-A2 | COMPOSITION CONTAINING ANTI-MISTING COMPONENT | Momentive Performance Materials Inc. (US) | 2009-05-13 | — | — | EP | disclosed |
| US-20080276836-A1 | Composition containing anti-misting component of reduced molecular weight and viscosity | MOMENTIVE PERFORMANCE MATERIALS INC. | 2008-11-13 | — | — | US | disclosed |
| US-20080281055-A1 | Branched polysiloxane of reduced molecular weight and viscosity | MOMENTIVE PERFORMANCE MATERIALS INC. | 2008-11-13 | — | — | US | disclosed |
| WO-2008027497-A2 | BRANCHED POLYSILOXANE COMPOSITION | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2008-03-06 | — | — | WO | disclosed |
| US-20080058479-A1 | Composition containing anti-misting component | GENERAL ELECTRIC COMPANY (US) | 2008-03-06 | — | — | US | disclosed |
| WO-2008027494-A2 | COMPOSITION CONTAINING ANTI-MISTING COMPONENT | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2008-03-06 | — | — | WO | disclosed |
| US-20080058491-A1 | Branched polysiloxane composition | GENERAL ELECTRIC COMPANY (US) | 2008-03-06 | — | — | US | disclosed |