SCHEMBL678026

SCHEMBL678026

C=C(C(=O)OC12CC3CC(CC(C3)C1)C2)C(C)C

nearest known ligand 0.40

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
CYP19A1 P11511 6/20 0.40
CYP17A1 P05093 5/20 0.40
NAAA Q02083 1/20 0.37
NPSR1 Q6W5P4 2/20 0.36
ALDH1A1 P00352 3/20 0.35
EPHX1 P07099 1/20 0.35
NPC1 O15118 1/20 0.35
EPHX2 P34913 2/20 0.33
MAPT P10636 1/20 0.33
MEN1 O00255 1/20 0.32
HTT P42858 1/20 0.32
KMT2A Q03164 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14036957 0.84 PKM (0.34) CYP19A1CYP17A1ALDH1A1
SCHEMBL217993 0.83 CYP19A1 (0.36) CYP19A1CYP17A1NAAANPSR1ALDH1A1
SCHEMBL12306771 0.82 ALDH1A1 (0.39) CYP19A1CYP17A1NPSR1ALDH1A1MAPT
SCHEMBL677512 0.81 KMT2A (0.45) CYP19A1CYP17A1NAAANPSR1ALDH1A1
SCHEMBL45476 0.79 NAAA (0.40) CYP19A1CYP17A1NAAANPSR1ALDH1A1
SCHEMBL13184022 0.79
Methacrylic Acid SCHEMBL7096069 0.79 CYP19A1 (0.33) CYP19A1CYP17A1NAAANPSR1
SCHEMBL6743446 0.79 DPP4 (0.31)
SCHEMBL16369107 0.79 CYP19A1 (0.40) CYP19A1CYP17A1NAAANPSR1ALDH1A1
SCHEMBL3152890 0.78 CYP19A1 (0.37) CYP19A1CYP17A1NAAANPSR1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8901192-B2 (Meth)acrylic resin composition DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 2014-12-02 US claimed
US-20120205043-A1 (METH)ACRYLIC RESIN COMPOSITION DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 2012-08-16 US claimed
JP-62199605-A None JP disclosed
WO-2024141344-A1 MULTISTAGE POLYMER COMPOSITIONS AND COATINGS COMPRISING CURED MULTISTAGE POLYMER COMPOSITIONS ARKEMA FRANCE (FR) 2024-07-04 WO disclosed
EP-4393982-A1 MULTISTAGE POLYMER COMPOSITIONS AND COATINGS COMPRISING CURED MULTISTAGE POLYMER COMPOSITIONS ARKEMA FRANCE (FR) 2024-07-03 EP disclosed
EP-4393963-A1 METHODS FOR PREPARING MULTISTAGE POLYMER PARTICLE COMPOSITIONS AND CURABLE FORMULATIONS FOR THREE-DIMENSIONAL PRINTING ARKEMA FRANCE (FR) 2024-07-03 EP disclosed
WO-2023210746-A1 POLYMER, CURABLE RESIN COMPOSITION, STRETCHABLE INSULATING CURED FILM OBTAINED BY CURING SAID COMPOSITION, INSULATING CURED FILM FOR TOUCH PANEL, TOUCH PANEL, INSULATING CURED FILM FOR FLEXIBLE PRINTED CIRCUIT BOARD, AND FLEXIBLE PRINTED CIRCUIT BOARD 大阪有機化学工業株式会社 2023-11-02 WO disclosed
CN-116981758-A Thermally responsive brush polymers having a copolymer backbone and copolymer arms 英菲诺姆国际有限公司 2023-10-31 CN disclosed
WO-2023118329-A1 MULTISTAGE POLYMER, ITS METHOD OF PREPARATION, COMPOSITION COMPRISING IT AND ITS USE ARKEMA FRANCE (FR) 2023-06-29 WO disclosed
CN-109776311-B Method and device for preparing 2-isopropyl-2-adamantanol (methyl) acrylate 宁波南大光电材料有限公司 2022-01-11 CN disclosed
CN-109776311-A The preparation method and device of 2- isopropyl -2- adamantanol (methyl) acrylate 江苏南大光电材料股份有限公司 2019-05-21 CN disclosed
US-20130174986-A1 METHOD FOR DISASSEMBLING BONDED BODY, AND ADHESIVE DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 2013-07-11 US disclosed
US-20120205043-A1 (METH)ACRYLIC RESIN COMPOSITION DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 2012-08-16 US disclosed
US-20110288231-A1 RAW-MATERIAL COMPOSITIONS FOR RESIN FOR OPTICAL PART, RESIN FOR OPTICAL PART, AND OPTICAL PART IDEMITSU KOSAN CO., LTD. (JP) 2011-11-24 US disclosed
EP-2374824-A1 RAW-MATERIAL COMPOSITIONS FOR RESIN FOR OPTICAL PART, RESIN FOR OPTICAL PART, AND OPTICAL PART Idemitsu Kosan Co., Ltd. (JP) 2011-10-12 EP disclosed
US-8013091-B2 Resin for optical component, raw material composition used for resin for optical component, and optical component IDEMITSU KOSAN CO., LTD. (JP) 2011-09-06 US disclosed
US-20100324246-A1 RESIN FOR OPTICAL COMPONENT, RAW MATERIAL COMPOSITION USED FOR RESIN FOR OPTICAL COMPONENT, AND OPTICAL COMPONENT IDEMITSU KOSAN CO., LTD. (JP) 2010-12-23 US disclosed
EP-2163566-A1 RESIN FOR OPTICAL COMPONENT, RAW MATERIAL COMPOSITION USED FOR RESIN FOR OPTICAL COMPONENT, AND OPTICAL COMPONENT Idemitsu Kosan Co., Ltd. (JP) 2010-03-17 EP disclosed
US-20050163958-A1 Optical filter and display using the same DAI NIPPON PRINTING CO., LTD. (JP) 2005-07-28 US disclosed
JP-S62199605-A OPTICAL RESIN MATERIAL HITACHI CHEM CO LTD 1987-09-03 JP disclosed