SCHEMBL6841441

SCHEMBL6841441

CCCCCCCCCCCCC[SiH](O)O

nearest known ligand 0.50

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.50
THRB P10828 1/20 0.50
LMNA P02545 2/20 0.45
ALDH1A1 P00352 2/20 0.45
MEN1 O00255 2/20 0.45
KMT2A Q03164 2/20 0.45
HSD17B10 Q99714 1/20 0.45
SMN1; SMN2 Q16637 1/20 0.40
CES2 O00748 3/20 0.39
CES1 P23141 3/20 0.39
EPHX1 P07099 2/20 0.39
DNM1 Q05193 5/20 0.38
SLC22A1 O15245 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6841034 1.00 TSHR (0.50) TSHRTHRBLMNAALDH1A1MEN1
SCHEMBL968834 1.00 TSHR (0.50) TSHRTHRBLMNAALDH1A1MEN1
SCHEMBL6841496 1.00 TSHR (0.50) TSHRTHRBLMNAALDH1A1MEN1
SCHEMBL6841494 1.00 TSHR (0.50) TSHRTHRBLMNAALDH1A1MEN1
SCHEMBL4293102 1.00 TSHR (0.50) TSHRTHRBLMNAALDH1A1MEN1
SCHEMBL968567 1.00 TSHR (0.50) TSHRTHRBLMNAALDH1A1MEN1
SCHEMBL399173 0.97
SCHEMBL970152 0.87
SCHEMBL851446 0.85 CES2 (0.38) TSHRTHRBLMNAALDH1A1MEN1
SCHEMBL4521500 0.85 TSHR (0.59) TSHRALDH1A1EPHX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6764807-B2 LITHOGRAPHY KODAK POLYCHROME GRAPHICS LLC 2004-07-20 US disclosed
US-20020086235-A1 Lithography EASTMAN KODAK COMPANY 2002-07-04 US disclosed
US-6399271-B1 HYDROXY CONTAINING COMPOUND WITH AFFINITY FOR INK, AND TITANIUM OR SILICON CONTAINING COMPOUND WITH DIFFERENT AFFINITY FOR INK KODAK POLYCHROME GRAPHICS LLC 2002-06-04 US disclosed
EP-0377175-A2 Pattern forming composition and process for forming pattern using the same HITACHI, LTD. (JP) 1990-07-11 EP disclosed