SCHEMBL6744403

SCHEMBL6744403

C=CC(=O)OC(C)(C(C)C)C12CC3CC(CC(O)(C3)C1)C2

nearest known ligand 0.32

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
HSD11B1 P28845 3/20 0.32
DPP4 P27487 3/20 0.32
PKM P14618 1/20 0.31
L3MBTL1 Q9Y468 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5969194 0.86 MEN1 (0.33)
SCHEMBL1028437 0.85 PKM (0.33) HSD11B1DPP4PKM
SCHEMBL6830426 0.85 ALDH1A1 (0.36) PKML3MBTL1
SCHEMBL1217993 0.82 HSD11B1 (0.34) HSD11B1DPP4PKML3MBTL1
SCHEMBL5411822 0.79 HSD11B1 (0.35) HSD11B1DPP4PKML3MBTL1
SCHEMBL7110758 0.76 ALDH1A1 (0.36) HSD11B1DPP4PKML3MBTL1
SCHEMBL5901413 0.76 MEN1 (0.32)
SCHEMBL14594003 0.75
SCHEMBL11918797 0.75 KMT2A (0.33) DPP4
SCHEMBL332873 0.72 MEN1 (0.36)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6806335-B2 FOR USE IN FINE PATTERNING OF SEMICONDUCTORS DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2004-10-19 US disclosed
EP-1445266-A2 Photoresist copolymer Daicel Chemical Industries, Ltd. (JP) 2004-08-11 EP disclosed
US-6692889-B1 COPOLYMERS CONTAINING DERIVATIZED ADAMANTANYL ACRYLATE FUNCTIONALITY; ETCHING RESISTANCE DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2004-02-17 US disclosed
US-20040006189-A1 Polymeric compound and resin composition for photoresist DAICEL CHEMICAL INDUSTRIES, LTD. 2004-01-08 US disclosed
US-20030180662-A1 Acid-sensitive compound and resin composition for photoresist DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2003-09-25 US disclosed
US-6552143-B2 Addition polymer including units of 1-oxo-perhydro-5,6-didehydro-4,7-methanoisobenzofuran; making a semiconductor using the photoresist; high adhesion, fine patterns DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2003-04-22 US disclosed
US-20020169266-A1 Polymeric compound and resin composition for photoresist DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2002-11-14 US disclosed
EP-1172384-A1 POLYMER FOR PHOTORESISTS AND RESIN COMPOSITIONS FOR PHOTORESISTS Daicel Chemical Industries, Ltd. (JP) 2002-01-16 EP disclosed
EP-1172694-A1 POLYMERIC COMPOUND FOR PHOTORESIST AND RESIN COMPOSITION FOR PHOTORESIST Daicel Chemical Industries, Ltd. (JP) 2002-01-16 EP disclosed
EP-1000924-A1 ACID-SENSITIVE COMPOUND AND RESIN COMPOSITION FOR PHOTORESIST Daichel Chemical Industries Ltd (JP) 2000-05-17 EP disclosed