SCHEMBL673373

SCHEMBL673373

Cc1cc(-c2cc(-c3cc(C)c(O)c(C)c3)cc(-c3cc(C)c(O)c(C)c3)c2)cc(C)c1O

nearest known ligand 0.93

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA1 P00915 3/20 0.93
CA2 P00918 3/20 0.93
CYP1A2 P05177 2/20 0.56
CYP2C9 P11712 2/20 0.56
CYP2C19 P33261 1/20 0.56
ESR1 P03372 2/20 0.46
ESR2 Q92731 1/20 0.46
ALDH1A1 P00352 3/20 0.45
CYP3A4 P08684 2/20 0.45
TP53 P04637 1/20 0.45
TSHR P16473 1/20 0.45
TDP1 Q9NUW8 1/20 0.45
GAA P10253 2/20 0.42
KDM4E B2RXH2 2/20 0.42
LMNA P02545 2/20 0.42
MAPT P10636 2/20 0.42
PTGS1 P23219 3/20 0.41
PTGS2 P35354 3/20 0.41
ALOX5 P09917 2/20 0.41
MEN1 O00255 2/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22804025 0.97 CA1 (1.00) CA1CA2CYP1A2CYP2C9CYP2C19
SCHEMBL220910 0.97 CA1 (1.00) CA1CA2CYP1A2CYP2C9CYP2C19
Methane SCHEMBL28825813 0.93 CA1 (0.93) CA1CA2CYP1A2CYP2C9CYP2C19
SCHEMBL17060490 0.88 CA1 (0.82) CA1CA2CYP1A2CYP2C9CYP2C19
SCHEMBL16581476 0.87 CA1 (0.70) CA1CA2CYP1A2CYP2C9CYP2C19
SCHEMBL19126271 0.85 CA1 (0.78) CA1CA2CYP1A2CYP2C9CYP2C19
SCHEMBL9229319 0.85 CA2 (0.78) CA1CA2CYP1A2CYP2C9CYP2C19
SCHEMBL726588 0.83 CA1 (0.74) CA1CA2CYP1A2CYP2C9CYP2C19
SCHEMBL16790391 0.83 CA1 (0.74) CA1CA2CYP1A2CYP2C9CYP2C19
SCHEMBL278774 0.81 CA1 (0.70) CA1CA2CYP1A2CYP2C9CYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 103 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20070106051-A1 Polyfunctional poly(arylene ether) method CITIBANK, N.A., AS COLLATERAL AGENT 2007-05-10 US claimed
US-20250376552-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2025-12-11 US disclosed
US-20250264801-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2025-08-21 US disclosed
EP-4596607-A1 RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED PRODUCT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
EP-4597225-A1 FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
EP-4596608-A1 RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
US-20250236697-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2025-07-24 US disclosed
US-20250230283-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2025-07-17 US disclosed
CN-120077104-A Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device 富士胶片株式会社 2025-05-30 CN disclosed
CN-119998728-A Film manufacturing method, photosensitive resin composition, cured product manufacturing method, cured product, and laminate 富士胶片株式会社 2025-05-13 CN disclosed
US-5529881-A ALKALI-SOLUBLE RESIN AND 1,2-NAPHTHOQUINONEDIAZIDE SULFONIC ACID ESTER OF SPECIFIED POLYHYDROXY COMPOUND AS PHOTOSENSITIVE COMPOUND FUJI PHOTO FILM CO., LTD. (JP) 1996-06-25 US disclosed
US-5523396-A ESTERIFICATION OF POLYHYDROXY COMPOUND WITH 1,2-NAPHTHOQUINONEDIAZIDE-5-SULFONYL CHLORIDE IN THE PRESENCE OF A BASIC CATALYST FUJI PHOTO FILM CO., LTD. (JP) 1996-06-04 US disclosed
EP-0710886-A1 Positive photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1996-05-08 EP disclosed
EP-0706089-A2 Process for synthesizing quinonediazide ester and positive working photoresist containing the same FUJI PHOTO FILM CO., LTD. (JP) 1996-04-10 EP disclosed
US-5494773-A MIXTURE WITH A 1,2-QUINONEDIAZIDE COMPOUND FUJI PHOTO FILM CO., LTD. (JP) 1996-02-27 US disclosed
EP-0684521-A1 Positive working photosensitive compositions FUJI PHOTO FILM CO., LTD. (JP) 1995-11-29 EP disclosed
EP-0677789-A1 Positive photoresist composition Fuji Photo Film Co., Ltd. (JP) 1995-10-18 EP disclosed
EP-0672952-A1 Positive photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1995-09-20 EP disclosed
EP-0658807-A1 Positive-working photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1995-06-21 EP disclosed
EP-0644460-A1 Positive working photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1995-03-22 EP disclosed