Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | IDO1 | P14902 | 2/20 | 0.52 |
| ▸ | SLC6A4 | P31645 | 7/20 | 0.44 |
| ▸ | SLC6A2 | P23975 | 6/20 | 0.44 |
| ▸ | SLC6A3 | Q01959 | 5/20 | 0.44 |
| ▸ | RIPK1 | Q13546 | 1/20 | 0.42 |
| ▸ | TAAR1 | Q96RJ0 | 1/20 | 0.42 |
| ▸ | ABCB1 | P08183 | 1/20 | 0.42 |
| ▸ | CA12 | O43570 | 1/20 | 0.42 |
| ▸ | CA1 | P00915 | 1/20 | 0.42 |
| ▸ | CA2 | P00918 | 1/20 | 0.42 |
| ▸ | CA4 | P22748 | 1/20 | 0.42 |
| ▸ | CA7 | P43166 | 1/20 | 0.42 |
| ▸ | CA9 | Q16790 | 1/20 | 0.42 |
| ▸ | CA14 | Q9ULX7 | 1/20 | 0.42 |
| ▸ | CHRM2 | P08172 | 1/20 | 0.41 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.41 |
| ▸ | KCNH2 | Q12809 | 1/20 | 0.40 |
| ▸ | HRH1 | P35367 | 1/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.39 |
| ▸ | GAA | P10253 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2088979 | 0.87 | SLC6A4 (0.59) | IDO1SLC6A4SLC6A2SLC6A3RIPK1 | |
| SCHEMBL31048 | 0.86 | IDO1 (0.69) | IDO1TAAR1ABCB1CA12CA1 | |
| SCHEMBL31290863 | 0.86 | IDO1 (0.69) | IDO1TAAR1ABCB1CA12CA1 | |
| SCHEMBL28990663 | 0.82 | IDO1 (0.48) | IDO1TAAR1ABCB1CA12CA1 | |
| SCHEMBL648491 | 0.82 | IDO1 (0.44) | IDO1TAAR1CA12CA1CA2 | |
| SCHEMBL4733632 | 0.80 | IDO1 (0.47) | IDO1TAAR1ABCB1CA12CA1 | |
| SCHEMBL7959739 | 0.80 | L3MBTL1 (0.58) | IDO1ABCB1ALDH1A1GAAMAPT | |
| SCHEMBL18355261 | 0.79 | IDO1 (0.46) | IDO1RIPK1TAAR1ABCB1CA12 | |
| SCHEMBL22311627 | 0.79 | IDO1 (0.46) | IDO1SLC6A4SLC6A2ABCB1KCNH2 | |
| SCHEMBL27595685 | 0.79 | IDO1 (0.41) | IDO1SLC6A4SLC6A2SLC6A3TAAR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 77 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-4539343-A | PHENOLIC BINDER, DISCOLORATION INHIBITION, FLEXURAL STRENGTH | SUMITOMO DUREZ COMPANY, LTD. (JP) | 1985-09-03 | — | — | US | claimed |
| US-20240210827-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-06-27 | — | — | US | disclosed |
| CN-115667404-B | Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2024-05-03 | — | — | CN | disclosed |
| CN-117940516-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2024-04-26 | — | — | CN | disclosed |
| CN-117881745-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and compound | 富士胶片株式会社 | 2024-04-12 | — | — | CN | disclosed |
| CN-117836916-A | Method for producing cured product, method for producing laminate, method for producing semiconductor device, treatment liquid, and resin composition | 富士胶片株式会社 | 2024-04-05 | — | — | CN | disclosed |
| CN-117836715-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and alkali generator | 富士胶片株式会社 | 2024-04-05 | — | — | CN | disclosed |
| CN-117751326-A | Method for producing cured product, method for producing laminate, method for producing semiconductor device, resin composition, cured product, laminate, and semiconductor device | 富士胶片株式会社 | 2024-03-22 | — | — | CN | disclosed |
| CN-117730280-A | Method for producing cured product, method for producing laminate, method for producing semiconductor device, resin composition, cured product, laminate, and semiconductor device | 富士胶片株式会社 | 2024-03-19 | — | — | CN | disclosed |
| CN-117715982-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2024-03-15 | — | — | CN | disclosed |
| US-20200409263-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2020-12-31 | — | — | US | disclosed |
| CN-107615166-B | Photosensitive resin composition, method for producing polyimide, and semiconductor device | 旭化成株式会社 | 2020-12-25 | — | — | CN | disclosed |
| WO-2020246234-A1 | NEGATIVE CURABLE COMPOSITION, CURED FILM, LAYERED PRODUCT, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2020-12-10 | — | — | WO | disclosed |
| US-10831101-B2 | Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2020-11-10 | — | — | US | disclosed |
| US-20190113845-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2019-04-18 | — | — | US | disclosed |
| CN-1464875-A | Organometallic complexes, catalysts containing the same, and process for preparation of carboxylic esters | SHOWA DENKO KK (JP) | 2003-12-31 | — | — | CN | disclosed |
| US-6620901-B2 | Reacting formaldehyde and excess phenol to endpoint; crosslinking with hexamethylenetetramine; heat and oxidation resistance; antishock agents | BORDEN CHEMICAL, INC. | 2003-09-16 | — | — | US | disclosed |
| US-20030135012-A1 | High carbon yield phenolic resole | HEXION VAD LLC | 2003-07-17 | — | — | US | disclosed |
| WO-2003051948-A1 | HIGH CARBON YIELD PHENOLIC RESOLE | BORDEN CHEMICAL, INC. (US) | 2003-06-26 | — | — | WO | disclosed |
| US-4539343-A | PHENOLIC BINDER, DISCOLORATION INHIBITION, FLEXURAL STRENGTH | SUMITOMO DUREZ COMPANY, LTD. (JP) | 1985-09-03 | — | — | US | disclosed |