SCHEMBL688738

SCHEMBL688738

O=C1OC(=O)OC(=O)c2ccccc2Oc2ccccc2C(=O)O1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 2/20 0.52
ALOX15 P16050 1/20 0.52
KDM4E B2RXH2 4/20 0.43
TYMS P04818 2/20 0.43
MAPK1 P28482 1/20 0.43
ATM Q13315 1/20 0.43
STK17B O94768 4/20 0.41
CYP1A2 P05177 1/20 0.41
CYP2D6 P10635 1/20 0.41
PKM P14618 1/20 0.40
TSHR P16473 1/20 0.40
HSP90AA1 P07900 1/20 0.38
MEN1 O00255 1/20 0.38
CDC25B P30305 1/20 0.38
KMT2A Q03164 1/20 0.38
MAOA P21397 1/20 0.37
MAOB P27338 1/20 0.37
HDAC3 O15379 1/20 0.37
HDAC4 P56524 1/20 0.37
HDAC1 Q13547 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30567320 0.87 TDP1 (0.68) TDP1ALOX15KDM4ETYMSMAPK1
SCHEMBL30055520 0.85 ALOX15 (0.57) TDP1ALOX15KDM4ETYMSMAPK1
SCHEMBL2113335 0.85 ALOX15 (0.57) TDP1ALOX15KDM4ETYMSMAPK1
SCHEMBL167093 0.85
SCHEMBL30320031 0.85 TDP1 (0.63) TDP1ALOX15KDM4ETYMSMAPK1
SCHEMBL19754922 0.85 TDP1 (0.63) TDP1ALOX15KDM4ETYMSMAPK1
SCHEMBL12691224 0.85 TDP1 (0.63) TDP1ALOX15KDM4ETYMSMAPK1
SCHEMBL4599247 0.82 ALOX15 (0.52) TDP1ALOX15KDM4ETYMSMAPK1
SCHEMBL5285168 0.76 ALOX15 (0.43) TDP1ALOX15TYMSSTK17BPKM
SCHEMBL19068774 0.76 TDP1 (0.52) TDP1ALOX15KDM4ETYMSMAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 63 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2555053-B1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2017-10-18 EP claimed
EP-2555053-A1 Positive-type photosensitive resin composition Toray Industries, Inc. (JP) 2013-02-06 EP claimed
EP-0629893-B1 Liquid crystal device CANON KK (JP) 1998-01-28 EP claimed
EP-0629893-A1 Liquid crystal device CANON KABUSHIKI KAISHA (JP) 1994-12-21 EP claimed
WO-2024082365-A1 POLYSILOXANE-POLYIMIDE-POLYUREA COPOLYMER AND PREPARATION METHOD THEREFOR, AND HEAT-INSULATING COATING AND PREPARATION METHOD THEREFOR 北京宇航系统工程研究所 2024-04-25 WO disclosed
US-11802181-B2 Di-amine compound, and heat-resistant resin and resin composition using the same TORAY INDUSTRIES, INC. (JP) 2023-10-31 US disclosed
CN-107709407-B Polyimide precursor composition, photosensitive resin composition, cured film, method for producing cured film, semiconductor device, and method for producing polyimide precursor composition 富士胶片株式会社 2020-11-17 CN disclosed
EP-1296540-B1 DISPLAY TORAY INDUSTRIES (JP) 2019-10-16 EP disclosed
US-20190256655-A1 DI-AMINE COMPOUND, AND HEAT-RESISTANT RESIN AND RESIN COMPOSITION USING THE SAME TORAY INDUSTRIES, INC. (JP) 2019-08-22 US disclosed
US-20180079864-A1 POLYIMIDE PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, A SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING POLYIMIDE PRECURSOR COMPOSITION FUJIFILM CORPORATION (JP) 2018-03-22 US disclosed
US-20180039174-A1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2018-02-08 US disclosed
EP-2520977-B1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2017-11-22 EP disclosed
EP-1132773-A1 POSITIVE-TYPE PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITION TORAY INDUSTRIES, INC. (JP) 2001-09-12 EP disclosed
EP-0629893-B1 Liquid crystal device CANON KK (JP) 1998-01-28 EP disclosed
EP-0376349-B1 Miscible blends of imide containing polymers with poly(aryl sulfones) AMOCO CORP (US) 1996-07-24 EP disclosed
US-5212259-A Printed circuits AMOCO CORPORATION (US) 1993-05-18 US disclosed
US-5134202-A Process for miscible blends of imide containing polymers with poly(aryl sulfones) AMOCO CORPORATION (US) 1992-07-28 US disclosed
US-5046822-A Polyimide film; ferroelectricity CANON KABUSHIKI KAISHA (JP) 1991-09-10 US disclosed
US-5037902-A Heat and chemical resistance; electronics AMOCO CORPORATION (US) 1991-08-06 US disclosed
EP-0376349-A2 Miscible blends of imide containing polymers with poly(aryl sulfones) AMOCO CORPORATION (US) 1990-07-04 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11802181-B2 Di-amine compound, and heat-resistant resin and resin composition using the same CAD, ARID2, SMC3 TDP1 4000/4885ALOX15 2365/4885KDM4E 310/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.