SCHEMBL6900865

SCHEMBL6900865

COC(C)Cc1ccccc1CC(C)OC

nearest known ligand 0.45

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
GABRA1 P14867 1/20 0.38
GABRB2 P47870 1/20 0.38
KMT2A Q03164 1/20 0.35
TAAR1 Q96RJ0 3/20 0.34
SLC6A2 P23975 2/20 0.34
SIGMAR1 Q99720 2/20 0.34
MAOA P21397 1/20 0.34
SLC6A4 P31645 1/20 0.34
SLC6A3 Q01959 1/20 0.34
CYP2A6 P11509 1/20 0.34
ADORA2A P29274 1/20 0.34
ADORA1 P30542 1/20 0.34
IDO1 P14902 2/20 0.34
CHRM2 P08172 1/20 0.33
CHRM1 P11229 1/20 0.33
KCNH2 Q12809 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9729257 0.87 TAAR1 (0.42) KMT2ATAAR1SLC6A2SLC6A4SLC6A3
SCHEMBL1840025 0.85 HSPA5 (0.46) GABRA1GABRB2TAAR1SLC6A2SLC6A4
SCHEMBL9466819 0.84 GABRA1 (0.39) GABRA1GABRB2TAAR1SLC6A2SIGMAR1
SCHEMBL13189946 0.80 SIGMAR1 (0.56) KMT2ATAAR1SLC6A2SIGMAR1MAOA
SCHEMBL13006663 0.80 SIGMAR1 (0.56) KMT2ATAAR1SLC6A2SIGMAR1MAOA
SCHEMBL2555409 0.80 SIGMAR1 (0.56) KMT2ATAAR1SLC6A2SIGMAR1MAOA
SCHEMBL8014296 0.79 FOLH1 (0.48)
SCHEMBL6358266 0.78 GABRA1 (0.41) GABRA1GABRB2TAAR1SLC6A2SIGMAR1
SCHEMBL8762286 0.78 CYP1A1 (0.34) GABRA1GABRB2KMT2ATAAR1SLC6A2
SCHEMBL15899562 0.78 HPGD (0.44) KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-9087438-A None JP disclosed
EP-3266829-B1 RESIN COMPOSITION AND RESIN MOLDED ARTICLE ZEON CORP (JP) 2025-03-12 EP disclosed
US-20240166854-A1 THERMOPLASTIC ELASTOMER COMPOSITION MITSUI CHEMICALS, INC. (JP) 2024-05-23 US disclosed
EP-4303238-A1 THERMOPLASTIC ELASTOMER COMPOSITION Mitsui Chemicals, Inc. (JP) 2024-01-10 EP disclosed
CN-116888211-A Thermoplastic elastomer composition 三井化学株式会社 2023-10-13 CN disclosed
US-11767404-B2 Resin composition for masterbatch MITSUI CHEMICALS, INC. (JP) 2023-09-26 US disclosed
CN-109790355-B Resin composition, pellet, package, vibration-proof material, sound-insulating material, and interlayer film for laminated glass 株式会社可乐丽 2021-08-24 CN disclosed
US-10913843-B2 Resin composition, pellet, veil, damping material, sound insulation material, and intermediate film for laminated glass KURARAY CO., LTD. (JP) 2021-02-09 US disclosed
EP-3763770-A1 RESIN COMPOSITION FOR MASTERBATCHES Mitsui Chemicals, Inc. (JP) 2021-01-13 EP disclosed
US-20210002435-A1 RESIN COMPOSITION FOR MASTERBATCH MITSUI CHEMICALS, INC. (JP) 2021-01-07 US disclosed
EP-0853096-A1 Resin composition and usage thereof KURARAY CO., LTD. (JP) 1998-07-15 EP disclosed
US-5753755-A COMPOSITION CONTAINING AMORPHOUS POLYOLEFIN, BLOCK POLYMER COMPRISING AROMATIC VINYL COMPOUND AND ISOBUTYLENE KURARAY CO., LTD. (JP) 1998-05-19 US disclosed
EP-0832929-A1 Polymer blend KURARAY CO., LTD. (JP) 1998-04-01 EP disclosed
JP-H0987438-A MOLDING MATERIAL FOR CLOSURE OR SEALING ELEMENT KURARAY CO LTD 1997-03-31 JP disclosed
EP-0761752-A1 Resin composition and molded article of the same KURARAY CO., LTD. (JP) 1997-03-12 EP disclosed
EP-0754743-A1 Closure and sealing element KURARAY CO., LTD. (JP) 1997-01-22 EP disclosed
EP-0572667-A1 THERMOPLASTIC RESIN COMPOSITION NIPPON ZEON CO., LTD. (JP) 1993-12-08 EP disclosed
US-5248746-A Cationic polymerization, molecular weight control NIPPON ZEON CO., LTD. (JP) 1993-09-28 US disclosed
EP-0479311-A2 Tackifier composition NIPPON ZEON CO., LTD. (JP) 1992-04-08 EP disclosed
EP-0451679-A2 Method of producing polymers NIPPON ZEON CO., LTD. (JP) 1991-10-16 EP disclosed