SCHEMBL672623

SCHEMBL672623

Cc1cn(CCC#N)cn1

nearest known ligand 0.50

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
QPCT Q16769 10/20 0.39
ALPL P05186 2/20 0.39
PLAA Q9Y263 1/20 0.39
ALPG P10696 1/20 0.38
KDM4E B2RXH2 1/20 0.38
HIF1A Q16665 1/20 0.38
NPSR1 Q6W5P4 1/20 0.38
CSNK2A1 P68400 1/20 0.37
ALDH1A1 P00352 1/20 0.36
MEN1 O00255 1/20 0.35
KMT2A Q03164 1/20 0.35
GAA P10253 1/20 0.35
TSHR P16473 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17479549 0.80
SCHEMBL7208329 0.77 CSNK2A1 (0.37) CSNK2A1ALDH1A1MEN1KMT2ATSHR
SCHEMBL28089203 0.75 ALPL (0.35) QPCTALPLPLAAALPGTSHR
SCHEMBL24496205 0.74
SCHEMBL2937569 0.74
Bromide SCHEMBL6375209 0.72 ALPL (0.41) QPCTALPLPLAAALPGTSHR
SCHEMBL634200 0.72 CYP1A2 (0.45) QPCTALPLPLAAALDH1A1KMT2A
SCHEMBL18516697 0.71 KDM5A (0.46) QPCTALPLPLAAALPG
SCHEMBL12608285 0.71 MEN1 (0.41) QPCTALPLPLAAALPGMEN1
SCHEMBL8591843 0.71 TBXAS1 (0.44) QPCTALPLPLAAALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 144 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118206718-A Core-shell material and preparation method thereof 华为技术有限公司 2024-06-18 CN claimed
CN-117946494-A Epoxy plastic packaging material for packaging discrete devices and application thereof 江苏中科科化新材料股份有限公司 2024-04-30 CN claimed
CN-110791052-B High-reliability epoxy resin composition and application thereof 昆山兴凯半导体材料有限公司 2023-07-07 CN claimed
CN-115637020-A Hyperbranched epoxy resin thermosetting resin composition and application thereof 复旦大学 2023-01-24 CN claimed
CN-108384195-B Nickel-to-epoxy resin composition with high adhesion and application thereof 长兴电子材料(昆山)有限公司 2020-06-30 CN claimed
CN-108485185-B High-reliability high-fluidity epoxy resin composition for vehicles and application thereof 长兴电子材料(昆山)有限公司 2020-06-30 CN claimed
CN-111153631-A High-thermal-conductivity and high-reliability epoxy resin composition and application thereof 长兴电子材料(昆山)有限公司 2020-05-15 CN claimed
CN-110791052-A High-reliability epoxy resin composition and application thereof 长兴电子材料(昆山)有限公司 2020-02-14 CN claimed
US-10465037-B2 High heat monomers and methods of use thereof SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2019-11-05 US claimed
US-20170158806-A1 HIGH HEAT MONOMERS AND METHODS OF USE THEREOF SHPP GLOBAL TECHNOLOGIES B.V. (NL) 2017-06-08 US claimed
CN-102352090-B Flame retarded epoxy resin composite material CHANGXING ELECTRONIC MATERIAL KUNSHAN CO LTD 2013-04-03 CN claimed
CN-102352090-A Flame retarded epoxy resin composite material CHANGXING ELECTRONIC MATERIAL KUNSHAN CO LTD 2012-02-15 CN claimed
CN-100398592-C Flame retardant, flame-retardant resin composition containing same and use thereof ETERNAL CHEMICAL INDUSTRY CO LTD (CN) 2008-07-02 CN claimed
CN-1865329-A Flame retardant, flame-retardant resin composition containing same and use thereof ETERNAL CHEMICAL INDUSTRY CO LTD (CN) 2006-11-22 CN claimed
CN-120040432-A Triazine benzene compound, composition, condensate and preparation method and application thereof 北京化工大学 2025-05-27 CN disclosed
CN-119613351-A Triazine biphenyl compound, composition, condensate, preparation method and application thereof 北京化工大学 2025-03-14 CN disclosed
CN-118475639-A Capped poly (phenylene ether) s and curable thermoset compositions containing the same 高新特殊工程塑料全球技术有限公司 2024-08-09 CN disclosed
WO-2000005045-A1 ROTARY TROWEL FOR USE IN THE MOLDING OF CERAMICS AND METHOD FOR PRODUCTION THEREOF VANTICO AG (CH) 2000-02-03 WO disclosed
EP-0947532-A1 Epoxy resin composition for printed circuit board and printed circuit board using the same HITACHI CHEMICAL COMPANY, LTD. (JP) 1999-10-06 EP disclosed
US-5747557-A MIXING UNDER SHEAR FORCE; UNIFORM DISPERSION KABUSHIKI KAISHA TOSHIBA (JP) 1998-05-05 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20170158806-A1 HIGH HEAT MONOMERS AND METHODS OF USE THEREOF HSP90AA1, HSP90AB1, EPHX2 QPCT 3093/4885ALPL 1832/4885PLAA 1956/4885
US-10465037-B2 High heat monomers and methods of use thereof HSP90AA1, HSP90AB2P, HSP90AB1 QPCT 3036/4885ALPL 1735/4885PLAA 2029/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.