SCHEMBL68911

SCHEMBL68911

CC(Cl)c1ccccc1[SiH3]

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GABRA1 P14867 2/20 0.36
GABRB2 P47870 2/20 0.36
TSHR P16473 4/20 0.32
CYP1A2 P05177 2/20 0.32
CYP3A4 P08684 2/20 0.32
LMNA P02545 2/20 0.32
FAAH O00519 1/20 0.32
CA1 P00915 1/20 0.32
CA2 P00918 1/20 0.32
HPGD P15428 1/20 0.32
GABRB1 P18505 1/20 0.32
GABRG2 P18507 1/20 0.32
PTGS1 P23219 1/20 0.32
SLC6A2 P23975 1/20 0.32
HTR2C P28335 1/20 0.32
GABRB3 P28472 1/20 0.32
GABRA5 P31644 1/20 0.32
GABRA3 P34903 1/20 0.32
HTR2B P41595 1/20 0.32
GABRA2 P47869 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2865478 0.81 GABRA1 (0.43) GABRA1GABRB2TSHRCYP1A2CYP3A4
SCHEMBL2104519 0.79 TSHR (0.39) GABRA1GABRB2TSHRCYP3A4LMNA
SCHEMBL3378475 0.79 GABRA1 (0.50) GABRA1GABRB2TSHRCYP1A2CYP3A4
SCHEMBL10318395 0.76 TRPA1 (0.34) BLMHIF1ACYP2D6NFKB1
SCHEMBL12814851 0.76 TSHR (0.31) GABRA1GABRB2TSHRCYP3A4LMNA
SCHEMBL28598232 0.75 GABRA1 (0.36) GABRA1GABRB2TSHRCYP1A2CYP3A4
SCHEMBL10884302 0.75 GABRA1 (0.46) GABRA1GABRB2TSHRCYP1A2CYP3A4
SCHEMBL2273910 0.75 TSHR (0.38) GABRA1GABRB2TSHRGABRG2GABRB3
SCHEMBL2100798 0.75 NISCH (0.36)
SCHEMBL10717115 0.75 TSHR (0.38) TSHRLMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8871890-B2 Curable resin composition and cured article DAICEL CORPORATION (JP) 2014-10-28 US disclosed
EP-2636706-A1 CURABLE RESIN COMPOSITION AND CURED ARTICLE Daicel Corporation (JP) 2013-09-11 EP disclosed
US-20130131265-A1 CURABLE RESIN COMPOSITION AND CURED ARTICLE DAICEL CORPORATION (JP) 2013-05-23 US disclosed
US-8404584-B2 Method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2013-03-26 US disclosed
US-8129087-B2 Block copolymer and substrate processing method CANON KABUSHIKI KAISHA (JP) 2012-03-06 US disclosed
US-20110207319-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2011-08-25 US disclosed
US-7901866-B2 Pattern forming method CANON KABUSHIKI KAISHA (JP) 2011-03-08 US disclosed
US-20090311637-A1 BLOCK COPOLYMER AND SUBSTRATE PROCESSING METHOD CANON KABUSHIKI KAISHA (JP) 2009-12-17 US disclosed
US-20090311633-A1 PATTERN FORMING METHOD CANON KABUSHIKI KAISHA (JP) 2009-12-17 US disclosed
WO-2008047817-A1 PATTERN FORMING METHOD CANON KABUSHIKI KAISHA (JP) 2008-04-24 WO disclosed