SCHEMBL675840

SCHEMBL675840

[SiH3]CC=COCc1ccccc1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
IDO1 P14902 3/20 0.46
AGXT P21549 3/20 0.45
TSHR P16473 2/20 0.44
MAOB P27338 2/20 0.39
ALDH1A1 P00352 3/20 0.35
CA1 P00915 2/20 0.35
CA2 P00918 2/20 0.35
CA9 Q16790 2/20 0.35
SLC6A2 P23975 2/20 0.35
SLC6A3 Q01959 2/20 0.35
LMNA P02545 1/20 0.35
CYP1A2 P05177 1/20 0.35
PTGS1 P23219 1/20 0.35
CYP2C19 P33261 1/20 0.35
PTGS2 P35354 1/20 0.35
HIF1A Q16665 1/20 0.35
HDAC6 Q9UBN7 1/20 0.35
HCAR2 Q8TDS4 1/20 0.35
L3MBTL1 Q9Y468 3/20 0.34
MAPK1 P28482 2/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27509183 0.82 TSHR (0.57) IDO1AGXTTSHRMAOBALDH1A1
SCHEMBL17269304 0.81 MAOB (0.58) IDO1AGXTTSHRMAOBALDH1A1
SCHEMBL675783 0.80 CA1 (0.39) IDO1MAOBALDH1A1CA1CA2
SCHEMBL7717208 0.79 IDO1 (0.46) IDO1AGXTTSHRMAOBALDH1A1
SCHEMBL7566541 0.79 IDO1 (0.52) IDO1AGXTTSHRMAOBALDH1A1
SCHEMBL7717207 0.79 IDO1 (0.46) IDO1AGXTTSHRMAOBALDH1A1
SCHEMBL1257815 0.79 IDO1 (0.46) IDO1AGXTTSHRMAOBALDH1A1
SCHEMBL738243 0.79 IDO1 (0.46) IDO1AGXTTSHRMAOBALDH1A1
SCHEMBL676432 0.78 TSHR (0.48) IDO1AGXTTSHRMAOBALDH1A1
SCHEMBL6506525 0.76 IDO1 (0.43) IDO1AGXTTSHRMAOBALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1746132-B1 SILICON-CONTAINING CURABLE COMPOSITION AND CURED OBJECT OBTAINED BY THERMALLY CURING THE SAME ADEKA CORP (JP) 2013-07-10 EP disclosed
EP-1801871-B1 SEMICONDUCTOR DEVICE KANSAI ELECTRIC POWER CO (JP) 2012-07-11 EP disclosed
US-7939614-B2 Silicon-containing curing composition and heat cured product thereof ADEKA CORPORATION (JP) 2011-05-10 US disclosed
US-7772594-B2 covered with a synthetic high molecular compound which is a silicon-containing curable polymer composition having excellent heat resistance and flexibility; high voltage; fluorine-free; platinum curing catalyst THE KANSAI ELECTRIC POWER CO., INC. (JP) 2010-08-10 US disclosed
US-20080210948-A1 High-Heat-Resistive Semiconductor Device THE KANSAI ELECTRIC POWER CO., INC. (JP) 2008-09-04 US disclosed
US-20070197755-A1 Silicon-containing curing composition and heat cured product thereof ADEKA CORPORATION (JP) 2007-08-23 US disclosed
EP-1801871-A1 SEMICONDUCTOR DEVICE THE KANSAI ELECTRIC POWER CO., INC. (JP) 2007-06-27 EP disclosed
EP-1746132-A1 SILICON-CONTAINING CURABLE COMPOSITION AND CURED OBJECT OBTAINED BY THERMALLY CURING THE SAME Adeka Corporation (JP) 2007-01-24 EP disclosed