Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.48 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.45 |
| ▸ | TSHR | P16473 | 1/20 | 0.45 |
| ▸ | PTGS2 | P35354 | 6/20 | 0.37 |
| ▸ | MCL1 | Q07820 | 2/20 | 0.36 |
| ▸ | PTPN2 | P17706 | 2/20 | 0.34 |
| ▸ | PTPN1 | P18031 | 2/20 | 0.34 |
| ▸ | PTPN5 | P54829 | 2/20 | 0.34 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.33 |
| ▸ | HTR6 | P50406 | 1/20 | 0.31 |
| ▸ | AKR1C2 | P52895 | 1/20 | 0.31 |
| ▸ | AKR1C1 | Q04828 | 1/20 | 0.31 |
| ▸ | PSMD14 | O00487 | 1/20 | 0.31 |
| ▸ | LMNA | P02545 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Styrene SCHEMBL2119541 | 0.87 | ALDH1A1 (0.56) | TDP1ALDH1A1TSHRPTGS2MCL1 | |
| SCHEMBL2944668 | 0.86 | TDP1 (0.70) | TDP1ALDH1A1TSHRPTGS2MCL1 | |
| Styrene SCHEMBL27724327 | 0.83 | ALDH1A1 (0.56) | TDP1ALDH1A1TSHRPTGS2MCL1 | |
| SCHEMBL19915134 | 0.82 | TDP1 (0.61) | TDP1ALDH1A1TSHRPTGS2MCL1 | |
| SCHEMBL17476623 | 0.82 | TDP1 (0.61) | TDP1ALDH1A1TSHRPTGS2MCL1 | |
| Lithium Ion SCHEMBL813502 | 0.82 | TDP1 (0.61) | TDP1ALDH1A1TSHRPTGS2MCL1 | |
| Potassium Ion SCHEMBL331671 | 0.82 | TDP1 (0.61) | TDP1ALDH1A1TSHRPTGS2MCL1 | |
| SCHEMBL5621482 | 0.82 | TDP1 (0.61) | TDP1ALDH1A1TSHRPTGS2MCL1 | |
| SCHEMBL2025169 | 0.82 | TDP1 (0.61) | TDP1ALDH1A1TSHRPTGS2MCL1 | |
| SCHEMBL137132 | 0.82 | HTR6 (0.46) | TDP1ALDH1A1TSHRPTPN5HTR6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119930906-A | PAG (polyamide) bonded photoresist film-forming resin and preparation method thereof | 杭州先研科技有限公司 | 2025-05-06 | — | — | CN | claimed |
| CN-119930906-A | PAG (polyamide) bonded photoresist film-forming resin and preparation method thereof | 杭州先研科技有限公司 | 2025-05-06 | — | — | CN | disclosed |
| CN-119930906-A | PAG (polyamide) bonded photoresist film-forming resin and preparation method thereof | 杭州先研科技有限公司 | 2025-05-06 | — | — | CN | disclosed |
| CN-116157482-B | Color-changeable adhesive sheet | 日东电工株式会社 | 2024-02-06 | — | — | CN | disclosed |
| CN-116157482-A | Color-changeable adhesive sheet | 日东电工株式会社 | 2023-05-23 | — | — | CN | disclosed |
| CN-116075567-A | Method for producing adhesive sheet product | 日东电工株式会社 | 2023-05-05 | — | — | CN | disclosed |
| US-9090722-B2 | Chemical amplification resist composition, and mold preparation method and resist film using the same | FUJIFILM CORPORATION (JP) | 2015-07-28 | — | — | US | disclosed |
| US-8361693-B2 | Chemically amplified positive photoresist composition and pattern forming process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-01-29 | — | — | US | disclosed |
| EP-2264525-B1 | Chemically amplified positive photoresist composition and pattern forming process | SHINETSU CHEMICAL CO (JP) | 2012-09-05 | — | — | EP | disclosed |
| US-20120100481-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE COMPOSITION AND PATTERN FORMING METHOD USING THE SAME | FUJIFILM CORPORATION (JP) | 2012-04-26 | — | — | US | disclosed |
| US-20120006788-A1 | CHEMICAL AMPLIFICATION RESIST COMPOSITION, AND MOLD PREPARATION METHOD AND RESIST FILM USING THE SAME | FUJIFILM CORPORATION (JP) | 2012-01-12 | — | — | US | disclosed |
| EP-2399168-A1 | CHEMICAL AMPLIFICATION RESIST COMPOSITION, AND MOLD PREPARATION METHOD AND RESIST FILM USING THE SAME | FUJIFILM Corporation (JP) | 2011-12-28 | — | — | EP | disclosed |
| WO-2011013842-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE COMPOSITION AND PATTERN FORMING METHOD USING THE SAME | FUJIFILM CORPORATION (JP) | 2011-02-03 | — | — | WO | disclosed |
| WO-2010150917-A1 | CHEMICAL AMPLIFICATION RESIST COMPOSITION, AND MOLD PREPARATION METHOD AND RESIST FILM USING THE SAME | FUJIFILM CORPORATION (JP) | 2010-12-29 | — | — | WO | disclosed |
| EP-2264525-A2 | Chemically amplified positive photoresist composition and pattern forming process | Shin-Etsu Chemical Co., Ltd. (JP) | 2010-12-22 | — | — | EP | disclosed |
| US-20100316955-A1 | CHEMICALLY AMPLIFIED POSITIVE PHOTORESIST COMPOSITION AND PATTERN FORMING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-12-16 | — | — | US | disclosed |