SCHEMBL6765203

SCHEMBL6765203

C=C[Si](C)(C)c1cccc(NC(=O)F)c1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TGM2 P21980 1/20 0.42
SMN1; SMN2 Q16637 5/20 0.38
ALDH1A1 P00352 3/20 0.37
USP2 O75604 1/20 0.37
NR1H2 P55055 1/20 0.36
NR1H3 Q13133 1/20 0.36
NPC1 O15118 4/20 0.36
RAB9A P51151 4/20 0.36
MAPK1 P28482 3/20 0.36
TP53 P04637 2/20 0.36
NFKB1 P19838 1/20 0.36
NFKB2 Q00653 1/20 0.36
RELA Q04206 1/20 0.36
MAPT P10636 1/20 0.36
CYP1A2 P05177 1/20 0.36
HSD17B10 Q99714 1/20 0.36
GAA P10253 2/20 0.36
L3MBTL1 Q9Y468 1/20 0.36
TDP1 Q9NUW8 1/20 0.36
LMNA P02545 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18806248 0.88 TGM2 (0.42) TGM2SMN1; SMN2ALDH1A1USP2NPC1
SCHEMBL18806234 0.84 TGM2 (0.44) TGM2ALDH1A1MAPTCYP1A2LMNA
SCHEMBL26797067 0.81 NR1H2 (0.38) TGM2SMN1; SMN2ALDH1A1NR1H2NR1H3
SCHEMBL26796875 0.81 F2R (0.48) SMN1; SMN2ALDH1A1NR1H2NR1H3RAB9A
SCHEMBL12438754 0.81 NR1H2 (0.47) TGM2SMN1; SMN2ALDH1A1NR1H2NR1H3
SCHEMBL15942920 0.80 NR1H2 (0.37) TGM2SMN1; SMN2ALDH1A1NR1H2NR1H3
SCHEMBL18868022 0.79 NR1H2 (0.38) TGM2NR1H2NR1H3
SCHEMBL10015678 0.79 KMT2A (0.49) SMN1; SMN2ALDH1A1NPC1RAB9AMAPK1
SCHEMBL824795 0.77 TSHR (0.37) TGM2NR1H2NR1H3EGFR
SCHEMBL18806226 0.76 L3MBTL1 (0.41) SMN1; SMN2ALDH1A1NR1H2NR1H3HSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230374355-A1 ADHESIVE COMPOSITION, DIE ATTACH MATERIAL, SEALING AGENT OR COATING AGENT FOR PROTECTION, AND ELECTRICAL/ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-11-23 US disclosed
US-10017677-B2 Heat-conductive fluorinated curable composition, cured product thereof, and electric/electronic part SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-07-10 US disclosed
US-20170121583-A1 HEAT-CONDUCTIVE FLUORINATED CURABLE COMPOSITION, CURED PRODUCT THEREOF, AND ELECTRIC/ELECTRONIC PART SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-05-04 US disclosed
US-20160222170-A1 PHOTO-CURABLE FLUOROPOLYETHER-BASED RUBBER COMPOSITION, CURING METHOD THEREOF AND CURED PRODUCT OBTAINED BY THE CURING METHOD SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-08-04 US disclosed
US-9221968-B2 Curable perfluoropolyether based gel composition and gel product using cured composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-12-29 US disclosed
US-20150274960-A1 CURABLE PERFLUOROPOLYETHER BASED GEL COMPOSITION AND GEL PRODUCT USING CURED COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-10-01 US disclosed
US-9093625-B2 Curable composition for encapsulating optical semiconductor and optical semiconductor apparatus using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-07-28 US disclosed
US-9023927-B2 Adhesive composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-05-05 US disclosed
US-8860076-B2 Optical semiconductor sealing curable composition and optical semiconductor apparatus using this SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-10-14 US disclosed
US-8805244-B2 Charging member, process cartridge, and image forming apparatus FUJI XEROX CO., LTD. (JP) 2014-08-12 US disclosed
US-8492487-B2 Thermosetting fluoropolyether adhesive composition and adhesion method SHIN-ETSU CHEMICAL CO., LTD. (JP) 2013-07-23 US disclosed
US-8440777-B2 Addition-cure fluoropolyether adhesive composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2013-05-14 US disclosed
US-20130082300-A1 OPTICAL SEMICONDUCTOR SEALING CURABLE COMPOSITION AND OPTICAL SEMICONDUCTOR APPARATUS USING THIS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2013-04-04 US disclosed
US-8299196-B2 Adhesive composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-10-30 US disclosed
US-20120123049-A1 THERMOSETTING FLUOROPOLYETHER ADHESIVE COMPOSITION AND ADHESION METHOD SHIN-ETSU CHEMICAL CO., LTD (JP) 2012-05-17 US disclosed
US-20120076532-A1 CHARGING MEMBER, PROCESS CARTRIDGE, AND IMAGE FORMING APPARATUS FUJI XEROX CO., LTD. (JP) 2012-03-29 US disclosed
US-8119760-B2 Curable perfluoropolyether compositions and rubber or gel articles comprising the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-02-21 US disclosed
US-8110065-B2 Heat-curable fluoropolyether adhesive composition and bonding method SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-02-07 US disclosed
US-20110257315-A1 ADHESIVE COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2011-10-20 US disclosed
US-20110178263-A1 ADDITION-CURE FLUOROPOLYETHER ADHESIVE COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2011-07-21 US disclosed