SCHEMBL6757682

SCHEMBL6757682

CCCOc1cc(Cc2cc(OCCC)c(N)c(OCCC)c2)cc(OCCC)c1N

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.48
HTT P42858 2/20 0.48
MAPT P10636 2/20 0.48
KDM4E B2RXH2 1/20 0.48
MEN1 O00255 1/20 0.48
USP2 O75604 1/20 0.48
TP53 P04637 1/20 0.48
POLB P06746 1/20 0.48
GAA P10253 1/20 0.48
CASP1 P29466 1/20 0.48
CASP7 P55210 1/20 0.48
KMT2A Q03164 1/20 0.48
ATM Q13315 1/20 0.48
CSNK2A1 P68400 2/20 0.44
TLR8 Q9NR97 1/20 0.42
HSD17B10 Q99714 2/20 0.39
LMNA P02545 1/20 0.39
MCHR1 Q99705 1/20 0.39
CYP1A2 P05177 1/20 0.38
CYP2C9 P11712 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7546340 0.89 CYP1A2 (0.50) ALDH1A1HTTMAPTKDM4EMEN1
SCHEMBL5981821 0.84 ALDH1A1 (0.45) ALDH1A1MAPTKDM4EMEN1USP2
SCHEMBL31457247 0.75 ALDH1A1 (0.54) ALDH1A1HTTMAPTKDM4EMEN1
SCHEMBL11210965 0.75 MAPT (0.64) ALDH1A1HTTMAPTKDM4EMEN1
SCHEMBL5982004 0.75 ALDH1A1 (0.59) ALDH1A1HTTMAPTKDM4EMEN1
SCHEMBL7928268 0.74 ALDH1A1 (0.44) ALDH1A1HTTMAPTKDM4EMEN1
SCHEMBL7928280 0.73 MCHR1 (0.58) ALDH1A1HTTMAPTKDM4EMEN1
SCHEMBL5252217 0.73 LTA4H (0.41) HTTMAPTMEN1KMT2AHSD17B10
SCHEMBL22887978 0.72 MAPT (0.43) ALDH1A1HTTMAPTKDM4EMEN1
SCHEMBL8854696 0.71 MGLL (0.37) ALDH1A1HTTMAPTKDM4EMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6713143-B2 FOR USE IN PRINTED CIRCUIT BOARD; ELECTRONICS TOMEGAWA PAPER CO., LTD. (JP) 2004-03-30 US disclosed
US-6492030-B1 SILOXANE DENATURED POLYIMIDE, DI- OR TRIALLYL COMPOUND AND DIMALEIMIDE COMPOUND; ADHERES TO METALS WITH LOW DIELECTRIC CONSTANT AND DISSIPATION FACTOR; FASTER SIGNAL PROCESSING; HIGH FREQUENCY ELECTRONICS WITH MINIATURIZED CIRCUITS TOMOEGAWA PAPER CO., LTD. (JP) 2002-12-10 US disclosed
US-6473288-B2 Adhesive sheet and electrostatic chucking device TOMOEGAWA PAPER CO. (JP) 2002-10-29 US disclosed
US-20020106521-A1 Thermosetting low-dielectric resin composition and use thereof HASHIMOTO TAKESHI (JP) 2002-08-08 US disclosed
EP-0729996-B1 Polyimide and process for producing the same TOMOEGAWA PAPER CO LTD (JP) 2002-06-12 EP disclosed
US-6395391-B1 MULTILAYER; METAL SUBSTRATE, ADHESIVE LAYERS TOMOEGAWA PAPER CO., LTD. (JP) 2002-05-28 US disclosed
US-6346598-B1 SILOXANE MODIFIED POLYIMIDES WITH METHALLYL GROUPS TOMOEGAWA PAPER CO., LTD. (JP) 2002-02-12 US disclosed
US-20020004134-A1 Adhesive sheet and electrostatic chucking device TOMOEGAWA PAPER CO., LTD. 2002-01-10 US disclosed
US-6268033-B1 POLYIMIDE TOMOEGAWA PAPER CO., LTD. (JP) 2001-07-31 US disclosed
US-6265042-B1 POLYIMIDE TOMOEGAWA PAPER CO., LTD. (JP) 2001-07-24 US disclosed
US-6228452-B1 POLYIMIDE ON METAL SUBSTRATE TOMOEGAWA PAPER CO., LTD. (JP) 2001-05-08 US disclosed
US-6184337-B1 HEAT RESISTANCE; FOR USE IN SEMICONDUCTORS TOMOEGAWA PAPER CO., LTD. (JP) 2001-02-06 US disclosed
US-6132865-A METAL SUBSTRATE AND ADHESIVE LAYERS TOMOEGAWA PAPER CO., LTD. (JP) 2000-10-17 US disclosed
US-6045886-A TWO ADHESIVE LAYERS ARE RESIN LAYERS COMPOSED OF 100-40% BY MOL OF A POLYIMIDE; SAID TWO ADHESIVE LAYERS HAVING EACH A DIFFERENT GLASS TRANSITION TEMPERATURE; HEAT RESISTANCE TOMOEGAWA PAPER CO., LTD. (JP) 2000-04-04 US disclosed
US-5891540-A POLYIMIDE TOMOEGAWA PAPER CO., LTD. (JP) 1999-04-06 US disclosed
US-5851616-A Adhesive tape for electronic parts and liquid adhesive TOMOEGAWA PAPER CO., LTD. (JP) 1998-12-22 US disclosed
US-5663287-A SOLUBLE IN ORGANIC SOLVENTS AND EXCELS IN HEAT RESISTANCE TOMOEGAWA PAPER CO., LTD. (JP) 1997-09-02 US disclosed
EP-0729996-A1 Polyimide and process for producing the same TOMOEGAWA PAPER CO. LTD. (JP) 1996-09-04 EP disclosed