Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ACHE | P22303 | 2/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.31 |
| ▸ | TSHR | P16473 | 2/20 | 0.31 |
| ▸ | TP53 | P04637 | 1/20 | 0.31 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.31 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.31 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.31 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.31 |
| ▸ | MEN1 | O00255 | 1/20 | 0.30 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.30 |
| ▸ | CA4 | P22748 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL135716 | 0.81 | MEN1 (0.32) | MEN1KMT2A | |
| SCHEMBL22654156 | 0.80 | CA2 (0.34) | TSHRMEN1KMT2A | |
| SCHEMBL252065 | 0.80 | ALDH1A1 (0.30) | ALDH1A1TSHR | |
| SCHEMBL9900069 | 0.78 | — | — | |
| SCHEMBL14956287 | 0.78 | ALDH1A1 (0.35) | ALDH1A1TSHR | |
| SCHEMBL22654249 | 0.78 | KDM4E (0.37) | ALDH1A1SMN1; SMN2 | |
| SCHEMBL18950137 | 0.76 | ALDH1A1 (0.31) | ALDH1A1TSHR | |
| SCHEMBL18145380 | 0.74 | — | — | |
| SCHEMBL6268335 | 0.74 | CA4 (0.35) | ALDH1A1TP53CA4 | |
| SCHEMBL580082 | 0.72 | ALDH1A1 (0.33) | ALDH1A1TSHRCA4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1746132-B1 | SILICON-CONTAINING CURABLE COMPOSITION AND CURED OBJECT OBTAINED BY THERMALLY CURING THE SAME | ADEKA CORP (JP) | 2013-07-10 | — | — | EP | disclosed |
| EP-1801871-B1 | SEMICONDUCTOR DEVICE | KANSAI ELECTRIC POWER CO (JP) | 2012-07-11 | — | — | EP | disclosed |
| US-7939614-B2 | Silicon-containing curing composition and heat cured product thereof | ADEKA CORPORATION (JP) | 2011-05-10 | — | — | US | disclosed |
| US-7772594-B2 | covered with a synthetic high molecular compound which is a silicon-containing curable polymer composition having excellent heat resistance and flexibility; high voltage; fluorine-free; platinum curing catalyst | THE KANSAI ELECTRIC POWER CO., INC. (JP) | 2010-08-10 | — | — | US | disclosed |
| US-20080210948-A1 | High-Heat-Resistive Semiconductor Device | THE KANSAI ELECTRIC POWER CO., INC. (JP) | 2008-09-04 | — | — | US | disclosed |
| US-20070197755-A1 | Silicon-containing curing composition and heat cured product thereof | ADEKA CORPORATION (JP) | 2007-08-23 | — | — | US | disclosed |
| EP-1801871-A1 | SEMICONDUCTOR DEVICE | THE KANSAI ELECTRIC POWER CO., INC. (JP) | 2007-06-27 | — | — | EP | disclosed |
| EP-1746132-A1 | SILICON-CONTAINING CURABLE COMPOSITION AND CURED OBJECT OBTAINED BY THERMALLY CURING THE SAME | Adeka Corporation (JP) | 2007-01-24 | — | — | EP | disclosed |