SCHEMBL6856186

SCHEMBL6856186

Nc1ccc(-c2c(C(=O)O)ccc(N)c2O)cc1O

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ PPM1B O75688 1/20 0.53
▸ CYP3A4 P08684 4/20 0.52
▸ ALOX15 P16050 3/20 0.52
▸ HSD17B10 Q99714 2/20 0.52
▸ KDM4E B2RXH2 4/20 0.50
▸ KMT2A Q03164 4/20 0.50
▸ GFER P55789 1/20 0.50
▸ RXFP1 Q9HBX9 1/20 0.50
▸ HNF4A P41235 1/20 0.46
▸ ACMSD Q8TDX5 1/20 0.46
▸ ALDH1A1 P00352 4/20 0.44
▸ MAPT P10636 3/20 0.44
▸ GAA P10253 1/20 0.44
▸ ESR2 Q92731 1/20 0.44
▸ MMP2 P08253 1/20 0.44
▸ PTPN1 P18031 1/20 0.44
▸ TDP1 Q9NUW8 4/20 0.41
▸ MEN1 O00255 3/20 0.41
▸ THRB P10828 3/20 0.41
▸ RECQL P46063 3/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17267883 0.80 CYP3A4 (0.47) PPM1BCYP3A4ALOX15HSD17B10KDM4E
SCHEMBL17267884 0.79 ACMSD (0.46) PPM1BCYP3A4ALOX15HSD17B10KDM4E
SCHEMBL17267867 0.76 HSD17B10 (0.46) PPM1BCYP3A4ALOX15HSD17B10KDM4E
SCHEMBL17267866 0.75 PPM1B (0.48) PPM1BCYP3A4ALOX15HSD17B10KDM4E
SCHEMBL17267880 0.75 PPM1B (0.48) PPM1BCYP3A4ALOX15HSD17B10KDM4E
SCHEMBL23270907 0.73 CYP3A4 (0.52) PPM1BCYP3A4ALOX15HSD17B10KDM4E
SCHEMBL9008936 0.73 CYP3A4 (0.47) PPM1BCYP3A4ALOX15HSD17B10KDM4E
SCHEMBL16599716 0.72 CASP7 (0.56) PPM1BCYP3A4ALOX15HSD17B10KDM4E
SCHEMBL1981082 0.72 MMP2 (0.65) PPM1BCYP3A4ALOX15HSD17B10KDM4E
Hydrochloric Acid SCHEMBL12468240 0.72 HSD17B10 (0.65) PPM1BCYP3A4ALOX15HSD17B10KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6780561-B2 FOR FORMING PROTECTIVE FILM OR AN INSULATING FILM FOR A SEMICONDUCTOR ELEMENT OR A CIRCUIT BOARD SUCH AS A PRINTED BOARD KANSAI PAINT CO., LTD. (JP) 2004-08-24 — — US disclosed
US-20030143480-A1 For forming protective film or an insulating film for a semiconductor element or a circuit board such as a printed board KANSAI PAINT CO., LTD. (JP) 2003-07-31 — — US disclosed
US-5534614-A Method for the preparation of amide oligomers and polybenzazole polymers therefrom THE DOW CHEMICAL COMPANY (US) 1996-07-09 — — US disclosed
US-5322916-A Method for the preparation of amide oligomers and polybenzazole polymers therefrom THE DOW CHEMICAL COMPANY (US) 1994-06-21 — — US disclosed
US-5011753-A Polyamides Containing Hexafluoroisopropylidene Groups Which May Be Cured To Form Polybenzoxazoles HOECHST CELANESE CORPORATION (US) 1991-04-30 — — US disclosed
US-4939215-A CHEMICAL AND RADIATION RESISTANCE; AIRCRAFT, ELECTRONICS HOECHST CELANESE CORPORATION (US) 1990-07-03 — — US disclosed
US-4845183-A MOLDING MATERIALS; FOR DIELECTRICS OR COATING SOLUTIONS; TOUGHNESS, FLEXIBILITY, TRANSPARENT HOECHST CELANESE CORPORATION (US) 1989-07-04 — — US disclosed
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