SCHEMBL6937716

SCHEMBL6937716

COc1cccc(C2=NC(c3ccc(F)cc3F)(C3(c4ccc(F)cc4F)N=C(c4cccc(OC)c4)C(c4cccc(OC)c4)=N3)N=C2c2cccc(OC)c2)c1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
BACE1 P56817 3/20 0.45
NPY5R Q15761 1/20 0.43
CLK4 Q9HAZ1 2/20 0.41
DYRK1A Q13627 1/20 0.41
ALDH1A3 P47895 1/20 0.40
PRKCA P17252 1/20 0.40
GSK3B P49841 1/20 0.40
NPC1 O15118 1/20 0.40
RAB9A P51151 1/20 0.40
SMN1; SMN2 Q16637 1/20 0.40
SQOR Q9Y6N5 1/20 0.39
NCOA1 Q15788 1/20 0.39
NCOA3 Q9Y6Q9 1/20 0.39
NFE2L2 Q16236 2/20 0.39
DGAT2 Q96PD7 1/20 0.39
KDM1A O60341 2/20 0.39
KDM1B Q8NB78 2/20 0.39
CYP1A2 P05177 1/20 0.39
CYP3A4 P08684 1/20 0.39
CYP2D6 P10635 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29450716 1.00 BACE1 (0.45) BACE1NPY5RCLK4DYRK1AALDH1A3
SCHEMBL29450715 0.89 BACE1 (0.45) BACE1NPY5RCLK4DYRK1AALDH1A3
SCHEMBL6938978 0.89 BACE1 (0.45) BACE1NPY5RCLK4DYRK1AALDH1A3
SCHEMBL6941966 0.86 DYRK1A (0.43) BACE1NPY5RCLK4DYRK1AKDM1A
SCHEMBL29510957 0.86 DYRK1A (0.43) BACE1NPY5RCLK4DYRK1AKDM1A
SCHEMBL29417503 0.86 DYRK1A (0.43) BACE1NPY5RCLK4DYRK1ANPC1
SCHEMBL6941655 0.86 DYRK1A (0.43) BACE1NPY5RCLK4DYRK1ANPC1
SCHEMBL6935526 0.86 NR3C1 (0.45) BACE1RAB9ASMN1; SMN2CYP3A4MAPK1
SCHEMBL29510931 0.85 DYRK1A (0.40) BACE1NPY5RCLK4DYRK1AALDH1A3
SCHEMBL6941647 0.85 DYRK1A (0.40) BACE1NPY5RCLK4DYRK1AALDH1A3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240111211-A1 PHOTOSENSITIVE RESIN FILM, RESIST PATTERN FORMING METHOD, AND WIRING PATTERN FORMING METHOD RESONAC CORPORATION (JP) 2024-04-04 US disclosed
US-6524770-B1 For polyimide precursor curable under patternwise low radiation; heat and chemical resistance; polyamide having unsaturated ester pendant groups cures HITACHI CHEMICAL CO., LTD. (JP) 2003-02-25 US disclosed