SCHEMBL675969

SCHEMBL675969

O=C1C2C=CCCC2C(=O)N1CC1CO1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.38
HBB P68871 1/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
POLB P06746 1/20 0.38
TSHR P16473 2/20 0.36
ALDH1A1 P00352 4/20 0.35
MAPK1 P28482 1/20 0.35
CYP2C19 P33261 2/20 0.33
CYP1A2 P05177 1/20 0.33
CYP2C9 P11712 1/20 0.33
DHFR P00374 1/20 0.33
MAPT P10636 3/20 0.32
HSD17B10 Q99714 2/20 0.32
MEN1 O00255 1/20 0.32
HPGD P15428 1/20 0.32
NPY1R P25929 1/20 0.32
CASP1 P29466 1/20 0.32
NPY2R P49146 1/20 0.32
CASP7 P55210 1/20 0.32
KMT2A Q03164 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10719995 0.85 TP53 (0.38) TP53HBBSMN1; SMN2DHFR
SCHEMBL10967255 0.78 ALDH1A1 (0.31) ALDH1A1
SCHEMBL959563 0.75 ALDH1A1 (0.47) TP53HBBSMN1; SMN2TSHRALDH1A1
SCHEMBL8149048 0.75 ALDH1A1 (0.41) SMN1; SMN2TSHRALDH1A1MAPK1MAPT
SCHEMBL21461267 0.75 ALDH1A1 (0.32) ALDH1A1MEN1KMT2A
SCHEMBL15184112 0.75 ALDH1A1 (0.41) SMN1; SMN2TSHRALDH1A1MAPK1MAPT
SCHEMBL9383280 0.74 MAOA (0.33)
SCHEMBL3847282 0.74 ALDH1A1 (0.44) POLBALDH1A1MAPTMEN1KMT2A
SCHEMBL11818302 0.74 SMN1; SMN2 (0.47) TP53SMN1; SMN2TSHRALDH1A1CYP1A2
SCHEMBL17983048 0.73 TP53 (0.48) TP53HBBSMN1; SMN2POLBTSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 77 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109476830-B Hardener composition and associated forming process, uncured and cured epoxy resin composition, and article 沙特基础工业全球技术有限公司 2021-07-09 CN claimed
US-20190241698-A1 HARDENER COMPOSITION AND ASSOCIATED FORMING METHOD, UNCURED AND CURED EPOXY RESIN COMPOSITIONS, AND ARTICLE SHPP GLOBAL TECHNOLOGIES B.V. (NL) 2019-08-08 US claimed
EP-3487906-A1 HARDENER COMPOSITION AND ASSOCIATED FORMING METHOD, UNCURED AND CURED EPOXY RESIN COMPOSITIONS, AND ARTICLE SABIC Global Technologies B.V. (NL) 2019-05-29 EP claimed
US-20180319930-A1 METHOD OF FORMING A CURED EPOXY MATERIAL, CURED EPOXY MATERIAL FORMED THEREBY, PHENYLENE ETHER OLIGOMER-ANHYDRIDE REACTION PRODUCT USEFUL IN THE METHOD, AND COMPOSITE CORE INCORPORATING THE CURED EPOXY MATERIAL SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2018-11-08 US claimed
EP-3377315-A1 METHOD OF FORMING A CURED EPOXY MATERIAL, CURED EPOXY MATERIAL FORMED THEREBY, PHENYLENE ETHER OLIGOMER-ANHYDRIDE REACTION PRODUCT USEFUL IN THE METHOD, AND COMPOSITE CORE INCORPORATING THE CURED EPOXY MATERIAL SABIC Global Technologies B.V. (NL) 2018-09-26 EP claimed
WO-2018022262-A1 HARDENER COMPOSITION AND ASSOCIATED FORMING METHOD, UNCURED AND CURED EPOXY RESIN COMPOSITIONS, AND ARTICLE SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2018-02-01 WO claimed
CN-116675953-A Crosslinkable Networks and Thermoset Polymers from Functionalized Polyetherimides 高新特殊工程塑料全球技术有限公司 2023-09-01 CN disclosed
CN-113710725-B Crosslinkable networks from functionalized polyetherimides and thermoset polymers therefrom 高新特殊工程塑料全球技术有限公司 2023-07-07 CN disclosed
EP-3640275-B1 CURABLE EPOXY COMPOSITIONS AND CURED PRODUCTS THEREOF SHPP GLOBAL TECH BV (NL) 2022-06-29 EP disclosed
US-20220145065-A1 CROSS-LINKABLE NETWORK FROM FUNCTIONALIZED POLYETHERIMIDE AND THERMOSET POLYMER RESULTING THEREFROM SHPP GLOBAL TECHNOLOGIES B.V. (NL) 2022-05-12 US disclosed
EP-3931238-A1 CROSS-LINKABLE NETWORK FROM FUNCTIONALIZED POLYETHERIMIDE AND THERMOSET POLYMER RESULTING THEREFROM SHPP Global Technologies B.V. (NL) 2022-01-05 EP disclosed
CN-113710725-A Crosslinkable networks from functionalized polyetherimides and thermoset polymers therefrom 高新特殊工程塑料全球技术有限公司 2021-11-26 CN disclosed
CN-109476830-B Hardener composition and associated forming process, uncured and cured epoxy resin composition, and article 沙特基础工业全球技术有限公司 2021-07-09 CN disclosed
US-20070082986-A1 Polymer composition, method, and article SABIC GLOBAL TECHNOLOGIES IP B.V. (NL) 2007-04-12 US disclosed
US-20070080330-A1 Flame retardant composition and method CITIBANK, N.A., AS COLLATERAL AGENT 2007-04-12 US disclosed
US-6174943-B1 FLAME RESISTANCE AND ANTI-DRIP PROPERTY WITHOUT CONTAINING HALOGEN ATOM; HEAT RESISTANCE, MECHANICAL STRENGTH, SOLVENT RESISTANCE, SURFACE PROPERTY OF MOLDINGS, DIMENSIONAL STABILITY KANEKA CORPORATION (JP) 2001-01-16 US disclosed
EP-0829517-B1 FLAME-RETARDANT RESIN COMPOSITION KANEGAFUCHI CHEMICAL IND (JP) 2000-10-18 EP disclosed
US-5871570-A BLEND OF POLYCARBONATE, POLYALKYLENE TEREPHTHALATE AND RUBBER COPOLYMER WITH ORGANOPHOSPHOROUS FLAME RETARDANT, FLUOROCARBON RESIN AND EPOXY COMPOUND KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1999-02-16 US disclosed
EP-0884366-A1 FLAME-RETARDANT THERMOPLASTIC RESIN COMPOSITION KANEKA CORPORATION (JP) 1998-12-16 EP disclosed
EP-0829517-A1 FLAME-RETARDANT RESIN COMPOSITION KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1998-03-18 EP disclosed