Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6910505 | 0.98 | ALDH1A1 (0.31) | ALDH1A1TSHR | |
| SCHEMBL569492 | 0.89 | ALDH1A1 (0.36) | ALDH1A1TSHR | |
| SCHEMBL6890056 | 0.86 | ALDH1A1 (0.35) | ALDH1A1TSHR | |
| SCHEMBL9901171 | 0.84 | ALDH1A1 (0.33) | ALDH1A1TSHR | |
| SCHEMBL667354 | 0.83 | ALDH1A1 (0.32) | ALDH1A1TSHR | |
| SCHEMBL2600703 | 0.81 | ESR1 (0.33) | ALDH1A1TSHR | |
| SCHEMBL3481880 | 0.81 | ALDH1A1 (0.31) | ALDH1A1TSHR | |
| SCHEMBL3482271 | 0.81 | ALDH1A1 (0.31) | ALDH1A1TSHR | |
| SCHEMBL3481638 | 0.80 | ALDH1A1 (0.33) | ALDH1A1TSHR | |
| SCHEMBL1147931 | 0.79 | ESR1 (0.32) | ALDH1A1TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109661435-B | Curable resin composition, cured product thereof, and semiconductor device | 日亚化学工业株式会社 | 2022-04-12 | — | — | CN | disclosed |
| US-10947384-B2 | Curable resin composition, cured product thereof, and semiconductor device | DAICEL CORPORATION (JP) | 2021-03-16 | — | — | US | disclosed |
| US-20190218346-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND SEMICONDUCTOR DEVICE | DAICEL CORPORATION (JP) | 2019-07-18 | — | — | US | disclosed |
| EP-2599836-B1 | CURABLE COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | ADEKA CORP (JP) | 2015-03-25 | — | — | EP | disclosed |
| EP-2057239-B1 | BRANCHED POLYSILOXANE COMPOSITION | MOMENTIVE PERFORMANCE MAT INC (US) | 2015-03-04 | — | — | EP | disclosed |
| US-8637627-B2 | Phenoxyphenyl polysiloxane composition and method for making and using same | ROHM AND HAAS COMPANY (US) | 2014-01-28 | — | — | US | disclosed |
| US-8470937-B2 | Curable composition for semiconductor encapsulation | ADEKA CORPORATION (JP) | 2013-06-25 | — | — | US | disclosed |
| EP-2599836-A1 | CURABLE COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | Adeka Corporation (JP) | 2013-06-05 | — | — | EP | disclosed |
| EP-2057238-B1 | COMPOSITION CONTAINING ANTI-MISTING COMPONENT | MOMENTIVE PERFORMANCE MAT INC (US) | 2012-10-10 | — | — | EP | disclosed |
| US-20120126435-A1 | CURABLE COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | ADEKA CORPORATION (JP) | 2012-05-24 | — | — | US | disclosed |
| EP-1914262-A1 | Heat stable aryl polysiloxane compositions | Rohm and Haas Company (US) | 2008-04-23 | — | — | EP | disclosed |
| US-20080090986-A1 | Cured; encapsulated semiconductors; alkylene bridged aryl polysiloxane and hydrosilation catalysts; heating, aging; discoloration inhibition | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2008-04-17 | — | — | US | disclosed |
| WO-2008027497-A2 | BRANCHED POLYSILOXANE COMPOSITION | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2008-03-06 | — | — | WO | disclosed |
| US-20080058479-A1 | Composition containing anti-misting component | GENERAL ELECTRIC COMPANY (US) | 2008-03-06 | — | — | US | disclosed |
| US-20080058491-A1 | Branched polysiloxane composition | GENERAL ELECTRIC COMPANY (US) | 2008-03-06 | — | — | US | disclosed |
| WO-2008027494-A2 | COMPOSITION CONTAINING ANTI-MISTING COMPONENT | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2008-03-06 | — | — | WO | disclosed |
| US-7335708-B2 | Addition cross-linking two-component silicone materials with a high Shore D hardness | KETTENBACH GMBH & CO. KG (DE) | 2008-02-26 | — | — | US | disclosed |
| US-6774200-B2 | HEAT-RESISTANCE | NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) | 2004-08-10 | — | — | US | disclosed |
| EP-1247838-A2 | Silsesquioxane polymer molding and method of preparing same | National Institute of Advanced Industrial Science and Technology (JP) | 2002-10-09 | — | — | EP | disclosed |
| US-20020143132-A1 | Silsesquioxane polymer molding and method of preparing same | NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY | 2002-10-03 | — | — | US | disclosed |