⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL338572 | 0.84 | — | — | |
| SCHEMBL3099997 | 0.84 | — | — | |
| SCHEMBL8992520 | 0.83 | ADORA3 (0.33) | — | |
| SCHEMBL9007778 | 0.82 | DDAH1 (0.32) | — | |
| Fluoride SCHEMBL28837794 | 0.82 | DDAH1 (0.32) | — | |
| Bromide SCHEMBL3127439 | 0.82 | DDAH1 (0.32) | — | |
| Hydrochloric Acid SCHEMBL4451752 | 0.81 | KDM4E (0.33) | — | |
| SCHEMBL152356 | 0.80 | HRH3 (0.39) | — | |
| SCHEMBL2054377 | 0.79 | GPR84 (0.41) | — | |
| Hydrochloric Acid SCHEMBL9594946 | 0.79 | HRH3 (0.38) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 92 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10465037-B2 | High heat monomers and methods of use thereof | SABIC GLOBAL TECHNOLOGIES B.V. (NL) | 2019-11-05 | — | — | US | claimed |
| US-20170158806-A1 | HIGH HEAT MONOMERS AND METHODS OF USE THEREOF | SHPP GLOBAL TECHNOLOGIES B.V. (NL) | 2017-06-08 | — | — | US | claimed |
| EP-3172201-A1 | HIGH HEAT MONOMERS AND METHODS OF USE THEREOF | SABIC Global Technologies B.V. (NL) | 2017-05-31 | — | — | EP | claimed |
| WO-2016014536-A1 | HIGH HEAT MONOMERS AND METHODS OF USE THEREOF | SABIC GLOBAL TECHNOLOGIES B.V. (NL) | 2016-01-28 | — | — | WO | claimed |
| CN-109476830-B | Hardener composition and associated forming process, uncured and cured epoxy resin composition, and article | 沙特基础工业全球技术有限公司 | 2021-07-09 | — | — | CN | disclosed |
| CN-108290386-B | Method of forming a cured epoxy material, cured epoxy material formed thereby, and composite core incorporating the cured epoxy material | 沙特基础工业全球技术有限公司 | 2021-05-14 | — | — | CN | disclosed |
| US-10870724-B2 | High heat monomers and methods of use thereof | SABIC GLOBAL TECHNOLOGIES B.V. (NL) | 2020-12-22 | — | — | US | disclosed |
| US-20200270393-A1 | HARDENER COMPOSITION | SHPP GLOBAL TECHNOLOGIES B.V. (NL) | 2020-08-27 | — | — | US | disclosed |
| EP-3692087-A1 | HARDENER COMPOSITION | SABIC Global Technologies B.V. (NL) | 2020-08-12 | — | — | EP | disclosed |
| CN-104342054-B | Surface protection film and optical member | 日东电工株式会社 | 2020-06-19 | — | — | CN | disclosed |
| CN-111183168-A | Hardening agent composition | 沙特基础工业全球技术有限公司 | 2020-05-19 | — | — | CN | disclosed |
| CN-110452493-A | Curable epoxy composition and circuit material prepreg, thermoset epoxy composition and product prepared therefrom | SABIC GLOBAL TECHNOLOGIES BV | 2019-11-15 | — | — | CN | disclosed |
| US-20040254305-A1 | Epoxy resin composition for photosemiconductor package | CHANG CHUN PLASTIC CO., LTD. (TW) | 2004-12-16 | — | — | US | disclosed |
| US-20040158023-A1 | Halogen-free resin composition | CHANG CHUN PLASTICS CO., LTD. (TW) | 2004-08-12 | — | — | US | disclosed |
| US-20040147640-A1 | Halogen-free resin composition | CHANG CHUN PLASTICS CO., LTD. (TW) | 2004-07-29 | — | — | US | disclosed |
| US-20040077821-A1 | Flame retarding resin composition | CHANG CHUN PLASTICS CO., LTD. (TW) | 2004-04-22 | — | — | US | disclosed |
| EP-0986562-A1 | SUBSTITUTED 1,2,4-TRIAZOLO 3,4-A]PHTHALAZINE DERIVATIVES AS GABA ALPHA 5 LIGANDS | MERCK SHARP & DOHME LTD. (GB) | 2000-03-22 | — | — | EP | disclosed |
| WO-1998050385-A1 | SUBSTITUTED 1,2,4-TRIAZOLO[3,4-a]PHTHALAZINE DERIVATIVES AS GABA ALPHA 5 LIGANDS | MERCK SHARP & DOHME LIMITED (GB) | 1998-11-12 | — | — | WO | disclosed |
| US-4122277-A | CURING AGENTS FOR EPOXIDES, DYEABILITY IMPROVERS, FORMALDEHYDE RESIN ADDITIVES, ION EXCHANGE RESINS | SHIKOKU CHEMICALS CORPORATION (JP) | 1978-10-24 | — | — | US | disclosed |
| US-4104473-A | HYDROXYMETHYLATION WITH FORMALDEHYDE | SHIKOKU CHEMICALS CORPORATION (JP) | 1978-08-01 | — | — | US | disclosed |