SCHEMBL675783

SCHEMBL675783

[SiH3]CC=COCCc1ccccc1

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA1 P00915 1/20 0.39
CA2 P00918 1/20 0.39
CA9 Q16790 1/20 0.39
HCAR2 Q8TDS4 1/20 0.39
IDO1 P14902 2/20 0.38
NPC1 O15118 1/20 0.38
RAB9A P51151 1/20 0.38
MAOB P27338 1/20 0.37
ALDH1A1 P00352 1/20 0.37
HPGD P15428 1/20 0.37
ALOX15 P16050 1/20 0.37
ALOX12 P18054 1/20 0.37
CASP1 P29466 1/20 0.37
HSD17B10 Q99714 1/20 0.37
AKR1B10 O60218 1/20 0.37
AKR1B1 P15121 1/20 0.37
TDP1 Q9NUW8 3/20 0.36
SMN1; SMN2 Q16637 2/20 0.35
CYP2A6 P11509 1/20 0.35
HTR2A P28223 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25271865 0.82 MAOB (0.54) CA1CA2CA9HCAR2IDO1
SCHEMBL25271200 0.82 GPR52 (0.44) CA1CA2CA9HCAR2IDO1
SCHEMBL675840 0.80 IDO1 (0.46) CA1CA2CA9HCAR2IDO1
SCHEMBL30712620 0.78 HCAR2 (0.40) CA1CA2CA9HCAR2IDO1
SCHEMBL6740879 0.76 CA1 (0.41) CA1CA2CA9HCAR2IDO1
SCHEMBL23292134 0.76 CA1 (0.41) CA1CA2CA9HCAR2IDO1
SCHEMBL6740876 0.76 CA1 (0.41) CA1CA2CA9HCAR2IDO1
SCHEMBL28923271 0.75 LMNA (0.42) IDO1SMN1; SMN2
SCHEMBL21596611 0.74 AKR1B10 (0.53) CA1CA2CA9HCAR2IDO1
SCHEMBL22761787 0.73 CA1 (0.39) CA1CA2CA9HCAR2IDO1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1746132-B1 SILICON-CONTAINING CURABLE COMPOSITION AND CURED OBJECT OBTAINED BY THERMALLY CURING THE SAME ADEKA CORP (JP) 2013-07-10 EP disclosed
EP-1801871-B1 SEMICONDUCTOR DEVICE KANSAI ELECTRIC POWER CO (JP) 2012-07-11 EP disclosed
US-7939614-B2 Silicon-containing curing composition and heat cured product thereof ADEKA CORPORATION (JP) 2011-05-10 US disclosed
US-7772594-B2 covered with a synthetic high molecular compound which is a silicon-containing curable polymer composition having excellent heat resistance and flexibility; high voltage; fluorine-free; platinum curing catalyst THE KANSAI ELECTRIC POWER CO., INC. (JP) 2010-08-10 US disclosed
US-20080210948-A1 High-Heat-Resistive Semiconductor Device THE KANSAI ELECTRIC POWER CO., INC. (JP) 2008-09-04 US disclosed
US-20070197755-A1 Silicon-containing curing composition and heat cured product thereof ADEKA CORPORATION (JP) 2007-08-23 US disclosed
EP-1801871-A1 SEMICONDUCTOR DEVICE THE KANSAI ELECTRIC POWER CO., INC. (JP) 2007-06-27 EP disclosed
EP-1746132-A1 SILICON-CONTAINING CURABLE COMPOSITION AND CURED OBJECT OBTAINED BY THERMALLY CURING THE SAME Adeka Corporation (JP) 2007-01-24 EP disclosed