SCHEMBL6684643

SCHEMBL6684643

C=CCN(CC=C)C(=O)O[Si](CC=C)(CC=C)CC=C

nearest known ligand 0.41

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.41
SMN1; SMN2 Q16637 1/20 0.32
MAPT P10636 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7591793 0.72 ALDH1A1 (0.35) ALDH1A1MAPT
SCHEMBL4199211 0.70 ALDH1A1 (0.46) ALDH1A1SMN1; SMN2MAPT
SCHEMBL18553102 0.70 ALDH1A1 (0.46) ALDH1A1SMN1; SMN2MAPT
SCHEMBL10645801 0.70 ALDH1A1 (0.46) ALDH1A1SMN1; SMN2MAPT
SCHEMBL547108 0.70 TSHR (0.38) ALDH1A1SMN1; SMN2MAPT
SCHEMBL9487264 0.70 ALDH1A1 (0.46) ALDH1A1SMN1; SMN2MAPT
SCHEMBL16144123 0.70 ALDH1A1 (0.46) ALDH1A1SMN1; SMN2MAPT
SCHEMBL9762149 0.70 ALDH1A1 (0.46) ALDH1A1SMN1; SMN2MAPT
SCHEMBL4563189 0.70 ALDH1A1 (0.32) ALDH1A1MAPT
SCHEMBL1683063 0.68 ALDH1A1 (0.45) ALDH1A1SMN1; SMN2MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1266903-B1 Method of preparing an organosilicon compound DOW CORNING ASIA LTD (JP) 2004-09-29 EP claimed
EP-1266903-A1 Method of preparing an organosilicon compound DOW CORNING ASIA, Ltd. (JP) 2002-12-18 EP claimed
US-6326506-B1 HYDROSILATION DOW CORNING ASIA, LTD. (JP) 2001-12-04 US claimed
EP-1266903-B1 Method of preparing an organosilicon compound DOW CORNING ASIA LTD (JP) 2004-09-29 EP disclosed
EP-1266903-A1 Method of preparing an organosilicon compound DOW CORNING ASIA, Ltd. (JP) 2002-12-18 EP disclosed
US-6326506-B1 HYDROSILATION DOW CORNING ASIA, LTD. (JP) 2001-12-04 US disclosed