Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ESR1 | P03372 | 1/20 | 0.39 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.39 |
| ▸ | AMY1A | P0DUB6 | 1/20 | 0.39 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.39 |
| ▸ | CETP | P11597 | 1/20 | 0.36 |
| ▸ | TP53 | P04637 | 1/20 | 0.34 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.34 |
| ▸ | CA1 | P00915 | 1/20 | 0.34 |
| ▸ | CA2 | P00918 | 1/20 | 0.34 |
| ▸ | CA4 | P22748 | 1/20 | 0.34 |
| ▸ | CA6 | P23280 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3195069 | 0.89 | TRPA1 (0.39) | ESR1ESR2AMY1ATRPA1CETP | |
| SCHEMBL22500140 | 0.84 | ESR1 (0.36) | ESR1ESR2AMY1ATRPA1CETP | |
| SCHEMBL8087955 | 0.84 | CETP (0.36) | ESR1ESR2AMY1ACETP | |
| SCHEMBL29636480 | 0.79 | AMY1A (0.39) | ESR1ESR2AMY1ACETP | |
| SCHEMBL6847207 | 0.79 | AMY1A (0.39) | ESR1ESR2AMY1ACETP | |
| SCHEMBL30375280 | 0.79 | AMY1A (0.39) | ESR1ESR2AMY1ACETP | |
| SCHEMBL15189657 | 0.79 | AMY1A (0.39) | ESR1ESR2AMY1ACETP | |
| SCHEMBL771058 | 0.77 | SHBG (0.48) | ESR1ESR2 | |
| SCHEMBL29831656 | 0.77 | SHBG (0.48) | ESR1ESR2 | |
| SCHEMBL29368767 | 0.76 | HSPA5 (0.43) | AMY1A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 63 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250376552-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2025-12-11 | — | — | US | disclosed |
| US-20250264801-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-08-21 | — | — | US | disclosed |
| EP-4596607-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED PRODUCT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4596608-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4597225-A1 | FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| US-20250236697-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-07-24 | — | — | US | disclosed |
| US-20250230283-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-07-17 | — | — | US | disclosed |
| CN-120077104-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2025-05-30 | — | — | CN | disclosed |
| CN-119998728-A | Film manufacturing method, photosensitive resin composition, cured product manufacturing method, cured product, and laminate | 富士胶片株式会社 | 2025-05-13 | — | — | CN | disclosed |
| CN-119731225-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2025-03-28 | — | — | CN | disclosed |
| US-5529881-A | ALKALI-SOLUBLE RESIN AND 1,2-NAPHTHOQUINONEDIAZIDE SULFONIC ACID ESTER OF SPECIFIED POLYHYDROXY COMPOUND AS PHOTOSENSITIVE COMPOUND | FUJI PHOTO FILM CO., LTD. (JP) | 1996-06-25 | — | — | US | disclosed |
| US-5523396-A | ESTERIFICATION OF POLYHYDROXY COMPOUND WITH 1,2-NAPHTHOQUINONEDIAZIDE-5-SULFONYL CHLORIDE IN THE PRESENCE OF A BASIC CATALYST | FUJI PHOTO FILM CO., LTD. (JP) | 1996-06-04 | — | — | US | disclosed |
| EP-0710886-A1 | Positive photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1996-05-08 | — | — | EP | disclosed |
| EP-0706089-A2 | Process for synthesizing quinonediazide ester and positive working photoresist containing the same | FUJI PHOTO FILM CO., LTD. (JP) | 1996-04-10 | — | — | EP | disclosed |
| US-5494773-A | MIXTURE WITH A 1,2-QUINONEDIAZIDE COMPOUND | FUJI PHOTO FILM CO., LTD. (JP) | 1996-02-27 | — | — | US | disclosed |
| EP-0684521-A1 | Positive working photosensitive compositions | FUJI PHOTO FILM CO., LTD. (JP) | 1995-11-29 | — | — | EP | disclosed |
| EP-0677789-A1 | Positive photoresist composition | Fuji Photo Film Co., Ltd. (JP) | 1995-10-18 | — | — | EP | disclosed |
| EP-0672952-A1 | Positive photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1995-09-20 | — | — | EP | disclosed |
| EP-0658807-A1 | Positive-working photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1995-06-21 | — | — | EP | disclosed |
| EP-0644460-A1 | Positive working photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1995-03-22 | — | — | EP | disclosed |