SCHEMBL6704874

SCHEMBL6704874

Nc1ccc(OC2=CC=CC(Oc3ccc(N)cc3)(c3ccccc3)C2)cc1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAOA P21397 3/20 0.41
MEN1 O00255 4/20 0.36
KMT2A Q03164 4/20 0.36
RAB9A P51151 2/20 0.36
NPC1 O15118 1/20 0.36
NLRP3 Q96P20 1/20 0.36
ALDH1A1 P00352 3/20 0.34
CYP3A4 P08684 1/20 0.34
TSHR P16473 1/20 0.34
TDP1 Q9NUW8 1/20 0.34
NCOA1 Q15788 1/20 0.34
NCOA3 Q9Y6Q9 1/20 0.34
KDM1A O60341 1/20 0.33
MAPT P10636 4/20 0.33
GAA P10253 2/20 0.33
SMN1; SMN2 Q16637 2/20 0.33
MITF O75030 1/20 0.33
GFER P55789 1/20 0.33
NLRP1 Q9C000 1/20 0.33
NOD2 Q9HC29 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9842810 0.90 LTA4H (0.33) TSHR
SCHEMBL28213823 0.74 MAOA (0.38) MAOAMEN1KMT2ARAB9ANPC1
SCHEMBL29757199 0.73 PARP10 (0.36) MAOAALDH1A1CYP3A4TSHRTDP1
SCHEMBL31676705 0.71 ALDH1A1 (0.35) MAOAMEN1KMT2AALDH1A1CYP3A4
SCHEMBL534636 0.70 MAOA (0.41) MAOAMEN1KMT2ARAB9ANPC1
SCHEMBL30835358 0.69 MEN1 (0.46) MAOAMEN1KMT2ARAB9ANPC1
SCHEMBL11825562 0.68 AKR1C3 (0.34) MEN1KMT2ANPC1TSHRNCOA1
SCHEMBL31412836 0.62
SCHEMBL554324 0.62 MAOA (1.00) MAOAMEN1KMT2ARAB9ANPC1
Diphenylether SCHEMBL28089995 0.62 MAOA (1.00) MAOAMEN1KMT2ARAB9ANPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11015018-B2 Resin composition and method for manufacturing thermally conductive material INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2021-05-25 US disclosed
US-20190211138-A1 RESIN COMPOSITION AND METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE MATERIAL INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2019-07-11 US disclosed
US-20040229969-A1 Foamed polyimide shaped article and process for production of same UBE INDUSTRIES, LTD., A JAPANESE CORPORATION (JP) 2004-11-18 US disclosed
EP-1471106-A1 Foamed polyimide shaped article and process for production of same Ube Industries, Ltd. (JP) 2004-10-27 EP disclosed
US-6320019-B1 REACTING A TETRACARBOXYLIC DIANHYDRIDE, AN AROMATIC DIAMINE, A DIAMINE WITH A SILOXANE STRUCTURE, AND AN AROMATIC TRI- OR TETRAAMINE WITH TWO PHENYL GROUPS SAEHAN INDUSTRIES INCORPORATION (KR) 2001-11-20 US disclosed
US-5736592-A Process for intramolecularly condensing a non-linear optical polyamic acid composition ENICHEM S.P.A. (IT) 1998-04-07 US disclosed
US-5688906-A Highly efficient nonlinear optical polyimides ENICHEM S.P.A. (IT) 1997-11-18 US disclosed
EP-0727692-A2 Process for intramolecularly condensing a non-linear optical polyamic acid composition ENICHEM S.p.A. (IT) 1996-08-21 EP disclosed
EP-0647874-A1 Highly efficient nonlinear optical polyimides ENICHEM S.p.A. (IT) 1995-04-12 EP disclosed