Known targets — ChEMBL curated mechanism
ABL1ADRA1AADRA1BADRA1DADRA2AADRA2BADRA2CADRB2AGTR1BCL2BCL2A1BCL2L1BCL2L10BCL2L2BCRBRAFCHRM1CHRNA10CHRNA9DRD1DRD2DRD3DRD4DRD5EGFRF2FLT1FLT4GCKGHSRGNRHRGRIN1GRIN2AGRIN2BGRIN2CGRIN2DGRIN3AGRIN3BHTR1AHTR1BHTR1DHTR2AHTR2CHTR3AIDH2KDRKITMAOBMCL1MTTPPP4HBPDGFRBPIK3CAPIK3CBPIK3CDPIK3CGPIK3R1PIK3R2PIK3R3PIK3R5PIKFYVEROCK1ROCK2SLC18A2SLC6A2SLC6A3SLC6A4TACR1TUBA1ATUBA1BTUBA1CTUBA3CTUBA3ETUBA4ATUBBTUBB1TUBB2ATUBB2BTUBB3TUBB4ATUBB4BTUBB6TUBB8gyrAgyrBparCparEpol
The experimentally established mechanism targets of Propionic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | FFAR3 | O14843 | 2/20 | 0.62 |
| ▸ | LDHA | P00338 | 1/20 | 0.39 |
| ▸ | SRR | Q9GZT4 | 1/20 | 0.39 |
| ▸ | HDAC3 | O15379 | 1/20 | 0.38 |
| ▸ | HDAC1 | Q13547 | 1/20 | 0.38 |
| ▸ | HDAC2 | Q92769 | 1/20 | 0.38 |
| ▸ | HDAC8 | Q9BY41 | 1/20 | 0.38 |
| ▸ | POLB | P06746 | 1/20 | 0.38 |
| ▸ | MEN1 | O00255 | 1/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.38 |
| ▸ | CA5A | P35218 | 1/20 | 0.38 |
| ▸ | CA5B | Q9Y2D0 | 1/20 | 0.38 |
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.37 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.37 |
| ▸ | CA2 | P00918 | 1/20 | 0.35 |
| ▸ | APEX1 | P27695 | 1/20 | 0.35 |
| ▸ | AKR1B1 | P15121 | 1/20 | 0.33 |
| ▸ | PTGS2 | P35354 | 1/20 | 0.32 |
| ▸ | FABP4 | P15090 | 1/20 | 0.32 |
| ▸ | HSD11B1 | P28845 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Propionic Acid SCHEMBL5073547 | 0.97 | FFAR3 (0.67) | FFAR3LDHASRRHDAC3HDAC1 | |
| Propionic Acid SCHEMBL28174768 | 0.94 | FFAR3 (0.71) | FFAR3LDHASRRHDAC3HDAC1 | |
| Propionic Acid SCHEMBL2777824 | 0.94 | FFAR3 (0.71) | FFAR3LDHASRRHDAC3HDAC1 | |
| Propionic Acid SCHEMBL4664260 | 0.91 | FFAR3 (0.59) | FFAR3LDHASRRHDAC3HDAC1 | |
| Propionic Acid SCHEMBL28107860 | 0.91 | FFAR3 (0.59) | FFAR3LDHASRRHDAC3HDAC1 | |
| Propionic Acid SCHEMBL28589623 | 0.90 | FFAR3 (0.67) | FFAR3LDHASRRHDAC3HDAC1 | |
| Propionic Acid SCHEMBL28304974 | 0.90 | FFAR3 (0.67) | FFAR3LDHASRRHDAC3HDAC1 | |
| Propionic Acid SCHEMBL28304976 | 0.90 | FFAR3 (0.67) | FFAR3LDHASRRHDAC3HDAC1 | |
| Propionic Acid SCHEMBL28210432 | 0.90 | FFAR3 (0.67) | FFAR3LDHASRRHDAC3HDAC1 | |
| Propionic Acid SCHEMBL2167213 | 0.88 | FFAR3 (0.56) | FFAR3LDHASRRHDAC3HDAC1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6797146-B2 | CONTACTING WITH AN ELECTROPLATING BATH OF A SOURCE OF METAL IONS, AN ELECTROLYTE COMPRISING TWO OR MORE ACIDS, AND ADDITIVES | SHIPLEY COMPANY, L.L.C. | 2004-09-28 | — | — | US | disclosed |
| US-6679983-B2 | BATH, SOURCE OF METAL IONS, AN ELECTROLYTE COMPRISING TWO OR MORE ACIDS AND OPTIONAL ADDITIVE(S); FILL OF SMALL FEATURES WITH LESS OVERPLATE; COPPER ELECTROPLATING | SHIPLEY COMPANY, L.L.C. | 2004-01-20 | — | — | US | disclosed |
| US-6660153-B2 | Providing metal seed layer substantially free of discontinuities disposed on substrate by contacting metal seed layer disposed on a substrate with electroplating bath comprising one or more sources of copper in electrolyte | SHIPLEY COMPANY, L.L.C. | 2003-12-09 | — | — | US | disclosed |
| US-20020088713-A1 | Providing metal seed layer substantially free of discontinuities disposed on substrate by contacting metal seed layer disposed on a substrate with electroplating bath comprising one or more sources of copper in electrolyte | SHIPLEY COMPANY, L.L.C. | 2002-07-11 | — | — | US | disclosed |
| US-20020053519-A1 | Seed layer repair | SHIPLEY COMPANY, L.L.C. | 2002-05-09 | — | — | US | disclosed |
| EP-1199383-A2 | Seed layer repair bath | Shipley Company LLC (US) | 2002-04-24 | — | — | EP | disclosed |
| US-20020043467-A1 | Electrolyte | SHIPLEY COMPANY, L.L.C. | 2002-04-18 | — | — | US | disclosed |
| EP-1197586-A2 | Electrolyte | Shipley Company LLC (US) | 2002-04-17 | — | — | EP | disclosed |