SCHEMBL6854376

SCHEMBL6854376

O=Cc1ccc(Oc2ccc(S(=O)(=O)c3ccc(Oc4ccc(C=O)cc4)cc3)cc2)cc1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ STS P08842 1/20 0.52
▸ HTT P42858 7/20 0.52
▸ SMN1; SMN2 Q16637 6/20 0.52
▸ PARP10 Q53GL7 1/20 0.52
▸ PARP3 Q9Y6F1 1/20 0.52
▸ ALDH1A1 P00352 6/20 0.48
▸ LMNA P02545 5/20 0.48
▸ KDM4E B2RXH2 3/20 0.48
▸ NPC1 O15118 2/20 0.48
▸ RAB9A P51151 2/20 0.48
▸ MAPT P10636 2/20 0.48
▸ TP53 P04637 1/20 0.48
▸ TSHR P16473 1/20 0.48
▸ XBP1 P17861 1/20 0.48
▸ MAPK1 P28482 1/20 0.48
▸ MDM2 Q00987 1/20 0.48
▸ HSD17B10 Q99714 1/20 0.48
▸ PKM P14618 2/20 0.48
▸ CYP2A6 P11509 1/20 0.48
▸ L3MBTL1 Q9Y468 2/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17378301 0.91 HTT (0.67) STSHTTSMN1; SMN2PARP10PARP3
SCHEMBL6853680 0.87 ALDH1A1 (0.48) STSALDH1A1LMNAKDM4ETSHR
SCHEMBL17546704 0.85 MAPT (0.58) STSHTTSMN1; SMN2PARP10PARP3
SCHEMBL5050902 0.84 PARP10 (0.65) STSSMN1; SMN2PARP10PARP3ALDH1A1
SCHEMBL1663469 0.84 PARP10 (0.65) STSSMN1; SMN2PARP10PARP3ALDH1A1
SCHEMBL6541459 0.84 PKM (0.73) STSHTTALDH1A1NPC1RAB9A
SCHEMBL3923767 0.84 ALDH1A1 (0.50) STSHTTSMN1; SMN2PARP10PARP3
SCHEMBL6854204 0.82 HTT (0.58) HTTSMN1; SMN2ALDH1A1LMNANPC1
SCHEMBL24512752 0.80 PTPRZ1 (0.50) STSHTTSMN1; SMN2PARP10PARP3
SCHEMBL30350286 0.80 LMNA (0.49) HTTSMN1; SMN2ALDH1A1LMNAMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12024594-B2 Multifunctional materials for temporary bonding BREWER SCIENCE, INC. (US) 2024-07-02 — — US claimed
WO-2021222194-A1 MULTIFUNCTIONAL MATERIALS FOR TEMPORARY BONDING BREWER SCIENCE, INC. (US) 2021-11-04 — — WO claimed
US-20210332188-A1 MULTIFUNCTIONAL MATERIALS FOR TEMPORARY BONDING BREWER SCIENCE, INC. 2021-10-28 — — US claimed
US-12024594-B2 Multifunctional materials for temporary bonding BREWER SCIENCE, INC. (US) 2024-07-02 — — US disclosed
US-11542397-B2 Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device TOKYO OHKA KOGYO CO., LTD. (JP) 2023-01-03 — — US disclosed
WO-2021222194-A1 MULTIFUNCTIONAL MATERIALS FOR TEMPORARY BONDING BREWER SCIENCE, INC. (US) 2021-11-04 — — WO disclosed
US-20210332188-A1 MULTIFUNCTIONAL MATERIALS FOR TEMPORARY BONDING BREWER SCIENCE, INC. 2021-10-28 — — US disclosed
US-20210309866-A1 LIQUID COMPOSITION, QUANTUM DOT-CONTAINING FILM, OPTICAL FILM, LIGHT-EMITTING DISPLAY ELEMENT PANEL, AND LIGHT-EMITTING DISPLAY DEVICE TOKYO OHKA KOGYO CO., LTD. (JP) 2021-10-07 — — US disclosed
EP-3812805-A1 LIQUID COMPOSITION, QUANTUM DOT-CONTAINING FILM, OPTICAL FILM, LUMINESCENT DISPLAY ELEMENT PANEL, AND LUMINESCENT DISPLAY DEVICE TOKYO OHKA KOGYO CO., LTD. (JP) 2021-04-28 — — EP disclosed
CN-112334795-A Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device 东京应化工业株式会社 2021-02-05 — — CN disclosed
CN-107429059-B Energy-sensitive resin composition 东京应化工业株式会社 2020-10-23 — — CN disclosed
EP-2947112-B1 METHOD FOR PRODUCING POLYBENZOXAZOLE RESIN TOKYO OHKA KOGYO CO LTD (JP) 2017-09-13 — — EP disclosed
US-20170115563-A1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2017-04-27 — — US disclosed
CN-105579907-A Radiation-sensitive composition and pattern production method TOKYO OHKA KOGYO CO LTD 2016-05-11 — — CN disclosed
US-9273181-B2 Polyester-based polymer having superior transparency and high heat resistance and preparation of the same IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) (KR) 2016-03-01 — — US disclosed
US-20150376329-A1 NOVEL POLYESTER-BASED POLYMER HAVING SUPERIOR TRANSPARENCY AND HIGH HEAT RESISTANCE AND PREPARATION OF THE SAME INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY (KR) 2015-12-31 — — US disclosed
US-20150337084-A1 METHOD FOR PRODUCING POLYBENZOXAZOLE RESIN TOKYO OHKA KOGYO CO., LTD. (JP) 2015-11-26 — — US disclosed
EP-2947112-A1 METHOD FOR PRODUCING POLYBENZOXAZOLE RESIN TOKYO OHKA KOGYO CO., LTD. (JP) 2015-11-25 — — EP disclosed
US-6780561-B2 FOR FORMING PROTECTIVE FILM OR AN INSULATING FILM FOR A SEMICONDUCTOR ELEMENT OR A CIRCUIT BOARD SUCH AS A PRINTED BOARD KANSAI PAINT CO., LTD. (JP) 2004-08-24 — — US disclosed
US-20030143480-A1 For forming protective film or an insulating film for a semiconductor element or a circuit board such as a printed board KANSAI PAINT CO., LTD. (JP) 2003-07-31 — — US disclosed
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